Product Information

MAX2410EEI+

MAX2410EEI+ electronic component of Analog Devices

Datasheet
Up-Down Converters Low-Cost RF Up/Downconverter with LNA and PA Driver

Manufacturer: Analog Devices
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 9.5125 ea
Line Total: USD 9.51

0 - Global Stock
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
0 - Global Stock


Ships to you between Fri. 03 May to Thu. 09 May

MOQ : 100
Multiples : 100

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MAX2410EEI+
Analog Devices

100 : USD 5.1747
200 : USD 4.8975
300 : USD 4.8272
500 : USD 4.7571
1000 : USD 4.6868
5000 : USD 4.6166
10000 : USD 4.5464

0 - Global Stock


Ships to you between Thu. 09 May to Mon. 13 May

MOQ : 1
Multiples : 1

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MAX2410EEI+
Analog Devices

1 : USD 9.5125
10 : USD 8.2782
25 : USD 7.9002
50 : USD 7.8876
100 : USD 6.5786
250 : USD 6.2879
1000 : USD 6.2152
2500 : USD 6.0941

     
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RoHS - XON
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Power Gain
Operating Supply Voltage
Maximum Power Dissipation
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Pd - Power Dissipation
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MAX2410 19-1320 Rev 1 3/98 Low-Cost RF Up/Downconverter with LNA and PA Driver General Description Features The MAX2410 performs the RF front-end transmit/receive Low-Cost Silicon Bipolar Design function in time-division-duplex (TDD) communication Integrated Upconvert/Downconvert Function systems. It operates over a wide frequency range and Operates from Single +2.7V to +5.5V Supply is optimized for RF frequencies around 1.9GHz. Applications include most popular cordless and PCS 3.2dB Combined Receiver Noise Figure: standards. 2.4dB (LNA) 9.8dB (Mixer) The MAX2410 contains a low-noise amplifier (LNA), a downconverter mixer, a local-oscillator (LO) buffer, an Flexible Power-Amplifier Driver: upconverter mixer, and a variable-gain power-amplifier 18dBm Output Third-Order Intercept (OIP3) (PA) driver in a low-cost, plastic surface-mount package. 35dB Gain Control Range The LNA has a 2.4dB (typical) noise figure and a LO Buffer for Low LO Drive Level -10dBm input third-order intercept point (IP3). The down- Low Power Consumption: converter mixer has a low 9.8dB noise figure and a 60mW Receive 3.3dBm IP3. Image and LO filtering are implemented off- 90mW Full-Power Transmit chip for maximum flexibility. The PA driver has 15dB of gain, which can be reduced over a 35dB (typical) range. 0.3W Shutdown Mode Power consumption is only 60mW in receive mode or Flexible Power-Down Modes Compatible with 90mW in transmit mode and drops to less than 0.3W in MAX2510/MAX2511 IF Transceivers shutdown mode. A similar part, the MAX2411A, features the same func- Ordering Information tionality as the MAX2410 but offers a differential bidirectional (transmit and receive) IF port. This allows PART TEMP. RANGE PIN-PACKAGE the use of a single IF filter for transmit (TX) and receive MAX2410EEI -40C to +85C 28 QSOP (RX). For applications requiring a receive function only, MAX2410E/D -40C to +85C Dice* consult the data sheet for the MAX2406, a low-cost *Dice are specified at T = +25C, DC parameters only. downconverter with low-noise amplifier. A Applications Pin Configuration PWT1900 DECT TOP VIEW DCS1800/PCS1900 ISM-Band Transceiver GND 1 28 GND PHS/PACS Iridium Handsets LNAIN 2 27 LNAOUT GND 3 26 GND GND 4 25 GND Functional Diagram V 5 24 RXMXIN CC MAX2410 RXEN 6 23 GND LNAOUT RXMXIN LO 7 22 IFIN LO 8 21 IFOUT LNA IFOUT LNAIN RX MIXER TXEN 9 20 GND V 10 19 TXMXOUT LO CC RXEN POWER LO MANAGEMENT TXEN GC 11 18 GND MAX2410 PA DRIVER GND 12 17 GND PADROUT TX MIXER IFIN PADROUT 13 16 PADRIN GND 14 15 GND GC PADRIN TXMXOUT QSOP Maxim Integrated Products 1 For free samples & the latest literature: Low-Cost RF Up/Downconverter with LNA and PA Driver ABSOLUTE MAXIMUM RATINGS V to GND..............................................................-0.3V to +6V Continuous Power Dissipation (T = +70C) CC A LNAIN Input Power.........................................................+15dBm QSOP (derate 11mW/C above +70C) .......................909mW LO, LO Input Power........................................................+10dBm Junction Temperature......................................................+150C PADRIN Input Power ......................................................+10dBm Operating Temperature Range ...........................-40C to +85C RXMXIN Input Power......................................................+10dBm Storage Temperature Range .............................-65C to +165C IFIN Input Power.............................................................+10dBm Lead Temperature (soldering, 10sec) .............................+300C RXEN, TXEN, GC Voltage...........................-0.3V to (V + 0.3V) CC Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. DC ELECTRICAL CHARACTERISTICS (V = 2.7V to 5.5V, V = 3.0V, RXEN = TXEN = 0.6V, IFOUT and PADROUT pulled up to V with 50 resistors, TXMXOUT pulled CC GC CC up to V with 125 resistor, LNAOUT pulled up to V with 100 resistor, all other RF and IF inputs open, T = -40C to +85C, CC CC A unless otherwise noted. Typical values are at T = +25C and V = 3.0V.) A CC PARAMETER CONDITIONS MIN TYP MAX UNITS Supply Voltage Range 2.7 5.5 V Digital Input Voltage High RXEN, TXEN pins 2.0 V Digital Input Voltage Low RXEN, TXEN pins 0.6 V RXEN Input Bias Current (Note 1) RXEN = 2V 0.1 1 A TXEN Input Bias Current (Note 1) TXEN = 2V 0.1 1 A GC Input Bias Current GC = 3V, TXEN = 2V 35 46 A Supply Current, Receive Mode RXEN = 2V 20 29.5 mA Supply Current, Transmit Mode TXEN = 2V 30 44.5 mA Supply Current, Standby Mode RXEN = 2V, TXEN = 2V 160 520 A Supply Current, Shutdown Mode V = 3V 0.1 10 A CC AC ELECTRICAL CHARACTERISTICS (MAX2410 EV kit, V = 3.0V, V = 2.15V, RXEN = TXEN = low, f = 1.5GHz, P = -10dBm, f = f = f = CC GC LO LO LNAIN PADRIN RXMXIN 1.9GHz, P = -32dBm, P = P = -22dBm, f = 400MHz, P = -32dBm. All measurements performed in 50 LNAIN PADRIN RXMXIN IFIN IFIN environment. T = +25C, unless otherwise noted.) A PARAMETER CONDITIONS MIN TYP MAX UNITS LOW-NOISE AMPLIFIER (RXEN = High) T = +25C 14.2 16.2 17.4 A Gain (Note 1) dB T = T to T 12.6 19.1 A MIN MAX Noise Figure 2.4 dB Input IP3 (Note 2) -10 dBm Output 1dB Compression -5 dBm LO to LNAIN Leakage RXEN = high or low -49 dBm RECEIVE MIXER (RXEN = High) T = +25C 6.6 8.3 9.8 A Conversion Gain (Note 1) dB T = T to T 5.4 10.8 A MIN MAX Noise Figure Single sideband 9.8 dB Input IP3 (Note 3) 3.3 dBm Input 1dB Compression -8 dBm IFOUT Frequency (Notes 1, 4) 450 MHz Minimum LO Drive Level (Note 5) -17 dBm 2 MAX2410

Tariff Desc

8542.31.00 51 No ..Application Specific (Digital) Integrated Circuits (ASIC)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:
AD4
ANALOG DEVICES
Analog Devices Hittite
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ANALOG DEVICES (MAXIM INTEGRATED)
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Analog Devices / Hittite
Analog Devices / Linear Technology
Analog Devices Inc
Analog Devices Inc.
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DA4
Dallas
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Dallas Semiconductor (VA)
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Maxim Integrated Products
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MX4
Technology
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Trinamic Motion Control
Trinamic Motion Control GmbH

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