S6J32GEKSMSE2000A Infineon

S6J32GEKSMSE2000A electronic component of Infineon
S6J32GEKSMSE2000A Infineon
S6J32GEKSMSE2000A ARM Microcontrollers - MCU
S6J32GEKSMSE2000A  Semiconductors
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X-On Electronics has gained recognition as a prominent supplier of S6J32GEKSMSE2000A ARM Microcontrollers - MCU across the USA, India, Europe, Australia, and various other global locations. S6J32GEKSMSE2000A ARM Microcontrollers - MCU are a product manufactured by Infineon. We provide cost-effective solutions for ARM Microcontrollers - MCU, ensuring timely deliveries around the world.

Part No. S6J32GEKSMSE2000A
Manufacturer: Infineon
Category: ARM Microcontrollers - MCU
Description: ARM Microcontrollers - MCU INTEGRATED CIRCUIT
Datasheet: S6J32GEKSMSE2000A Datasheet (PDF)
Price (USD)
360: USD 24.948 ea
Line Total: USD 8981.28 
Availability : 0
  
QtyUnit Price
360$ 24.948

Availability 0
Ship by Tue. 26 Aug to Thu. 28 Aug
MOQ : 360
Multiples : 360
QtyUnit Price
360$ 24.948

   
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We are delighted to provide the S6J32GEKSMSE2000A from our ARM Microcontrollers - MCU category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the S6J32GEKSMSE2000A and other electronic components in the ARM Microcontrollers - MCU category and beyond.

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S6J32E, S6J32F, S6J32G Series 32-bit Microcontroller Traveo Datasheet The S6J32E, S6J32F, and S6J32G series is an extension of the existing S6J3200 series with 4-MB Flash, 512-KB RAM, and Ethernet RMII support. The S6J3200 series microcontrollers are members of the 55-nm Traveo family targeting Cluster and Head-Up Display (HUD). They are built as a single-chip solution to drive a complete mid-range instrument cluster. They can control up to six gauges and drive up to two Thin Film Transistor (TFT) displays with WVGA resolution (854 480 pixels each). For connecting a HUD, one display output can be warped on-the-fly for the necessary correction of the windshield bulge. A powerful 2.5D graphics engine enables the device to be used for many mid-range graphics applications. Features Optional embedded Secure Hardware Extension (SHE) with Key Features AES-128 encryption and decryption 240-MHz Arm Cortex R5F CPU Flash memory retention time up to 20 years 4-MB internal high-speed Flash memory, 512-KB RAM ASIL-B support on ISO26262 specification Supports 2.7 V to 5.5 V and 2.7 V to 3.6 V I/O supply voltage 216-pin and 208-pin TEQFP packages 1.2-V core power supply Power domain control 50-channel 12-bit SAR A/D converter with 1-Msps conversion rate Applications Embedded 4-channel CAN FD controller Automotive cluster application 12-channel Multi-Function Serial (MFS) communication block Classic Cluster Control Optional Ethernet AVB with MII and RMII interface Head-Up Display Two-channel DDR HSSPI Optional HyperBus interface Optional Media-LB (MOST25) interface Six-channel Stepper Motor Controller Enhanced sound function for high quality 2D/2.5D graphics subsystem with video capture, 2-MB VRAM, dual-display support, on-the-fly-warping Cypress Semiconductor Corporation 198 Champion Court San Jose, CA 95134-1709 408-943-2600 Document Number: 002-10689 Rev *J Revised August 29, 2018 S6J32E, S6J32F, S6J32G Series Table of Contents 1. Overview ............................................................................. 3 8.4.3 Internal Clock Timing .................................................... 76 1.1 Microcontroller Support Information ................................ 3 8.4.4 Reference Voltages for AC Characteristics of I/O Cells 1.2 Related Documents ........................................................ 3 ..................................................................................... 80 2. Function List ...................................................................... 4 8.4.5 Reset ............................................................................ 81 2.1 Function List Table .......................................................... 4 8.4.6 Power-On Conditions ................................................... 82 2.2 Optional Function ............................................................ 6 8.4.7 Multi-Function Serial ..................................................... 85 2.2.1 Basic Option .................................................................... 6 8.4.8 Timer Input ................................................................. 107 2.2.2 ID .................................................................................... 8 8.4.9 Trigger Input ............................................................... 108 2.2.3 Restriction ....................................................................... 9 8.4.10 NMI Input .................................................................... 109 3. Product Description ......................................................... 11 8.4.11 Low-Voltage Detection ............................................... 109 3.1 Overview ....................................................................... 11 8.4.12 High Current Output Slew Rate .................................. 115 3.2 Product Description ....................................................... 11 8.4.13 Display Controller ....................................................... 116 3.2.1 Ethernet ........................................................................ 16 8.4.14 Video Capture ............................................................ 119 3.2.2 RAM Guarantee ............................................................ 18 8.4.15 FPD-Link (LVDS) ........................................................ 120 4. Package and Pin Assignment ......................................... 19 8.4.16 DDR-HSSPI ............................................................... 124 4.1 Pin Assignment ............................................................. 19 8.4.17 HyperBus ................................................................... 128 4.1.1 TEQFP-208 ................................................................... 20 8.4.18 Ethernet AVB.............................................................. 132 4.1.2 TEQFP-216 ................................................................... 21 8.4.19 MediaLB ..................................................................... 135 4.2 Package Dimensions .................................................... 22 8.4.20 QPRC ......................................................................... 136 4.2.1 TEQFP-208 ................................................................... 22 8.4.21 Port Noise Filter.......................................................... 139 4.2.2 TEQFP-216 ................................................................... 23 8.4.22 JTAG .......................................................................... 140 5. I/O Circuit Type................................................................. 24 8.4.23 I2S .............................................................................. 141 5.1 I/O Circuit Type ............................................................. 24 8.5 A/D Converter............................................................. 143 6. Port Description ............................................................... 31 8.5.1 Electrical Characteristics ............................................ 143 6.1 Port Description List ...................................................... 31 8.5.2 Notes on A/D Converters ........................................... 145 6.2 Remarks........................................................................ 51 8.5.3 Glossary ..................................................................... 145 7. Precautions and Handling Devices ................................ 51 8.5.4 Calibration Condition .................................................. 145 7.1 Handling Precautions .................................................... 51 8.6 Audio DAC ................................................................. 148 7.1.1 Precautions for Product Design .................................... 51 8.6.1 Electrical Characteristics ............................................ 148 7.1.2 Precautions for Package Mounting ............................... 52 8.7 Flash Memory............................................................. 151 7.1.3 Precautions for Use Environment ................................. 53 8.7.1 Electrical Characteristics ............................................ 151 7.2 Handling Devices .......................................................... 54 8.7.2 Notes .......................................................................... 151 8. Electrical Characteristics ................................................ 56 9. Abbreviation .................................................................. 152 8.1 Absolute Maximum Rating ............................................ 56 10. Ordering Information..................................................... 154 8.2 Operation Assurance Condition .................................... 60 11. Errata .............................................................................. 155 8.3 DC Characteristics ........................................................ 65 12. Appendix ........................................................................ 158 8.3.1 Port Function Characteristics ........................................ 65 12.1 Application 1: JTAG Tool Connection ......................... 158 8.3.2 Power Supply Current ................................................... 71 13. Document History ......................................................... 159 8.4 AC Characteristics ........................................................ 75 Sales, Solutions, and Legal Information ........................... 167 8.4.1 Source Clock Timing ..................................................... 75 8.4.2 Sub Clock Timing .......................................................... 76 Document Number: 002-10689 Rev *J Page 2 of 167

Tariff Desc

8542.31.00 52 No ..CMOS and MOS Microprocessors (MPU), Microcontrollers (MCU) and Digital Signal Processors (DSP)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits Digital.
Cypress
Cypress / Spansion
CYPRESS SEMI
Cypress Semicon
Cypress Semiconductor
Cypress Semiconductor Corp
INF
INFINEON
Infineon IR
INFINEON (CYPRESS)
Infineon (IRF)
Infineon / Cypress
Infineon / IR
INFINEON TECH ICs
Infineon Technologies
INFINEON TECHNOLOGIES AG
Infineon Technologies Americas Corp.
Infinite Power Solutions
INTERNATIONAL RECTIF
INTERNATIONAL RECTIFIER
International Rectifier HiRel Products
INTL RECTIFIER
IR
IRH
Ramtron
Ramtron / Cypress Semiconductor
Ramtron International Corp
SP9
SPANSION
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