Product Information

MAX19999ETX+

MAX19999ETX+ electronic component of Analog Devices

Datasheet
Up-Down Converters Dual, SiGe High-Linearity, 3000MHz to 4000MHz Downconversion Mixer withLO Buffer

Manufacturer: Analog Devices
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



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Obsolete
Availability Price Quantity
0 - WHS 1

MOQ : 1
Multiples : 1

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MAX19999ETX+
Analog Devices

1 : USD 25.8444
10 : USD 23.8464
50 : USD 22.7664
100 : USD 20.3472
250 : USD 19.4184
500 : USD 18.3168
1000 : USD 17.6796
N/A

Obsolete
     
Manufacturer
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RoHS - XON
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Operating Supply Voltage
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Maximum Input Frequency
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Minimum Operating Temperature
Pd - Power Dissipation
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MAX19999 19-4293 Rev 0 10/08 Dual, SiGe High-Linearity, 3000MHz to 4000MHz Downconversion Mixer with LO Buffer General Description Features The MAX19999 dual-channel downconverter provides 3000MHz to 4000MHz RF Frequency Range 8.3dB of conversion gain, +24dBm input IP3, +11.4dBm 2650MHz to 3700MHz LO Frequency Range 1dB input compression point, and a noise figure of 50MHz to 500MHz IF Frequency Range 10.5dB for 3000MHz to 4000MHz WiMAX and LTE 8.3dB Conversion Gain diversity receiver applications. With an optimized LO fre- quency range of 2650MHz to 3700MHz, this mixer is +24dBm Input IP3 ideal for low-side LO injection architectures. 10.5dB Noise Figure In addition to offering excellent linearity and noise per- +11.4dBm Input 1dB Compression Point formance, the MAX19999 also yields a high level of 74dBc Typical 2 x 2 Spurious Rejection at component integration. This device includes two dou- P = -10dBm RF ble-balanced passive mixer cores, two LO buffers, and Dual Channels Ideal for Diversity Receiver a pair of differential IF output amplifiers. Integrated on- Applications chip baluns allow for single-ended RF and LO inputs. Integrated LO Buffer The MAX19999 requires a nominal LO drive of 0dBm Integrated LO and RF Baluns for Single-Ended and a typical supply current of 388mA at V = +5.0V CC or 279mA at V = +3.3V. Inputs CC Low -3dBm to +3dBm LO Drive The MAX19999 is pin compatible with the MAX19997A 1800MHz to 2900MHz mixer and pin similar with the Pin Compatible with the MAX19997A 1800MHz to MAX19985/MAX19985A and MAX19995/MAX19995A 2900MHz Mixer series of 700MHz to 2200MHz mixers, making this Pin Similar to the MAX9995/MAX9995A and entire family of downconverters ideal for applications MAX19995/MAX19995A 1700MHz to 2200MHz where a common PCB layout is used across multiple Mixers and the MAX9985/MAX9985A and frequency bands. MAX19985/MAX19985A 700MHz to 1000MHz The MAX19999 is available in a compact 6mm x 6mm, Mixers 36-pin thin QFN package with an exposed pad. 39dB Channel-to-Channel Isolation Electrical performance is guaranteed over the extended temperature range, from T = -40C to +85C. Single +5.0V or +3.3V Supply C External Current-Setting Resistors Provide Option Applications for Operating Device in Reduced-Power/Reduced- Performance Mode 3.5GHz WiMAX and LTE Base Stations Fixed Broadband Wireless Access Ordering Information Microwave Links PART TEMP RANGE PIN-PACKAGE Wireless Local Loop MAX19999ETX+ -40C to +85C 36 Thin QFN-EP* Private Mobile Radios MAX19999ETX+T -40C to +85C 36 Thin QFN-EP* Military Systems +Denotes a lead-free/RoHS-compliant package. Pin Configuration/Functional Diagram and Typical *EP = Exposed pad. Application Circuit appear at end of data sheet. T = Tape and reel. WiMAX is a trademark of WiMAX Forum. Maxim Integrated Products 1 For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxims website at www.maxim-ic.com.Dual, SiGe High-Linearity, 3000MHz to 4000MHz Downconversion Mixer with LO Buffer ABSOLUTE MAXIMUM RATINGS V to GND...........................................................-0.3V to +5.5V (Notes 2, 3)..............................................................+38C/W CC JA RF , LO to GND.....................................................-0.3V to +0.3V (Note 3).....................................................................7.4C/W JC IFM , IFD , IFM SET, IFD SET, LO ADJ M, Operating Case Temperature Range LO ADJ D to GND.................................-0.3V to (V + 0.3V) (Note 4) ...................................................T = -40C to +85C CC C RF , LO Input Power ......................................................+15dBm Junction Temperature......................................................+150C RF , LO Current (RF and LO are DC shorted to GND Storage Temperature Range .............................-65C to +150C through balun).................................................................50mA Lead Temperature (soldering, 10s) .................................+300C Continuous Power Dissipation (Note 1) ..............................8.7W Note 1: Based on junction temperature T = T + ( x V x I ). This formula can be used when the temperature of the exposed J C JC CC CC pad is known while the device is soldered down to a PCB. See the Applications Information section for details. The junction temperature must not exceed +150C. Note 2: Junction temperature T = T + ( x V x I ). This formula can be used when the ambient temperature of the PCB is J A JA CC CC known. The junction temperature must not exceed +150C. Note 3: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four- layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial. Note 4: T is the temperature on the exposed pad of the package. T is the ambient temperature of the device and PCB. A C Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. +5.0V SUPPLY DC ELECTRICAL CHARACTERISTICS (Typical Application Circuit, no input RF or LO signals applied, V = +4.75V to +5.25V, T = -40C to +85C. Typical values are at CC C V = +5.0V, T = +25C, unless otherwise noted. R1 = R4 = 750, R2 = R5 = 698.) CC C PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Supply Voltage V 4.75 5 5.25 V CC Supply Current I Total supply current 388 420 mA CC +3.3V SUPPLY DC ELECTRICAL CHARACTERISTICS (Typical Application Circuit, no input RF or LO signals applied, T = -40C to +85C. Typical values are at C V = +3.3V, T = +25C, unless otherwise noted. R1 = R4 = 1.1k R2 = R5 = 845.) (Note 5) CC C PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Supply Voltage V (Note 6) 3 3.3 3.6 V CC Supply Current I Total supply current 279 mA CC RECOMMENDED AC OPERATING CONDITIONS PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS RF Frequency f (Notes 5, 7) 3000 4000 MHz RF LO Frequency f (Notes 5, 7) 2650 3700 MHz LO Using Mini-Circuits TC4-1W-17 4:1 transformer as defined in the Typical Application Circuit, IF matching 100 500 components affect the IF frequency range IF Frequency f MHz IF (Notes 5, 7) Using alternative Mini-Circuits TC4-1W-7A 4:1 transformer, IF matching components 50 250 affect the IF frequency range (Notes 5, 7) LO Drive Level P (Note 7) -3 +3 dBm LO 2 MAX19999

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8542.31.00 51 No ..Application Specific (Digital) Integrated Circuits (ASIC)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
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