Global Mixed-mode Technology G5390 Ultra Low Quiescent Current, Hysteretic DC-DC Boost Converter Features General Description 0.7V ~ 5.0V input voltage operation The G5390 is an ultra low quiescent current, hysteretic 2.2V ~ 5.0V fixed output voltage DC-DC boost converter. The device can operate from 200mA maximum output current load a 0.7V to 5.0V supply and the output voltage is fixed 1 A ultra low quiescent current from 2.2V to 5.0V. The output is not connected to the Shutdown current < 100nA input in shutdown mode and the shutdown current is 94% efficiency less than 100nA. The G5390 features auto-bypass Output true-shutdown. mode when the device directly connect the input to the Auto-bypass mode when V > V output voltage if the V exceeds V . In light load IN OUT IN OUT Adjustable low battery detection or operation, the G5390 enters sleep mode. Most of the Power-Good output selectable operating blocks are turned off for saving power. The Over temperature protection G5390 also offers adjustable low battery detection. No external diode or transistor required The LBO output is pulled to logic low if the battery TDFN2X2-8 Package voltage decreases below the threshold defined by external resistors on pin LBI. Alternately, the LBO output is working as Power-Good function when LBI is Applications connected to GND. Handheld devices Ordering Information ORDER TEMP. PACKAGE MARKING VOLTAGE NUMBER RANGE (Green) G5390-33RC1U 530A 3.3V -40C~+85C TDFN2X2-8 G5390-50RC1U 530B 5.0V -40C~+85C TDFN2X2-8 G5390-45RC1U 530C 4.5V -40C~+85C TDFN2X2-8 G5390-30RC1U 530D 3.0V -40C~+85C TDFN2X2-8 G5390-28RC1U 530E 2.8V -40C~+85C TDFN2X2-8 G5390-25RC1U 530F 2.5V -40C~+85C TDFN2X2-8 G5390-23RC1U 530G 2.3V -40C~+85C TDFN2X2-8 G5390-22RC1U 530H 2.2V -40C~+85C TDFN2X2-8 Note: RC: TDFN2X2-8 1: Bonding code D & U: Tape & Reel Green: Lead Free / Halogen Free Pin Configuration G5390 LBI 11 8 VIN 8 9 NC GND 22 7 EN 7 Thermal Thermal PaPadd LX 3 6 LBO 3 6 4 4 55 REF VOUT TDFN2X2-8 *This pad can be left floating or connect to GND for an optimal thermal performance. Ver: 0.6 May 14 2018 1 Global Mixed-mode Technology G5390 Absolute Maximum Ratings VIN, VOUT . . . . . . . . . . . . . . . . . . -0.3V to +6.5V Operating Junction Temperature . . . . . . . . . . . +150C LX, REF . . . . . . . . . . . . . . . . -0.3V to (VOUT+0.3)V Storage Temperature range . . . . . . . .-55C to +150C EN, LBI, LBO . . . . . . . . . . . . . . . . . -0.3V to +6.3V Reflow Temperature (Soldering, 10sec) . . . . . . .260C Thermal Resistance Junction to Ambient, ( ) ESD Susceptibility (HBM). . . . . . . . . . . . . . . . . . . .2kV JA TDFN2X2-8. . . . . . . . . . . . . . . . . . . . . . . . . .60C/W ESD Susceptibility (MM). . . . . . . . . . . . . . . . . . . .300V Continuous Power Dissipation (T =+25C) A TDFN2X2-8 . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5W * The package is placed on a 2-layer PCB (1oz). 1. Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications are not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. 2. Device is ESD sensitive. Handling precaution recommended. The Human Body model is a 100pF capacitor discharged through a 1.5K resistor into each pin. Electrical characteristics O (VIN=1.5V, T =25 C.) A The device is not guaranteed to function outside its operating conditions. Parameters with MIN and/or MAX limits are 100% tested at +25C, unless otherwise specified. PARAMETER SYMBOL CONDITIONS MIN TYP MAXUNIT Input Voltage Range V 0.7 --- 5.0 V IN Minimum Startup Voltage V T=+25C --- 0.7 --- V IN START AMB Output Voltage Range V 2.2 --- 5.0 V OUT Output Lockout Threshold V V rising --- 2 --- V OUT LO OUT Output Lockout Threshold Hysteresis V V falling --- 100 --- mV OUT OUT LO Reference Voltage V 0.99 1 1.01V REF Output Voltage Tolerance I =0mA to 10mA, T=+25C -2 --- +2 % LOAD AMB V =1.02xV , OUT OUTNOM Quiescent Current at V IN I --- --- 100 nA Q IN T =+25C AMB Quiescent Current at V OUT V =5V, No load, T=+25C 0.7 1 1.3 A I OUT AMB Q OUT Shutdown Current I T=+25C --- --- 100 nA SD AMB PMOS ON Resistance R V=5V --- 0.45 --- ON P OUT NMOS ON Resistance R V=5V --- 0.4 --- ON N OUT NMOS Maximum On-Time T 3.3 4.0 4.6 s ON MAX Peak Current Limit I --- 400 --- mA PEAK Zero Crossing Current I 5 20 35 mA ZC EN input voltage HIGH V 0.7 --- --- V IH EN input voltage LOW V --- --- 0.1 V IL EN input current I EN=5V, T=+25C --- --- 100 nA EN AMB REF input current I REF=1.01V, T=+25C --- --- 100 nA REF AMB LBI threshold V LBI falling 0.57 0.6 0.63 V LBI LBI hysteresis V LBI rising --- 25 --- mV LBI HYS LBI leakage current I LBI =1.5V, T=+25C --- --- 100 nA LBI AMB LBO voltage low V I=1mA --- 5 20 mV LBO LBO LBO leakage current I T=+25C --- --- 100 nA LBO AMB Power-Good threshold V LBI=0V, V falling 87 91 95 % OUT PG o Thermal Shutdown T --- 150 --- C SD o Thermal Shutdown Hysteresis T --- 10 --- C SD HYS Ver: 0.6 May 14 2018 2