EVALUATION KIT AVAILABLE Click here to ask about the production status of specific part numbers. MAX22088 Home Bus System (HBS) Compatible Transceiver General Description Benefits and Features The MAX22088 Home Bus transceiver complies with the High Integration Reduces BOM and Footprint Home Bus standard, where data and power are passed Eliminates the Need for Large AC-blocking Inductor on one single pair of wires, while minimizing the need Compact 4mm x 4mm TQFN Package for external components. The MAX22088 eliminates the Supports External DC-DC Converter for System large external AC-blocking inductor typically required in Loads More Than 70mA bus powered applications and improves the signal quality Configurability Enables Flexible Design to allow for longer cables. Additionally, the MAX22088 fea- Adjustable Receiver Thresholds tures an integrated 5V linear regulator to power system Switched Cable Termination loads up to 70mA (max). Adjustable Slew Rate on Transmit Signals The MAX22088 supports passing power and data with Large Receiver Hysteresis speed up to, and exceeding, 200kbps. The MAX22088 Data Rates from 9600bps to 200kbps features dynamic cable termination to improve the signal Dynamic Cable Termination Improves Signal quality for applications with high data rates. Quality for High Speed Applications Additional features include adjustable receiver hysteresis, Integrated Protection for Robust Communication receiver thresholds and driver slew rate allow the IEC 61000-4-2 8kV Contact and 15kV Air-Gap MAX22088 to be used in a wide variety of systems. ESD Protection IEC 61000-4-5 1kV Surge Protection with Selected Integrated protection (IEC 61000-4-2 8kV Contact and External Components 15kV Air-Gap ESD) ensures robust communication in -40C to +105C Operating Temperature Range harsh industrial environments. The MAX22088 is specified Thermal Shutdown Protection for operation over the -40C to +105C temperature range and is available in a compact 24-pin 4mm x 4mm TQFN Ordering Information appears at end of datasheet. package. Applications HVAC Data over Power Applications Digital Signage Remote Monitoring and Sensing Simplified Home Bus System (HBS) 18V H+ H+ POWER SUPPLY H- H- 180k 1F 100nF CAPP HPA 1F 1F 1F 1F CAPP HPA 5V FROM V V RAW HP HP RAW SYSTEM 100F EN EN HN AIO AIO CAPN CAPN RTRM HNA 100nF HN HNA BIO BIO RTRMO RTRMO 5V OUTPUT VCC TERM TERM VCC 10F 1F 1F 10F GND GND MAX22088 MAX22088 VCC VCC (REMOTE) (MASTER) SRA SRA TVL TVL RSRA RSRA TVT TVT DIN DIN Micro- Micro- RST RST controller controller DOUT DOUT 19-100718 Rev 2 2/21MAX22088 Home Bus System (HBS) Compatible Transceiver Absolute Maximum Ratings HP to HN ............................................................. -0.3V to +28.0V CAPP, CAPN..................................................................10mA HP to GND........................................................... -0.3V to +28.0V All Other Pins .................................................................50mA HN to GND ............................................................ -6.0V to +6.0V Continuous Power Dissipation HPA to CAPP ........................................................ -0.3V to +6.0V Single-Layer Board (T = +70C, derate 20.8mW/C above A CAPN to HNA........................................................ -0.3V to +6.0V +70C) ....................................................................1666.70mW V , EN to GND............................................... -0.3V to +28.0V Multilayer Board (T = +70C, derate 27.8mW/C above RAW A V to GND........................................................... -0.3V to +6.0V +70C) ....................................................................2222.20mW CC AIO, BIO, TERM, SRA to GND....................... -0.3V to V +0.3V Operating Temperature Range...........................-40C to +105C CC DIN, DOUT, RST, TVL, TVT, HPEN to GND......... -0.3V to +6.0V Junction Temperature.......................................................+150C Continuous Current Into Any Pin Storage Temperature Range ..............................-40C to +150C HP, HN, V , GND................................................... 250mA Soldering Temperature (reflow) ........................................+260C RAW V , AIO, BIO, TERM ................................................. 100mA CC Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Package Information 24-TQFN Package Code T2444+4C Outline Number 21-0139 Land Pattern Number 90-0022 Thermal Resistance, Single-Layer Board: Junction to Ambient ( ) 48C/W JA Junction to Case ( ) 3C/W JC Thermal Resistance, Four-Layer Board: Junction to Ambient ( ) 36C/W JA Junction to Case ( ) 3C/W JC For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a +, , or - in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. www.maximintegrated.com Maxim Integrated 2