Product Information

MT48LC4M32B2TG-6A:L

MT48LC4M32B2TG-6A:L electronic component of Alliance Memory

Datasheet
DRAM SDRAM 128M 4M X 32 TSOP C TEMP , LEADED

Manufacturer: Alliance Memory
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
N/A

Obsolete
Availability Price Quantity
0 - WHS 1

MOQ : 1
Multiples : 1

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MT48LC4M32B2TG-6A:L
Alliance Memory

1 : USD 6.3278
10 : USD 2.4381
25 : USD 2.3831
50 : USD 2.3738
100 : USD 2.2308
250 : USD 2.2165
500 : USD 2.1879
1000 : USD 2.145
2000 : USD 2.0449
N/A

Obsolete
     
Manufacturer
Product Category
RoHS - XON
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Supply Voltage - Max
Supply Voltage - Min
Minimum Operating Temperature
Maximum Operating Temperature
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Cnhts
Hts Code
Mxhts
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128Mb: x32 SDRAM Features SDR SDRAM MT48LC4M32B2 1 Meg x 32 x 4 Banks Options Marking Features Configuration PC100-compliant 4 Meg x 32 (1 Meg x 32 x 4 banks) 4M32B2 Fully synchronous all signals registered on positive 1 Package OCPL edge of system clock 86-pin TSOP II (400 mil) TG Internal pipelined operation column address can 86-pin TSOP II (400 mil) Pb-free P be changed every clock cycle 90-ball VFBGA (8mm x 13mm) F5 Internal banks for hiding row access/precharge 90-ball VFBGA (8mm x 13mm) Pb- B5 Programmable burst lengths: 1, 2, 4, 8, or full page free Auto precharge, includes concurrent auto precharge Timing (cycle time) and auto refresh modes 2 6ns (167 MHz) -6A Self refresh mode (not available on AT devices) 3 6ns (167 MHz) -6 Auto refresh 3 7ns (143 MHz) -7 64ms, 4096-cycle refresh (commercial and Revision :G/:L industrial) Operating temperature range 16ms, 4096-cycle refresh (automotive) Commercial (0C to +70C) None LVTTL-compatible inputs and outputs Industrial (40C to +85C) IT Single 3.3V 0.3V power supply 4 Automotive (40C to +105C) AT Supports CAS latency (CL) of 1, 2, and 3 1. Off-center parting line. Notes: 2. Available only on Revision L. 3. Available only on Revision G. 4. Contact Micron for availability. Table 1: Key Timing Parameters CL = CAS (READ) latency Clock t t t t Speed Grade Frequency (MHz) Target RCD- RP-CL RCD (ns) RP (ns) CL (ns) -6A 167 3-3-3 18 18 18 -6 167 3-3-3 18 18 18 -7 143 3-3-3 20 20 21 PDF: 09005aef80872800 Micron Technology, Inc. reserves the right to change products or specifications without notice. 1 128mb x32 sdram.pdf - Rev. V 03/16 EN 2001 Micron Technology, Inc. All rights reserved. Products and specifications discussed herein are subject to change by Micron without notice.128Mb: x32 SDRAM Features Table 2: Address Table Parameter 4 Meg x 32 Configuration 1 Meg x 32 x 4 banks Refresh count 4K Row addressing 4K A 11:0 Bank addressing 4 BA 1:0 Column addressing 256 A 7:0 Table 3: 128Mb (x32) SDR Part Numbering Part Numbers Architecture MT48LC4M32B2TG 4 Meg x 32 MT48LC4M32B2P 4 Meg x 32 1 MT48LC4M32B2F5 4 Meg x 32 1 MT48LC4M32B2B5 4 Meg x 32 Note: 1. FBGA Device Decoder: www.micron.com/decoder. PDF: 09005aef80872800 Micron Technology, Inc. reserves the right to change products or specifications without notice. 2 128mb x32 sdram.pdf - Rev. V 03/16 EN 2001 Micron Technology, Inc. All rights reserved.

Tariff Desc

8542.32.00 -- Memories
               Monolithic integrated circuits:
ACM
ALLIANCE MEMORY, INC.
ALLIANCE SEMI

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