AS4C256M8D3L-12BIN Alliance Memory

AS4C256M8D3L-12BIN electronic component of Alliance Memory
AS4C256M8D3L-12BIN Alliance Memory
AS4C256M8D3L-12BIN DRAM
AS4C256M8D3L-12BIN  Semiconductors
Images are for reference only, See Product Specifications

X-On Electronics has gained recognition as a prominent supplier of AS4C256M8D3L-12BIN DRAM across the USA, India, Europe, Australia, and various other global locations. AS4C256M8D3L-12BIN DRAM are a product manufactured by Alliance Memory. We provide cost-effective solutions for DRAM, ensuring timely deliveries around the world.

Part No. AS4C256M8D3L-12BIN
Manufacturer: Alliance Memory
Category: DRAM
Description: DRAM 2G 1.35V 1600Mhz 256M x 8 DDR3
Datasheet: AS4C256M8D3L-12BIN Datasheet (PDF)
Price (USD)
N/A

Obsolete

Availability 0
MOQ : 1
Multiples : 1
QtyUnit Price
1$ 6.9664
10$ 6.5205
25$ 6.3868
100$ 5.7737
242$ 5.6846
484$ 5.4059
968$ 5.2164
2662$ 5.2164
5082$ 5.1495
N/A

Obsolete
   
Manufacturer
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RoHS - XON
Icon ROHS
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We are delighted to provide the AS4C256M8D3L-12BIN from our DRAM category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the AS4C256M8D3L-12BIN and other electronic components in the DRAM category and beyond.

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2Gb DDR3L AS4C256M8D3L Revision History AS4C256M8D3L - 78-ball FBGA PACKAGE Revision Details Date Rev 1.0 Preliminary datasheet April 2014 Rev 2.0 Updated Table 12. Recommended DC Operating August 2014 Conditions page 21 Added CL=5 & CL=6 to Table 18 page 26 Confidential 1 Rev. 2.0 Aug. /2014 2Gb DDR3L - AS4C256M8D3L 256M x 8 bit DDR3L Synchronous DRAM (SDRAM) Confidential Advanced (Rev. 2.0, Aug. /2014) Overview Features JEDEC Standard Compliant The 2Gb Double-Data-Rate-3 (DDR3L) DRAMs is double data rate architecture to achieve high-speed Power supplies: V & V = +1.35V DD DDQ operation. It is internally configured as an eight bank Backward compatible to V & V = 1.5V 0.075V DD DDQ DRAM. Operating temperature: The 2Gb chip is organized as 32Mbit x 8 I/Os x 8 bank - Commercial (Extended) (0 ~ 95C) devices. These synchronous devices achieve high - Industrial (-40 ~ 95C) speed double-data-rate transfer rates of up to 1600 Supports JEDEC clock jitter specification Mb/sec/pin for general applications. Fully synchronous operation The chip is designed to comply with all key DDR3L Fast clock rate: 800MHz DRAM key features and all of the control and address inputs are synchronized with a pair of externally Differential Clock, CK & CK supplied differential clocks. Inputs are latched at the Bidirectional differential data strobe cross point of differential clocks (CK rising and CK - DQS & DQS falling). All I/Os are synchronized with differential DQS 8 internal banks for concurrent operation pair in a source synchronous fashion. 8n-bit prefetch architecture These devices operate with a single 1.35V -0.067V/ Internal pipeline architecture +0.1V power supply and are available in BGA packages. Precharge & active power down Programmable Mode & Extended Mode registers Additive Latency (AL): 0, CL-1, CL-2 Programmable Burst lengths: 4, 8 Burst type: Sequential / Interleave Output Driver Impedance Control 8192 refresh cycles / 64ms - Average refresh period 7.8s -40 TC +85 3.9s +85 TC +95 Write Leveling OCD Calibration Dynamic ODT (Rtt Nom & Rtt WR) RoHS compliant Auto Refresh and Self Refresh 78-ball 8 x 10.5 x 1.2mm FBGA package - Pb and Halogen Free Table 1. Speed Grade Information Speed Grade Clock Frequency CAS Latency t (ns) t (ns) RCD RP DDR3L-1600 800 MHz 11 13.75 13.75 Table 2. Ordering Information Product part No Org Temperature Package AS4C256M8D3L-12BCN 256M x 8 Commercial (Extended) 78-ball FBGA 0C to 95C AS4C256M8D3L-12BIN 256M x 8 Industrial 78-ball FBGA -40C to 95C (Extended) Confidential 2 Rev. 2.0 Aug. /2014

Tariff Desc

8542.32.00 -- Memories
               Monolithic integrated circuits:
ALLIANCE MEMORY, INC.
ALLIANCE SEMI
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