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FF300R12KT3P_E

FF300R12KT3P_E electronic component of Infineon
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Part No. FF300R12KT3P_E
Manufacturer: Infineon
Category: IGBT Modules
Description: IGBT Modules MEDIUM POWER 62MM
Datasheet: FF300R12KT3P_E Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

8: USD 243.15 ea
Line Total: USD 1945.2

0 - Global Stock
MOQ: 8  Multiples: 8
Pack Size: 8
Availability Price Quantity
0 - WHS 1


Ships to you between Wed. 05 Jun to Fri. 07 Jun

MOQ : 8
Multiples : 8
8 : USD 248.28
104 : USD 236.064
504 : USD 233.616
10000 : USD 233.616

     
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Product
Configuration
Collector- Emitter Voltage VCEO Max
Collector-Emitter Saturation Voltage
Continuous Collector Current at 25 C
Gate-Emitter Leakage Current
Maximum Operating Temperature
Minimum Operating Temperature
Packaging
Pd - Power Dissipation
Package / Case
Technology
Brand
Mounting Style
Maximum Gate Emitter Voltage
Product Type
Factory Pack Quantity :
Subcategory
Cnhts
Hts Code
Mxhts
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Technische Information / Technical Information IGBT-Modul FF300R12KT3P E IGBT-Module 62mm C-Serien Modul mit Trench/Feldstopp IGBT3 und Emitter Controlled HE Diode und bereits aufgetragenem Thermal Interface Material 62mm C-Series module with Trench/Fieldstop IGBT3 and Emitter Controlled HE diode and pre-applied Thermal Interface Material Vorlufige Daten / Preliminary Data V = 1200V CES I = 300A / I = 600A C nom CRM Typische Anwendungen Typical Applications Hochleistungsumrichter High power converters Motorantriebe Motor drives USV-Systeme UPS systems Windgeneratoren Wind turbines Elektrische Eigenschaften Electrical Features Niedrige Schaltverluste Low switching losses Sehr groe Robustheit Unbeatable robustness V CEsat mit positivem Temperaturkoeffizienten VCEsat with positive temperature coefficient Mechanische Eigenschaften Mechanical Features Gehuse mit CTI > 400 Package with CTI > 400 Groe Luft- und Kriechstrecken High creepage and clearance distances Hohe Leistungsdichte High power density Isolierte Bodenplatte Isolated base plate Standardgehuse Standard housing Thermisches Interface Material bereits Pre-applied Thermal Interface Material aufgetragen Module Label Code Barcode Code 128 Content of the Code Digit Module Serial Number 1 - 5 Module Material Number 6 - 11 Production Order Number 12 - 19 DMX - Code Datecode (Production Year) 20 - 21 Datecode (Production Week) 22 - 23 prepared by: AKB date of publication: 2016-04-25 approved by: MK revision: V2.1 1Technische Information / Technical Information IGBT-Modul FF300R12KT3P E IGBT-Module Vorlufige Daten Preliminary Data IGBT,Wechselrichter / IGBT,Inverter Hchstzulssige Werte / Maximum Rated Values Kollektor-Emitter-Sperrspannung T = 25C V 1200 V vj CES Collector-emitter voltage Kollektor-Dauergleichstrom T = 65C, T = 150C I 300 A H vj max C nom Continuous DC collector current Periodischer Kollektor-Spitzenstrom t = 1 ms I 600 A P CRM Repetitive peak collector current Gate-Emitter-Spitzenspannung V +/-20 V GES Gate-emitter peak voltage Charakteristische Werte / Characteristic Values min. typ. max. Kollektor-Emitter-Sttigungsspannung I = 300 A, V = 15 V T = 25C 1,70 2,15 V C GE vj VCE sat Collector-emitter saturation voltage I = 300 A, V = 15 V T = 125C 1,90 V C GE vj Gate-Schwellenspannung I = 12,0 mA, V = V , T = 25C V 5,00 5,80 6,50 V C CE GE vj GEth Gate threshold voltage Gateladung VGE = -15 V ... +15 V QG 2,80 C Gate charge Interner Gatewiderstand T = 25C R 2,5 vj Gint Internal gate resistor Eingangskapazitt f = 1 MHz, Tvj = 25C, VCE = 25 V, VGE = 0 V Cies 21,0 nF Input capacitance Rckwirkungskapazitt f = 1 MHz, T = 25C, V = 25 V, V = 0 V C 0,85 nF vj CE GE res Reverse transfer capacitance Kollektor-Emitter-Reststrom VCE = 1200 V, VGE = 0 V, Tvj = 25C ICES 5,0 mA Collector-emitter cut-off current Gate-Emitter-Reststrom V = 0 V, V = 20 V, T = 25C I 400 nA CE GE vj GES Gate-emitter leakage current Einschaltverzgerungszeit, induktive Last I = 300 A, V = 600 V T = 25C 0,16 s C CE vj t d on Turn-on delay time, inductive load VGE = 15 V Tvj = 125C 0,17 s R = 2,4 Gon Anstiegszeit, induktive Last I = 300 A, V = 600 V T = 25C 0,04 s C CE vj t r Rise time, inductive load VGE = 15 V Tvj = 125C 0,045 s R = 2,4 Gon Abschaltverzgerungszeit, induktive Last I = 300 A, V = 600 V T = 25C 0,45 s C CE vj t d off Turn-off delay time, inductive load VGE = 15 V Tvj = 125C 0,52 s R = 2,4 Goff Fallzeit, induktive Last I = 300 A, V = 600 V T = 25C 0,10 s C CE vj t f Fall time, inductive load VGE = 15 V Tvj = 125C 0,16 s R = 2,4 Goff Einschaltverlustenergie pro Puls I = 300 A, V = 600 V, L = 30 nH T = 25C 16,5 mJ C CE S vj Turn-on energy loss per pulse VGE = 15 V, di/dt = 6000 A/s Tvj = 125C Eon 25,0 mJ R = 2,4 Gon Abschaltverlustenergie pro Puls I = 300 A, V = 600 V, L = 30 nH T = 25C 24,5 mJ C CE S vj Turn-off energy loss per pulse VGE = 15 V, du/dt = 4500 V/s Tvj = 125C Eoff 37,0 mJ R = 2,4 Goff Kurzschluverhalten V 15 V, V = 900 V GE CC ISC SC data VCEmax = VCES -LsCE di/dt tP 10 s, Tvj = 125C 1200 A Wrmewiderstand, Chip bis Khlkrper pro IGBT / per IGBT R 0,116 K/W thJH Thermal resistance, junction to heatsink valid with IFX pre-applied thermal interface material Temperatur im Schaltbetrieb T -40 125 C vj op Temperature under switching conditions prepared by: AKB date of publication: 2016-04-25 approved by: MK revision: V2.1 2

Tariff Desc

8541.21.00 16 No - - With a dissipation rate of less than 1 W Free

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