DLPA004 DATA BUS TRANSIENT SUPPRESSOR Features Mechanical Data Fast Switching Speed Case: SOT-363 Ultra-Small Surface Mount Package Case Material: Molded Plastic,Gree Molding Compound. UL Flammability Classification Rating 94V-0 (Note 3) Lead Free By Design/RoHS Compliant (Note 3) Moisture Sensitivity: Level 1 per J-STD-020D Gree Device (Note 4) Terminals: Finish Matte Tin annealed over Alloy 42 Qualified to AEC-Q101 Standards for High Reliability Leadframe. Solderable per MIL-STD-202, Method 208 Ordering Information: See Page 3 Data Line Transient Protection Marking Information: See Page 3 In accordance with (Note 1): Weight: 0.006 grams (approximate) IEC 61000-4-2 Contact Method: 15kV IEC 61000-4-2 Air Discharge Method: 25kV N/C I/O N/C SOT-363 6 5 4 2 3 1 V V I/O P N TOP VIEW Device Schematic Maximum Ratings T = 25C unless otherwise specified A Characteristic Symbol Value Unit V Peak Repetitive Reverse Voltage RRM Working Peak Reverse Voltage 85 V V RWM DC Blocking Voltage V R RMS Reverse Voltage V 60 V R(RMS) Forward Current (Single Diode) I 200 mA FM Peak Forward Surge Current I 3.5 A FM(surge) 8.3ms Single half Sine-Wave Superimposed on Rated Load Average Rectified Forward Current (Note 1) I 1 A F(AV) Repetitive Peak Forward Current 450 mA I FRM Non-Repetitive Peak Forward Surge Current t = 1.0s 4.0 t = 1.0ms I 1.0 A FSM 0.5 t = 1.0s Thermal Characteristics Characteristic Symbol Value Unit Power Dissipation (Note 2) P 200 mW D Thermal Resistance Junction to Ambient Air (Note 2) 625 R C/W JA Operating and Storage Temperature Range -65 to +150 T , T C J STG Notes: 1. Tested with V pins connected to GND pin. CC 2. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which can be found on our website at DLPA004 Electrical Characteristics T = 25C unless otherwise specified A Characteristic SymbolMin Typ Max Unit Test Condition Reverse Breakdown Voltage (Note 5) V 85 V I = 100A (BR)R R I = 1.0mA 0.80 F 0.90 I = 10mA F Forward Voltage V V F 1.0 I = 50mA F 1.25 I = 150mA F 2.5 V = 70V R Leakage Current (Note 5) I 30 A V = 25V, T = 150C R R J 50 V = 70V, T = 150C R J Total Capacitance (per element) C 2 pF V = 0, f = 1.0MHz T R Capacitance Between Two Data Lines (DL & DL , DL & DL) C 1.6 2.0 pF V = 0, f = 1.0MHz 1 2 1 3 LL R Capacitance Between Data Line and Ground C 2.3 3.0 pF V = 0, f = 1.0MHz LG R I = I = 10mA, F R Reverse Recovery Time t 3.0 s rr I = 0.1 x I , R = 100 rr R L Notes: 5. Short duration pulse test used to minimize self-heating effect. 300 1,000 250 100 200 10 150 1.0 100 0.1 50 0 0.01 0 25 50 75 100 125 150 01 2 T , AMBIENT TEMPERATURE (C) A V , INSTANTANEOUS FORWARD VOLTAGE (V) F Fig. 1 Power Derating Curve, Total Package Fig. 2 Typical Forward Characteristics, Per Element 10 1 0.1 050 100 150 200 T , AMBIENT TEMPERATURE (C) A Fig. 3 Typical Reverse Characteristics, Per Element 2 of 4 March 2009 DLPA004 Diodes Incorporated www.diodes.com Document number: DS31593 Rev. 4 - 2 NEW PRODUCT P , POWER DISSIPATION (mW) I , INSTANTANEOUS REVERSE CURRENT (nA) D R I , INSTANTANEOUS FORWARD CURRENT (mA) F