AS4C16M16MD1-6BCN Alliance Memory

AS4C16M16MD1-6BCN electronic component of Alliance Memory
AS4C16M16MD1-6BCN Alliance Memory
AS4C16M16MD1-6BCN DRAM
AS4C16M16MD1-6BCN  Semiconductors
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X-On Electronics has gained recognition as a prominent supplier of AS4C16M16MD1-6BCN DRAM across the USA, India, Europe, Australia, and various other global locations. AS4C16M16MD1-6BCN DRAM are a product manufactured by Alliance Memory. We provide cost-effective solutions for DRAM, ensuring timely deliveries around the world.

Part No. AS4C16M16MD1-6BCN
Manufacturer: Alliance Memory
Category: DRAM
Description: DRAM 256M, 1.8V, 166Mhz 16M x 16 Mobile DDR
Datasheet: AS4C16M16MD1-6BCN Datasheet (PDF)
Price (USD)
1: USD 3.125 ea
Line Total: USD 3.12 
Availability : 1002
  
Ship by Wed. 06 Aug to Fri. 08 Aug
QtyUnit Price
1$ 3.125

Availability 1002
Ship by Wed. 06 Aug to Fri. 08 Aug
MOQ : 1
Multiples : 1
QtyUnit Price
1$ 3.125

   
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We are delighted to provide the AS4C16M16MD1-6BCN from our DRAM category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the AS4C16M16MD1-6BCN and other electronic components in the DRAM category and beyond.

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AS4C16M16MD1 256Mb MOBILE DDR SDRAM TABLE OF CONTENTS 1. GENERAL DESCRIPTION ................................................................................................... 4 2. FEATURES ........................................................................................................................... 4 3. PIN DESCRIPTION............................................................................................................... 5 3.1 Signal Descriptions.......................................................................................................................... 6 4. BLOCK DIAGRAM ............................................................................................................... 8 4.1 Block Diagram .................................................................................................................................8 4.2 Simplified State Diagram ................................................................................................................. 9 5. FUNCTION DESCRIPTION ................................................................................................. 10 5.1 Initialization ....................................................................................................................................11 5.1.1 Initialization Flow Diagram ................................................................................................................. 12 5.2 Register Definition .........................................................................................................................13 5.2.1 Mode Register ............................................................................................................................ 13 5.3 Burst Definition .............................................................................................................................. 13 5.2.1.2 Burst Type ............................................................................................................................... 14 5.2.2 Extended Mode Register ............................................................................................................ 14 5.2.2.1 Partial Array Self Refresh ....................................................................................................... 15 5.2.2.2 Temperature Compensated Self Refresh ............................................................................... 15 5.2.2.3 Output Drive Strength ............................................................................................................. 15 6. COMMANDS .................................................................................................................... 16 7. OPERATION ........................................................................................................................ 21 7.1. Deselect ........................................................................................................................................ 21 7.2. No Operation ................................................................................................................................ 21 7.4. Active ............................................................................................................................................ 22 7.5. Read ............................................................................................................................................. 23 7.5.1 Read to Read ...................................................................................................................................... 25 6.5.11 Burst Terminate ................................................................................................................................. 30 7.6 Write .............................................................................................................................................. 30 7.6.1 Write to Write ..................................................................................................................................... 32 7.7 Precharge ...................................................................................................................................... 36 7.8 Auto Precharge ............................................................................................................................. 37 7.9 Refresh Requirements .................................................................................................................. 37 7.10 Auto Refresh ............................................................................................................................... 37 7.11 Self Referesh ............................................................................................................................... 37 7.12 Power Down ................................................................................................................................ 39 7.13 Deep Power Down ...................................................................................................................... 41 7.14 Clock Stop ................................................................................................................................... 42 8. ELECTRICAL CHARACTERISTIC ......................................................................................43 Confidential - 1/56 - Ver.1.1 Oct.2015AS4C16M16MD1 256Mb MOBILE DDR SDRAM 8.1 Absolute Maximum Ratings .......................................................................................................... 43 8.2 Input/Output Capacitance ............................................................................................................. 43 8.3 Electrical Characteristics and AC/DC Operating Conditions ........................................................ 44 8.3.1 Electrical Characteristics and AC/DC Operating Conditions ............................................................... 44 8.4 IDD Specification Parameters and Test Conditions ..................................................................... 45 8.4.1 IDD Specification Parameters and Test Conditions ............................................................................ 45 8.5 AC Timings .................................................................................................................................... 47 8.5.2 Output Slew Rate Characteristics ....................................................................................................... 51 7.5.3 AC Overshoot/Undershoot Specification ............................................................................................. 51 8.5.4 AC Overshoot and Undershoot Definition ........................................................................................... 52 9. PACKAGE DIMENSION ..................................................................................................... 53 10. ORDERING INFORMATION ............................................................................................. 54 11. REVISION HISTORY ........................................................................................................ 55 Confidential - 2/56 - Ver.1.1 Oct.2015

Tariff Desc

8542.32.00 -- Memories
               Monolithic integrated circuits:
ALLIANCE MEMORY, INC.
ALLIANCE SEMI
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