Product Information

CY7C1413KV18-300BZXC

CY7C1413KV18-300BZXC electronic component of Infineon

Datasheet
SRAM 36MB (2Mx18) 1.8v 300MHz QDR II SRAM

Manufacturer: Infineon
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

8: USD 42.5003 ea
Line Total: USD 340

0 - Global Stock
MOQ: 8  Multiples: 8
Pack Size: 8
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0 - WHS 1


Ships to you between Fri. 10 May to Thu. 16 May

MOQ : 272
Multiples : 1
272 : USD 43.4475

0 - WHS 2


Ships to you between Fri. 10 May to Thu. 16 May

MOQ : 8
Multiples : 8
8 : USD 42.5003

0 - WHS 3


Ships to you between Thu. 16 May to Mon. 20 May

MOQ : 272
Multiples : 272
272 : USD 59.2821

     
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CY7C1411KV18/CY7C1426KV18 CY7C1413KV18/CY7C1415KV18 36-Mbit QDR II SRAM Four-Word Burst Architecture 36-Mbit QDR II SRAM Four-Word Burst Architecture Features Configurations Separate independent read and write data ports CY7C1411KV18 4M 8 Supports concurrent transactions CY7C1426KV18 4M 9 333 MHz clock for high bandwidth CY7C1413KV18 2M 18 CY7C1415KV18 1M 36 Four-word burst for reducing address bus frequency Double data rate (DDR) Interfaces on both read and write ports Functional Description (data transferred at 666 MHz) at 333 MHz The CY7C1411KV18, CY7C1426KV18, CY7C1413KV18, and Two input clocks (K and K) for precise DDR timing CY7C1415KV18 are 1.8 V synchronous pipelined SRAMs, SRAM uses rising edges only equipped with QDR II architecture. QDR II architecture consists of two separate ports: the read port and the write port to access Two input clocks for output data (C and C) to minimize clock the memory array. The read port has dedicated data outputs to skew and flight time mismatches support read operations and the write port has dedicated data Echo clocks (CQ and CQ) simplify data capture in high speed inputs to support write operations. QDR II architecture has systems separate data inputs and data outputs to completely eliminate the need to turnaround the data bus that exists with common Single multiplexed address input bus latches address inputs I/O devices. Each port can be accessed through a common for read and write ports address bus. Addresses for read and write addresses are Separate port selects for depth expansion latched on alternate rising edges of the input (K) clock. Accesses to the QDR II read and write ports are independent of one Synchronous internally self-timed writes another. To maximize data throughput, both read and write ports are equipped with DDR interfaces. Each address location is QDR II operates with 1.5 cycle read latency when DOFF is associated with four 8-bit words (CY7C1411KV18), 9-bit words asserted HIGH (CY7C1426KV18), 18-bit words (CY7C1413KV18), or 36-bit Operates similar to QDR I device with 1 cycle read latency when words (CY7C1415KV18) that burst sequentially into or out of the DOFF is asserted LOW device. Because data can be transferred into and out of the device on every rising edge of both input clocks (K and K and C Available in 8, 9, 18, and 36 configurations and C), memory bandwidth is maximized while simplifying Full data coherency, providing most current data system design by eliminating bus turnarounds. Depth expansion is accomplished with port selects, which Core V = 1.8 V (0.1 V) I/O V = 1.4 V to V DD DDQ DD enables each port to operate independently. Supports both 1.5 V and 1.8 V I/O supply All synchronous inputs pass through input registers controlled by Available in 165-ball FBGA package (13 15 1.4 mm) the K or K input clocks. All data outputs pass through output Offered in both Pb-free and non Pb-free Packages registers controlled by the C or C (or K or K in a single clock domain) input clocks. Writes are conducted with on-chip Variable drive HSTL output buffers synchronous self-timed write circuitry. JTAG 1149.1 compatible test access port For a complete list of related documentation, click here. Phase locked loop (PLL) for accurate data placement Selection Guide Description 333 MHz 300 MHz 250 MHz Unit Maximum operating frequency 333 300 250 MHz Maximum operating current 8 Not Offered 520 460 mA 9 560 520 460 18 570 540 470 36 790 730 640 Cypress Semiconductor Corporation 198 Champion Court San Jose, CA 95134-1709 408-943-2600 Document Number: 001-57826 Rev. *L Revised November 21, 20171M x 8 Array 1M x 9 Array 1M x 8 Array 1M x 9 Array 1M x 8 Array 1M x 9 Array 1M x 8 Array 1M x 9 Array CY7C1411KV18/CY7C1426KV18 CY7C1413KV18/CY7C1415KV18 Logic Block Diagram CY7C1411KV18 8 D 7:0 Write Write Write Write 20 Address A Reg Reg Reg Reg (19:0) Register 20 Address A (19:0) Register RPS K Control CLK K Logic Gen. C DOFF Read Data Reg. C CQ 32 V 16 REF 8 CQ Reg. Reg. Control WPS 8 Logic 8 8 16 NWS Q Reg. 1:0 7:0 8 Logic Block Diagram CY7C1426KV18 9 D 8:0 Write Write Write Write 20 Address A Reg Reg Reg Reg (19:0) Register 20 Address A (19:0) Register RPS K Control CLK K Logic Gen. C DOFF Read Data Reg. C CQ 36 V 18 REF 9 CQ Reg. Reg. Control WPS 9 Logic 9 9 18 BWS Q Reg. 0 8:0 9 Document Number: 001-57826 Rev. *L Page 2 of 33 Write Add. Decode Write Add. Decode Read Add. Decode Read Add. Decode

Tariff Desc

8542.32.00 31 No ..Random Access Memory (RAM) including Single Inline Memory Modules (SIMMS), Dual Inline Memory Modules (DIMMS), Dynamic Random Access Memory (DRAM), Synchronous Dynamic Random Access Memory (SD RAM), Rambus Dynamic Random Access Memory (RD RAM) and other similar memory
CYP
Cypress
Cypress / Spansion
CYPRESS SEMI
Cypress Semicon
Cypress Semiconductor
Cypress Semiconductor Corp
INF
INFINEON
Infineon IR
INFINEON (CYPRESS)
Infineon (IRF)
Infineon / Cypress
Infineon / IR
INFINEON TECH ICs
Infineon Technologies
INFINEON TECHNOLOGIES AG
Infineon Technologies Americas Corp.
Infinite Power Solutions
INTERNATIONAL RECTIF
INTERNATIONAL RECTIFIER
International Rectifier HiRel Products
INTL RECTIFIER
IR
IRH
Ramtron
Ramtron / Cypress Semiconductor
Ramtron International Corp
SP9
SPANSION

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