TechnicalData Sheet BERGQUIST LIQUI FORM TLFLF3500 BERGQUIST LIQUI-FORM 3500 June -2019 PRODUCT DESCRIPTION TYPICAL PROPERTIES OF CURED MATERIAL Thermally Conductive, One-Part, Liquid Formable GelMaterial. Physical Properties (1) Dispense Rate ,grams / minute 40 Technology Silicone Volumetric Expansion , 25 to 275C ,ASTM E228200 modified ,ppm/C Appearance Gray Cure Pre-cure gel Electrical Properties Application Thermal management, Dielectric Strength ,ASTM D149,V/mm 10,000 TIM(Thermal Interface Material) DielectricConstant ,ASTM D150 1,000Hz 8.1 Operating Temperature -60 to 200C 11 Volume Resistivity ,ASTM D257,ohm-meter 110 Range UL Flammability Rating UL 94 V-0 Outgassing Properties TotalMass Loss, % ,ASTM E595 0.14 FEATURES AND BENEFITS Thermal Properties Thermal Conductivity: 3.5 W/m-K Thermal Conductivity ,ASTM D5470,W/(m-K) 3.5 Dispensable pre-cured gel Stable viscosity in storage and in the application Thermal Performance vs. Pressure 2 (2) Excellent chemicalstability and mechanical stability Thermal Impedance ,ASTM D5470,C-in /W 10 psi 0.07 BERGQUIST LIQUIFORM TLFLF3500 is a highconductivity 25 psi 0.07 gel thermal interface material designed for demanding 50 psi 0.06 applications that require a balance between dispensability and low component stress during assembly and also in the application. (1) 30cc syringe, 90 psi (621 kPa), 0.100 orificeno attachment (2) The ASTM D5470 test fixture was utilized. The recorded values include the interfacial thermal resistance. The values are provided for reference only. Actual application BERGQUIST LIQUIFORM TLF LF3500 is a one-part, highly performance is directly related to the surface roughness, flatness and pressure applied conformable gelwith thixotropic properties . The material is precured and requires no curing, mixing or refrigeration . Its unique formulation assures excellent thermal performance, low GENERAL INFORMATION applied stress and reliablelong-term performance . For safe handling information on this product, consult the Safety Data Sheet, (SDS). BERGQUIST LIQUIFORM TLFLF3500 is thixotropic and has Not for product specifications a natural tack ensuring it forms around the component and The technicaldata contained herein are intended as reference stays in place in the application. only. Please contact your localquality department for assistance and recommendations on specifications for this product. TYPICAL APPLICATIONS Handheld devices The above cure profiles are guideline recommendations. Cure Bare die to heat spreader lid conditions (time and temperature) may vary based on Fillingvarious gaps between heat-generating devices to customers experience and their application requirements, as heat sink and housing well as customer curing equipment, oven loadingand actual oven temperatures. Devices requiring low assembly pressure Highvalue assemblies with rework BGA, PGA, PPGA TYPICAL PROPERTIES OF UNCURED MATERIAL Density ,ASTM D792,g/cc 3.1 ShelfLife 25 C ,days 365TDS BERGQUIST LIQUIFORM TLFLF3500, June -2019 except ifotherwise explicitly agreed and except in relation to death or personal CONFIGURATIONS AVAILABLE injury caused by our negligenceand any liabilityunder any applicablemandatory BERGQUIST LIQUIFORM TLF LF3500 is available with or product liabilitylaw. without glass beads. Glass beads are available in 7 mil In case products are delivered by Henkel Corporation, Resin Technology configuration. Group, Inc., or Henkel Canada Corporation, the following disclaimer is applicable: The data contained herein are furnished for information only and are believed to BERGQUIST LIQUIFORM TLFLF3500 is supplied in: be reliable.We cannot assume responsibility for the results obtained by others over whose methods we have no control. It is the user s responsibility to Cartridges 30cc,150 cc,300cc,600cc determine suitability for the user s purpose ofany production methods mentioned Pail 4.3gallon herein and to adopt such precautions as may be advisable for the protection of property and ofpersons against any hazards that may be involved in the handling and use thereof. In lightof the foregoing,Henkel Corporation specifically disclaims all warranties expressed or implied, including warranties of THAWING: merchantability or fitness for a particular purpose, arising from sale or use of Henkel Corporations products. Henkel Corporation specifically 1. Ifrefrigerated, allow container to reach room temperature disclaims any liability for consequential or incidental damages of any kind, before use . including lost profits. The discussion herein of various processes or 2. DO NOT open the container before contents reach 25 C compositions is not to be interpreted as representation that they are free from domination of patents owned by others or as a license under any Henkel temperature. Any moisture that collects on the thawed Corporation patents that may cover such processes or compositions. We container should be removed prior to opening the recommend that each prospective user test his proposed application before container . repetitive use, using this data as a guide. This product may be covered by one or more United States or foreignpatents or patent applications. STORAGE Trademark usage: Except as otherwise noted Alltrademarks in this document are trademarks and/or registered trademarks of Henkel and its affiliatesin the Store product in the unopened container in a dry location. U.S.and elsewhere. Storage information may be indicated on the product container labeling. Reference 2 Optimal Storage: 5 to 25 C for a 365 days shelf life,in sealed containers with moisture barrier packaging. Conversions (C x 1.8)+ 32 = F kV/mm x 25.4 = V/mil mm /25.4 = inches Nx 0.225 = lb/F N/mm x 5.71= lb/in psi x 145 = N/mm MPa = N/mm Nm x 8.851 = lbin Nm x 0.738= lbft Nmm x 0.142= ozin mPas = cP Disclaimer Note: The information provided in this Technical Data Sheet (TDS) including the recommendations for use and application of the product are based on our knowledge and experience ofthe product as at the date ofthis TDS.The product can have a variety of different applications as well as differingapplication and working conditions in your environment that are beyond our control. Henkel is, therefore, not liablefor the suitability ofour product for the production processes and conditions in respect of which you use them, as well as the intended applications and results. We strongly recommend that you carry out your own prior trials to confirm such suitability ofour product. Any liabilityin respect ofthe information in the TechnicalData Sheet or any other written or oral recommendation(s) regarding the concerned product is excluded, except ifotherwise explicitly agreed and except in relation to death or personal injury caused by our negligenceand any liabilityunder any applicablemandatory product liabilitylaw. In case products are delivered by Henkel Belgium NV, Henkel Electronic Materials NV,Henkel Nederland BV,Henkel Technologies France SAS and Henkel France SA please additionally note the following: In case Henkel would be nevertheless held liable,on whatever legalground, Henkels liabilitywillin no event exceed the amount ofthe concerned delivery. In case products are delivered by Henkel Colombiana, S.A.S.the following disclaimer is applicable: The information provided in this Technical Data Sheet (TDS) including the recommendations for use and application of the product are based on our knowledge and experience ofthe product as at the date ofthis TDS. Henkel is, therefore, not liablefor the suitability ofour product for the production processes and conditions in respect of which you use them, as well as the intended applications and results. We strongly recommend that you carry out your own prior trials to confirm such suitability ofour product. Any liabilityin respect ofthe information in the TechnicalData Sheet or any other written or oral recommendation(s) regarding the concerned product is excluded, Americas Europe Asia +1.888.943.6535 +32.1457.5611 +86.21.3898.4800 For the most direct access to local sales and technical support visit: www.henkel.com/electronics