X-On Electronics has gained recognition as a prominent supplier of F3L75R12W1H3B11BPSA1 igbt transistors across the USA, India, Europe, Australia, and various other global locations. F3L75R12W1H3B11BPSA1 igbt transistors are a product manufactured by Infineon. We provide cost-effective solutions for igbt transistors, ensuring timely deliveries around the world.

F3L75R12W1H3B11BPSA1 Infineon

F3L75R12W1H3B11BPSA1 electronic component of Infineon
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Part No.F3L75R12W1H3B11BPSA1
Manufacturer: Infineon
Category:IGBT Transistors
Description: IGBT Transistors LOW POWER EASY
Datasheet: F3L75R12W1H3B11BPSA1 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 83.148 ea
Line Total: USD 83.15

Availability - 21
Ships to you between
Mon. 10 Jun to Wed. 12 Jun
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
21 - WHS 1


Ships to you between Mon. 10 Jun to Wed. 12 Jun

MOQ : 1
Multiples : 1
1 : USD 55.545
10 : USD 54.9585
24 : USD 49.9675
48 : USD 44.643
120 : USD 44.137
264 : USD 44.137

     
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Technische Information / Technical Information IGBT-Modul F3L75R12W1H3 B11 IGBT-Module Vorlufige Daten / Preliminary Data J VCES = 1200V I = 75A / I = 150A C nom CRM Typische Anwendungen Typical Applications 3-Level-Applikationen 3-Level-Applications Solar Anwendungen Solar Applications Elektrische Eigenschaften Electrical Features Niederinduktives Design Low Inductive Design Niedrige Schaltverluste Low Switching Losses Niedriges VCEsat Low VCEsat Mechanische Eigenschaften Mechanical Features Al O Substrat mit kleinem thermischen Al O Substrate with Low Thermal Resistance 2 3 2 3 Widerstand Kompaktes Design Compact design PressFIT Verbindungstechnik PressFIT Contact Technology Robuste Montage durch integrierte Rugged mounting due to integrated mounting Befestigungsklammern clamps Module Label Code Barcode Code 128 Content of the Code Digit Module Serial Number 1 - 5 Module Material Number 6 - 11 Production Order Number 12 - 19 DMX - Code Datecode (Production Year) 20 - 21 Datecode (Production Week) 22 - 23 prepared by: CM date of publication: 2015-08-26 approved by: AKDA revision: V2.0 UL approved (E83335) 1Technische Information / Technical Information IGBT-Modul F3L75R12W1H3 B11 IGBT-Module Vorlufige Daten Preliminary Data IGBT, T1-T4 / IGBT, T1-T4 Hchstzulssige Werte / Maximum Rated Values Kollektor-Emitter-Sperrspannung T = 25C V 1200 V vj CES Collector-emitter voltage Implementierter Kollektor-Strom I 75 A CN Implemented collector current Kollektor-Dauergleichstrom TC = 100C, Tvj max = 175C IC nom 30 A Continuous DC collector current T = 25C, T = 175C I 45 A C vj max C Periodischer Kollektor-Spitzenstrom t = 1 ms I 150 A P CRM Repetitive peak collector current Gesamt-Verlustleistung TC = 25C, Tvj max = 175C Ptot 275 W Total power dissipation Gate-Emitter-Spitzenspannung V +/-20 V GES Gate-emitter peak voltage Charakteristische Werte / Characteristic Values min. typ. max. Kollektor-Emitter-Sttigungsspannung I = 30 A, V = 15 V T = 25C 1,45 1,70 V C GE vj Collector-emitter saturation voltage I = 30 A, V = 15 V T = 125C V 1,55 V C GE vj CE sat I = 30 A, V = 15 V T = 150C 1,60 V C GE vj Gate-Schwellenspannung IC = 2,60 mA, VCE = VGE, Tvj = 25C VGEth 5,05 5,80 6,45 V Gate threshold voltage Gateladung V = -15 V ... +15 V Q 0,57 C GE G Gate charge Interner Gatewiderstand Tvj = 25C RGint 0,0 Internal gate resistor Eingangskapazitt f = 1 MHz, T = 25C, V = 25 V, V = 0 V C 4,40 nF vj CE GE ies Input capacitance Rckwirkungskapazitt f = 1 MHz, Tvj = 25C, VCE = 25 V, VGE = 0 V Cres 0,235 nF Reverse transfer capacitance Kollektor-Emitter-Reststrom V = 1200 V, V = 0 V, T = 25C I 1,0 mA CE GE vj CES Collector-emitter cut-off current Gate-Emitter-Reststrom V = 0 V, V = 20 V, T = 25C I 100 nA CE GE vj GES Gate-emitter leakage current Einschaltverzgerungszeit, induktive Last IC = 30 A, VCE = 400 V Tvj = 25C 0,03 s t d on Turn-on delay time, inductive load V = 15 V T = 125C 0,03 s GE vj RGon = 6,8 Tvj = 150C 0,03 s Anstiegszeit, induktive Last IC = 30 A, VCE = 400 V Tvj = 25C 0,01 s t r Rise time, inductive load V = 15 V T = 125C 0,012 s GE vj RGon = 6,8 Tvj = 150C 0,012 s Abschaltverzgerungszeit, induktive Last IC = 30 A, VCE = 400 V Tvj = 25C 0,25 s t d off Turn-off delay time, inductive load V = 15 V T = 125C 0,32 s GE vj RGoff = 6,8 Tvj = 150C 0,34 s Fallzeit, induktive Last IC = 30 A, VCE = 400 V Tvj = 25C 0,025 s t f Fall time, inductive load V = 15 V T = 125C 0,04 s GE vj RGoff = 6,8 Tvj = 150C 0,045 s Einschaltverlustenergie pro Puls IC = 30 A, VCE = 400 V, LS = 40 nH Tvj = 25C 0,40 mJ Turn-on energy loss per pulse V = 15 V, di/dt = 2600 A/s (T = 150C) T = 125C E 0,60 mJ GE vj vj on RGon = 6,8 Tvj = 150C 0,70 mJ Abschaltverlustenergie pro Puls IC = 30 A, VCE = 400 V, LS = 40 nH Tvj = 25C 1,05 mJ Turn-off energy loss per pulse V = 15 V, du/dt = 2400 V/s (T = 150C) T = 125C E 1,60 mJ GE vj vj off RGoff = 6,8 Tvj = 150C 1,75 mJ Kurzschluverhalten VGE 15 V, VCC = 800 V I SC SC data V = V -L di/dt t 10 s, T = 150C 270 A CEmax CES sCE P vj Wrmewiderstand, Chip bis Gehuse pro IGBT / per IGBT R 0,500 0,550 K/W thJC Thermal resistance, junction to case prepared by: CM date of publication: 2015-08-26 approved by: AKDA revision: V2.0 2

Tariff Desc

8541.21.00 16 No - - With a dissipation rate of less than 1 W Free

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