5962-8971202ZA

REVISIONS LTR DESCRIPTION DATE APPROVED A Updated boilerplate. Added CAGE 75596 as a source of supply. - glg 99-05-04 Raymond Monnin B Boilerplate update and part of five year review. tcr 07-06-05 Robert M. Heber REV SHEET REV SHEET B B B B B B B B B B B B B REV STATUS REV OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 PREPARED BY PMIC N/A Charles Reusing DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 STANDARD CHECKED BY 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN shall be as shown in the following example: 5962-89712 01 X A Drawing number Device type Case outline Lead finish (see 1.2.1) (see 1.2.2) (see 1.2.3) 1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number 1/ Circuit function Acces time 01 16K X 4 SRAM with separate I/O 45 ns 02 16K X 4 SRAM with separate I/O 35 ns 03 16K X 4 SRAM with separate I/O 25 ns 04 16K X 4 SRAM with separate I/O 20 ns 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style X GDIP4-T28 or CDIP3-T28 28 Dual-in-line package Y GDFP2-F28 28 Flat package Z CQCC4-N28 28 Rectangular chip carrier package U CQCC3-N28 28 Rectangular chip carrier package 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage to ground potential (V ) .............................. -0.5 V dc to +7.0 V dc CC DC voltage applied to outputs in high Z state ....................... -0.5 V dc to +7.0 V dc DC input voltage (V ) 2/...................................................... -0.5 V dc to +7.0 V dc IN DC output current ................................................................. 20 mA Maximum power dissipation .............................................. 1.0 W Lead temperature (soldering, 10 seconds) ........................... +260C Thermal resistance, junction-to-case ( ) ........................... See MIL-STD-1835 JC Junction temperature (T ) 3/ ................................................ +150C J Storage temperature range................................................... -65C to +150C Temperature under bias ....................................................... -55C to +125C 1.4 Recommended operating conditions. Supply voltage range (V )................................................... +4.5 V dc to +5.5 V dc CC Ground voltage (GND).......................................................... 0 V dc Input high voltage (V )......................................................... 2.2 V dc minimum IH Input low voltage (V )........................................................... 0.8 V dc maximum IL Operating case temperature range (T )................................ -55C to +125C C 1/ Generic numbers are listed on the Standardized Military Drawing Source Approval Bulletin at the end of this document and will also be listed in MIL- HDBK -103 (see 6.6 herein). 2/ V minimum = -3.0 V for pulse width less than 20 ns. IL 3/ Maximum junction temperature may be increased to 175C during burn-in and steady state life. SIZE STANDARD 5962-89712 A MICROCIRCUIT DRAWING REVISION LEVEL SHEET DEFENSE SUPPLY CENTER COLUMBUS B 2 COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97