Product Information

W25Q256JWPIM

W25Q256JWPIM electronic component of Winbond

Datasheet
NOR Flash spiFlash 1.8V 256M-bit 4Kb Uniform Sector

Manufacturer: Winbond
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 3.3222 ea
Line Total: USD 3.32

433 - Global Stock
Ships to you between
Fri. 31 May to Tue. 04 Jun
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
6896 - WHS 1


Ships to you between Mon. 27 May to Fri. 31 May

MOQ : 1
Multiples : 1

Stock Image

W25Q256JWPIM
Winbond

1 : USD 4.0872
10 : USD 3.2409
25 : USD 3.2084
40 : USD 3.1759
80 : USD 3.0862
230 : USD 3.0524
570 : USD 2.8587
1140 : USD 2.691

     
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Mounting Style
Package / Case
Series
Memory Size
Maximum Clock Frequency
Interface Type
Organisation
Timing Type
Data Bus Width
Supply Voltage - Min
Supply Voltage - Max
Supply Current - Max
Minimum Operating Temperature
Maximum Operating Temperature
Brand
Moisture Sensitive
Product Type
Factory Pack Quantity :
Subcategory
Tradename
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W25Q256JW DTR 1.8V 256M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI, QPI & DTR Publication Release Date: September 04, 2018 - Revision E W25Q256JW DTR Table of Contents 1. GENERAL DESCRIPTIONS ............................................................................................................. 5 2. FEATURES ....................................................................................................................................... 5 3. PACKAGE TYPES AND PIN CONFIGURATIONS ........................................................................... 6 3.1 Pad Configuration 6x5-mm/ 8x6-mm.................................................................................... 6 3.2 Pad Description WSON 6x5-mm / 8x6-mm ......................................................................... 6 3.3 Pin Configuration SOIC 300-mil ........................................................................................... 7 3.4 Pin Description SOIC 300-mil ............................................................................................... 7 3.5 Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array) ................................................. 8 3.6 Ball Description TFBGA 8x6-mm ......................................................................................... 8 4. PIN DESCRIPTIONS ........................................................................................................................ 9 4.1 Chip Select (/CS) .................................................................................................................. 9 4.2 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) ..................................... 9 4.3 Write Protect (/WP) .............................................................................................................. 9 4.4 HOLD (/HOLD) ..................................................................................................................... 9 4.5 Serial Clock (CLK) ................................................................................................................ 9 4.6 Reset (/RESET) .................................................................................................................... 9 5. BLOCK DIAGRAM .......................................................................................................................... 10 6. FUNCTIONAL DESCRIPTIONS ..................................................................................................... 11 6.1 SPI / QPI Operations .......................................................................................................... 11 6.1.1 Standard SPI Instructions ..................................................................................................... 11 6.1.2 Dual SPI Instructions ............................................................................................................ 11 6.1.3 Quad SPI Instructions ........................................................................................................... 12 6.1.4 QPI Instructions .................................................................................................................... 12 6.1.5 SPI / QPI DTR Read Instructions ......................................................................................... 12 6.1.6 3-Byte / 4-Byte Address Modes ............................................................................................ 12 6.1.7 Hold Function ....................................................................................................................... 13 6.1.8 Software Reset & Hardware /RESET pin .............................................................................. 13 6.2 Write Protection .................................................................................................................. 14 7. STATUS AND CONFIGURATION REGISTERS ............................................................................ 15 7.1 Status Registers ................................................................................................................. 15 7.1.1 Program/Erase/Write In Progress (BUSY) Status Only .................................................. 15 7.1.2 Write Enable Latch (WEL) Status Only .......................................................................... 15 7.1.3 Block Protect Bits (BP3, BP2, BP1, BP0) Volatile/Non-Volatile Writable ....................... 16 7.1.4 Top/Bottom Block Protect (TB) Volatile/Non-Volatile Writable ....................................... 16 7.1.5 Complement Protect (CMP) Volatile/Non-Volatile Writable ............................................ 16 7.1.6 Status Register Protect (SRP, SRL) Volatile/Non-Volatile Writable ............................... 16 7.1.7 Erase/Program Suspend Status (SUS) Status Only....................................................... 17 - 1 -

Tariff Desc

8542.32.00 32 No ..CMOS and MOS Read Only Memory and Programmable Read Only Memory whether erasable or non-erasable (for example, flash memory, EPROM, E2PROM, EAPROM, NOVRAM, ROM and PROM)
Winbond Elec
WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA

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