5962-8769301EA E2v

REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Update boilerplate to MIL-PRF-38535 requirements. Editorial changes 05-02-07 Thomas M. Hess throughout. - LTG REV SHEET REV SHEET REV STATUS REV A A A A A A A A A A A A A OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 PMIC N/A PREPARED BY Greg A. Pitz DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 STANDARD CHECKED BY 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-87693 01 E A Drawing number Device type Case outline Lead finish (see 1.2.1) (see 1.2.2) (see 1.2.3) 1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54AC253 Dual 4-input multiplexer with three-state outputs 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style E GDIP1-T16 or CDIP2-T16 16 Dual-in-line package F GDFP2-F16 or CDFP3-F16 16 Flat pack 2 CQCC1-N20 20 Square leadless chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. 1/ 2/ 3/ Supply voltage range (V ) ........................................................................................ -0.5 V dc to +6.0 V dc CC DC input voltage (V ) ................................................................................................ -0.5 V dc to V + 0.5 V dc IN CC DC output voltage range (V ) ................................................................................. -0.5 V dc to V + 0.5 V dc OUT CC Clamp diode current (I , I )...................................................................................... 20 mA IK OK DC output current (I ) ............................................................................................. 50 mA OUT DC V or GND current (I , I ).............................................................................. 100 mA CC CC GND Storage temperature range (T ) ............................................................................. -65C to +150C STG Maximum power dissipation (P ) ............................................................................... 500 mW D Lead temperature (soldering 10 seconds).................................................................. +245C Thermal resistance, junction-to-case ( ) ................................................................. See MIL-STD-1835 JC Junction temperature (T )........................................................................................... +175C 4/ J See footnotes on next sheet. SIZE STANDARD 5962-87693 A MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS REVISION LEVEL SHEET COLUMBUS, OHIO 43218-3990 A 2 DSCC FORM 2234 APR 97