EVALUATION KIT AVAILABLE Click here for production status of specific part numbers. MAX98360A/B/C/D Tiny, Cost-Effective, Plug-and-Play Digital Class-D Amplifier General Description Benefits and Features The MAX98360A/B/C/D is an easy-to-use, low-cost, digital Simple Plug-and-Play Design pulse-code modulation (PCM) input Class-D amplifier that Single-Supply Operation (2.5V to 5.5V) provides industry-leading, Class-AB audio performance 3.2W Output Power into 4 at 5V with Class-D efficiency. The digital audio interface au- 2.2mA Quiescent Current tomatically recognizes different PCM and TDM clocking 1ms Turn-On Time (for MAX98360A and 2 schemes which eliminates the need for I C programming. MAX98360B) Simply supply power, LRCLK, BCLK, and digital audio to 92% Efficiency (R = 8, THD+N = 10%) L generate audio. Furthermore, a novel pinout allows cus- 10V Output Noise RMS tomers to use the cost-effective WLP package with no 110dB Dynamic Range need for expensive vias. Low 0.009% THD+N at 1kHz No MCLK Required The digital audio interface is highly flexible. The devices Sample Rates of 8kHz to 96kHz 2 support I S, left-justified, and 8-channel time division mul- 2 Supports Left, Right, or (Left/2 + Right/2) Output in I S tiplexed (TDM) data formats. The digital audio interface and Left-Justified Modes accepts 8kHz, 16kHz, 32kHz, 44.1kHz, 48kHz, 88.2kHz, Sophisticated Edge Rate Control Enables Filterless and 96kHz sample rates. Data words can be 16-bit, 24-bit, Class-D Outputs 2 or 32-bit in I S and left-justified modes and 16-bit or 32-bit 81dB PSRR at 217Hz in TDM mode. 1.5A Standby Current Allows Elimination of GPIO for Digital audio interface input thresholds are ideal for inter- EN Pin facing to 1.2V and 1.8V logic. The devices can tolerate Low RF Susceptibility Rejects TDMA Noise from GSM logic input voltages up to 5.5V. Radios The MAX98360A and MAX98360B have fast 1ms turn-on Class-D Switching Frequency Trimmed to 5% for times while the MAX98360C and MAX98360D ramp the Better EMI Planning volume over 13ms during turn-on and turn-off. Extensive Click-and-Pop Reduction Circuitry Robust Short-Circuit and Thermal Protection The devices eliminate the need for the external MCLK sig- Available in Space-Saving Package: 9-Pin WLP nal that is typically used for PCM communication. This re- (0.4mm Pitch) or 10-Pin FC2QFN (0.5mm Pitch) duces EMI and possible board coupling issues in addition 2 3.69mm Solution Size for WLP With A Single Bypass to reducing the size and pin count. The devices also fea- Capacitor ture a very high wideband jitter tolerance (12ns, typ) on BCLK and LRCLK to provide robust operation. Ordering Information appears at end of data sheet. Active emissions-limiting, edge-rate limiting, and over- shoot control circuitry greatly reduce EMI. A filterless Simplified Block Diagram spread-spectrum modulation scheme eliminates the need for output filtering found in traditional Class-D devices and VDD EN reduces the component count of the solution. CONTROL MAX98360MAX98360 GAIN SLOT The devices are specified over the -40C to +85C tem- OUTP DAI0 perature range. DAI1 PCM DAC CLASS-D AMPLIFIER INTERFACE DAI2 Applications OUTN Single Li-ion Cell/5V Devices Smart Speakers GND Notebook Computers IoT Devices Gaming Devices (Audio and Haptics) Smartphones Tablets Cameras 19-100655 Rev 2 3/20MAX98360A/B/C/D Tiny, Cost-Effective, Plug-and-Play Digital Class-D Amplifier Absolute Maximum Ratings V , DAI0, DAI1, and DAI2 to GND ......................... -0.3V to +6V Continuous power dissipation (T = +70C) WLP (derate DD A All other pins to GND .................................... -0.3V to V + 0.3V 13.7mW/C above +70C) ..............................................1096mW DD Duration of OUTP or OUTN short circuit to GND or Junction temperature ........................................................+150C V ............................................................................. Continuous Operating temperature range ................................-40C to +85C DD Duration of OUTP short to OUTN ............................... Continuous Storage temperature range .................................-65C to +150C Soldering temperature (reflow) .........................................+260C Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Package Information WLP Package Code N91E1+1 Outline Number 21-100371 Land Pattern Number Refer to Application Note 1891 Thermal Resistance, Four-Layer Board: Junction to Ambient ( ) 73C/W JA Junction to Case ( ) N/A JC FC2QFN Package Code F102A2F+1 Outline Number 21-100376 Land Pattern Number 90-100123 Thermal Resistance, Four-Layer Board: Junction to Ambient ( ) 73C/W JA Junction to Case ( ) 41C/W JC For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a +, , or - in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. www.maximintegrated.com Maxim Integrated 2