Product Information

GET56NGBB22GTE

GET56NGBB22GTE electronic component of Infineon

Datasheet
MPU AMD Radeon HD 6310 40nm 1.6GHz FCBGA

Manufacturer: Infineon
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

5001: USD 59.5798 ea
Line Total: USD 297958.58

0 - Global Stock
MOQ: 5001  Multiples: 5001
Pack Size: 5001
Availability Price Quantity
0 - WHS 1


Ships to you between Fri. 24 May to Thu. 30 May

MOQ : 5001
Multiples : 5001

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GET56NGBB22GTE
Infineon

5001 : USD 59.5798

     
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Mounting
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Rad Hardened
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A M D E M B E D D E D S O LU T I O N S : Product Selection Guide AMD Embedded: The Next Generation of Embedded Computing AMDs unique processor designs help deliver high performance AMD helps deliver the right balance of CPU, GPU and chipset and balanced system design. capabilities, to give designers the solutions they need to create the AMDs range of embedded solutions provides efl xible features next generation of embedded applications. Along with a broad range and a balanced performance approach for the overall system. of varied solutions, AMD supports the x86 embedded marketplace with design tools and technology partnerships that offer simplicity FEATURES INCLUDE 2 and efl xibility to help create high-performance, feature-rich, and > I ntegrated low power processor and GPU customer-driven products. AMD has long been a leader in innovation > I ndustry-leading performance-per-watt with its continued focus on improving both x86 processor and > N ative eight-core processor design provides highly scalable graphics processor designs. AMDs embedded products offer performance gains within a consistent thermal envelope designers a balanced foundation for overall system performance > Lead-free, four-layer processes with maximum on-board space with the quick time-to-market typically offered by commercial off-the-shelf components. AMD embedded solutions give designers > Efcfi ient heat dissipation reduces or eliminates the need ample efl xibility to design scalable, x86-based, cost-efcfi ient and for heat sinks and reduces ambient cooling requirements feature-rich products, and help drive energy conservation into their > Range of available packaging and pin counts meets systems without compromising application performance or variety of design requirements compatibility, graphics performance or features. AMD technology- Along with these and other technical features, embedded designers based products are leading edge from enterprise-class servers and can enjoy long-term component availability, comprehensive design consumer systems to traditional embedded markets. support, and AMDs commitment to continue offering new, customer- oriented products. This brochure presents the full array of AMDs embedded solutions that help deliver maximum performance with low overall system Tools and support for developers power consumption and are supported by longer than standard 1 AMD offers: availability , a full library of x86 software development applications, and hardware tools. Its time to design and produce the next- > A full range of RDK (Reference Design Kit) products designed to generation embedded systems your customers demand quickly, enable designers to go from concept to nfi ished product quickly easily, and efcfi iently. > A broad array of development boards for creating efcfi ient x86 system designs > I ndustry collaborations with leading software and hardware specialists, fostering maximum choice for your unique design Get to market faster with superior products Ready to create high-performance, low-power embedded designs that give your innovative new products an edge in the marketplace Experience the AMD advantage. Note 1: Most models support a planned 5 year availability from Product Release. See AES Product Roadmap: Backup - Product Longevity & Features document for last time buy schedules on specific products. Note 2: On some modelsThe AMD Fusion Family of Accelerated Processing Units (APU) AMD Geode LX processors: optimized for low-power, AMD Fusion is a new approach to processor design and software high-performance applications development, delivering powerful CPU and GPU capabilities for HD, AMD Geode LX processors are congfi ured to deliver developers a 3D and data-intensive workloads in a single-die processor called an versatile and efl xible suite of x86 solutions that enable fast design APU. APUs combine high-performance serial and parallel processing cycles and short time-to-market roadmaps. Ideal for applications cores with other special-purpose hardware accelerators, enabling ranging from thin-client and set-top boxes to point-of-sale devices breakthroughs in visual computing, security, performance-per-watt and kiosks. AMD has also introduced technology that allows the and device form factor. The rfi st introduction of this technology for AMD Geode LX family to use DDR2 memory modules in an existing embedded applications is the new AMD Embedded G-Series Family design. With a minor change in the memory voltage and an updated of APUs, targeted at delivering the ideal combination of price, power BIOS, a current AMD Geode LX processor based design can use a and performance for applications such as integrated digital signage, DDR2 memory module from AStint which helps ensure memory x86 set-top-box (xSTB), IP-TV, Thin Client, Point-of-Sale, longevity and results in system level power efcfi iency. In addition to Infotainment, and Casino Gaming markets. processors, the family includes a broad range of design tools including Development Boards (DBs) and Reference Design Kits The AMD64 embedded family: leading-edge technology (RDKs) to empower designers to make maximum use of the for high-end embedded systems established world of x86 software applications. AMD64 embedded solutions are each uniquely matched to a denfi ed set of product applications. These solutions include The AMD Radeon embedded graphics family: game-changing high-performance dual-, quad-, six- and eight-core AMD Opteron graphics for embedded systems. processors and dual-core AMD Turion II Neo processors with AMD Radeon graphics for embedded applications are designed to Direct Connect Architecture for enterprise-class telecom, networking deliver exciting, desktop-level visual experiences to embedded and storage equipment. The ASB1 (BGA) family of processors are systems. Built with advanced 3D graphics engines supporting designed with unique computing features and a thin, compact form Microsoft DirectX and OpenGL graphics APIs, AMD graphics factor to help enable new and uncompromising designs. The ASB2 solutions enable market-leading, rich, immersive images. processors are the second generation BGA platform, featuring the Outstanding multimedia capabilities are supported by an integrated AMD Turion II Neo dual-core processors coupled with the AMD multi-standard video decoder delivering enhanced video quality from 785E chipset, are designed to deliver exceptional performance while MPEG-2, H.264 or VC-1 video streams. The ultimate in display maintaining low average solution power draw with greater levels of efl xibility is provided by dual display controllers driving high-resolution performance and power efcfi iency over the previous generation displays through VGA, DVI, DisplayPort or HDMI interfaces. AMD ASB1 (BGA) processor family. graphics solutions are designed to perform, engineered to lead and built to win. With a product portfolio including AMD chipsets, discrete The AMD64 solutions are each uniquely equipped to provide the graphics processors, MXM modules and PC add-in boards, AMD processing needs for a large number of target markets. These provides system designers with exciting and innovative graphics solutions enable unique high-performance, smaller form factor solutions for their embedded systems. products, with maximum versatility, and minimum design challenge.

Tariff Desc

8542.31.00 52 No ..CMOS and MOS Microprocessors (MPU), Microcontrollers (MCU) and Digital Signal Processors (DSP)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits Digital.
CYP
Cypress
Cypress / Spansion
CYPRESS SEMI
Cypress Semicon
Cypress Semiconductor
Cypress Semiconductor Corp
INF
INFINEON
Infineon IR
INFINEON (CYPRESS)
Infineon (IRF)
Infineon / Cypress
Infineon / IR
INFINEON TECH ICs
Infineon Technologies
INFINEON TECHNOLOGIES AG
Infineon Technologies Americas Corp.
Infinite Power Solutions
INTERNATIONAL RECTIF
INTERNATIONAL RECTIFIER
International Rectifier HiRel Products
INTL RECTIFIER
IR
IRH
Ramtron
Ramtron / Cypress Semiconductor
Ramtron International Corp
SP9
SPANSION

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