DT2042-04SO
4 CHANNEL LOW CAPACITANCE TVS DIODE ARRAY
Features Mechanical Data
Low Clamping Voltage Case: SOT26
Typical 9V at 10A 100ns, TLP Case Material: Molded Plastic, Green Molding Compound.
Typical 9V at 10A 8 s/20 s UL Flammability Classification Rating 94V-0
IEC 61000-4-2 (ESD): Air 30kV, Contact 30kV Moisture Sensitivity: Level 1 per J-STD-020
Terminals: Matte Tin Finish annealed over Copper leadframe
IEC 61000-4-4 (EFT): 60A(5/50ns, I/O to V )
ss
(Lead Free Plating). Solderable per MIL-STD-202, Method 208
IEC 61000-4-5 (Lightning): 10A
Weight: 0.016 grams (approximate)
4 Channels of ESD protection
Low Channel Input Capacitance of 1.2pF Typical
TLP Dynamic Resistance: 0.25
Typically Used for High Speed Ports such as USB 2.0,
IEEE1394, VGA, Laptop and Personal Computers,
Flat Panel Displays, Video Graphics Displays, SIM Ports
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. Green Device (Note 3)
SOT26
NC
I/O 4 I/O 3
6 5 4
1 2 3
V I/O 2
I/O 1
SS
Top View Device Schematic
Ordering Information (Note 4)
Product Compliance Marking Reel Size (inches) Tape Width (mm) Quantity per Reel
DT2042-04SO-7 Standard BC5 7 8 3,000/Tape & Reel
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See
DT2042-04SO
Maximum Ratings (@T = +25C, unless otherwise specified.)
A
Characteristic Symbol Value Unit Conditions
Peak Pulse Current, per IEC 61000-4-5 10 A
I I/O to V , 8/20 s
PP SS
Peak Pulse Power, per IEC 61000-4-5 105 W
P I/O to V , 8/20 s
PP SS
Operating Voltage (DC) 5.5 V
V I/O to V
DC SS
ESD Protection Contact Discharge, per IEC61000-4-2 V 30 kV I/O to V
ESD_contact SS
ESD Protection Air Discharge, per IEC 61000-4-2 V 30 kV I/O to V
ESD_air SS
Operating Temperature -55 to +85 C
T
OP
Storage Temperature T -55 to +150 C
STG
Thermal Characteristics
Characteristic Symbol Value Unit
Power Dissipation Typical (Note 5) P 300 mW
D
Thermal Resistance, Junction to Ambient Typical (Note 5) R 417 C/W
JA
Electrical Characteristics (@T = +25C, unless otherwise specified.)
A
Characteristic Symbol MinTypMaxUnit Test Conditions
Reverse Working Voltage 5.5 V
V I/O to V
RWM SS
Reverse Current(Note6) 1 A
I V = 5V, any I/O to V
R R SS
Reverse Breakdown Voltage 6 9 V
V I = 1mA, I/O to V
BR R SS
Forward Clamping Voltage -1.0 -0.8 V = -15mA, I/O to V
V I
F F SS
Holding Voltage V 5.5 V
H
Trigger Voltage V 9 9.5 V
TRIG
Reverse Clamping Voltage (Note 7) V 7.5 V I = 5A, I/O to V , 8/20 s
C_5A PP SS
Reverse Clamping Voltage (Note 7) V 9 10.5 V I = 10A, I/O to V , 8/20 s
C_10A PP SS
ESD Clamping Voltage 9 V
V TLP, 10A, tp = 100 ns, I/O to V , per Fig. 7
ESD SS
Dynamic Resistance 0.25
R TLP, 10A, tp = 100 ns, I/O to V
DIF SS
1.2 1.5 pF
Channel Input Capacitance C V = 2.5V, f = 1MHz
I/O R
Vss = 0V,I/O = 2.5V, f =1MHz, T=25C ,
Variation of Channel Input Capacitance C 0.02 pF
I/O
I/O_x to V I/O_y to V
SS SS
Notes: 5. Device mounted on FR-4 PCB pad layout (2oz copper) as shown on Diodes, Inc. suggested pad layout AP02001, which can be found on our website
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