HMPP-389x Series
MiniPak Surface Mount RF PIN Switch Diodes
Data Sheet
Description/Applications Features
These ultra-miniature products represent the blending of Surface mount MiniPak package
Broadcoms proven semiconductor and the latest in leadless
Better thermal conductivity for higher power dissipation
packaging technology.
Single and dual versions
The HMPP-389x series is optimized for switching applications Matched diodes for consistent performance
where low resistance at low current and low capacitance are
Low capacitance
required. The MiniPak package offers reduced parasitics when
Low resistance at low current
compared to conventional leaded diodes, and lower thermal
1
Low FIT (Failure in Time) rate
resistance.
Six-sigma quality level
Low junction capacitance of the PIN diode chip, combined with
ultra low package parasitics, means that these products can be
Pin Connections and Package Marking
used at frequencies that are higher than the upper limit for
conventional PIN diodes.
3 4
Note that Broadcoms manufacturing techniques assure that
dice packaged in pairs are taken from adjacent sites on the
AA
wafer, ensuring the highest degree of match.
2 1
The HMPP-389T low inductance wide band shunt switch is well
suited for applications up to 6 GHz.
Minipak 1412 is a ceramic based package, while Minipak QFN is Product code Date code
a lead frame based package.
Note: Package marking provides orientation and identification.
See Electrical Specifications for appropriate package marking.
Package Lead Code Identification
(Top View)
Single Anti-parallel Parallel
3 4 3 4 3 4
2 1 2 1 2 1
#0 #2 #5
(Minipak 1412) (Minipak 1412) (Minipak 1412)
Shunt Switch
Cathode Anode
3 4
2 1
1. For more information, see the Surface Mount Schottky
Anode Cathode
T
Reliability Data Sheet.
Broadcom
- 1 -HMPP-389x Series Data Sheet
HMPP-389x Series Absolute Maximum Ratings, T = 25C
C
Operation in excess of any one of these conditions may result in permanent damage to the device.
MiniPak 1412/
Parameter Symbol Unit
MiniPak QFN
Forward Current (1-s pulse) I 1A
f
Peak Inverse Voltage P 100 V
IV
Junction Temperature T 150 C
j
Storage Temperature T 65 to +150 C
stg
a
150 C/W
Thermal Resistance jc
a. T = +25C, where T is defined to be the temperature at the package pins where contact is made to the circuit board.
C C
CAUTION Handling precautions should be taken to avoid static discharge.
MiniPak1412 Electrical Specifications, T = +25C, Each Diode
C
Minimum Maximum Series Maximum Total
Part Number Package
Lead Code Configuration Breakdown Voltage Resistance Capacitance
HMPP- Marking Code
(V) () (pF)
3890 D 0 Single 100 2.5 0.30
3892 C 2 Anti-parallel
3895 B 5 Parallel
389T T TShunt Switch
Test Conditions V = V I = 10 mA V = 5V
R BR F R
Measure I 10 A f = 100 MHz f = 1 MHz
R
MiniPak1412 Typical Parameters, T = +25C
C
Series Resistance Total Capacitance
Part Number Carrier Lifetime
R () C (pF)
HMPP- (ns)
S T
389x 3.8 200 0.20 at 5V
Test Conditions I = 1 mA I = 10 mA
F F
f = 100 MHz I = 6 mA
R
Broadcom
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