SMTBJ200A Littelfuse

SMTBJ SiBOD series FEATURES 2.16 2.74 2.16 Bi-directional transient voltage protection Glass passivated junction Nano second clamping response 2.26 Surge capability up to 250 (Amps) No performance degradation under service life Solder Pads Industry standard DO-2144AA Jedec outline All dimensions in mm Available on tape (12mm) UL recognised MECHANICAL CHARACTERISTICS Transfer molded, void free epoxy body Terminals: modified J bend for large contact area Tin/Lead plated leads Maximum case temperature for soldering purposes: 230C for 10 seconds Standard packaging: 12mm tape (meets EIA 481-1) Device marking, device code, logo 2.0 3.30/3.94 5.21/5.59 4.06/4.57 2.18/2.44 SEATING PLANE .102 .203 0.76/1.27 www.littelfuse.com 59 B A SMTBJ SiBOD series ELECTRICAL CHARACTERISTICS 25C Tamb SYMBOL PARAMETER IRM Stand-off current Stand-off voltage VRM Breakdown voltage IBO Breakover current VBR Breakover voltage IH Holding current VBO On-state voltage VT ABSOLUTE RATINGS SYMBOL PARAMETER VALUE Type A Type B Ipp Peak Pulse Current 10/1000 sec 50 100 A 8-20 s expo A 150 250 Itsm Non-repetitive surge peak on-state current tp20 ms 30 A A/s di/dt Critical rate of rise of on-state current Non-repetitive 100 T stg Storage and operating junction temperature range C -40 to +150 Tj 150 C C TL Maximum temperature for soldering 230 (For period of 10 seconds max) Device Vrm Irm Vbr Vbo Vt Ibo Ih Type Vrm MIN MAX TYP TYP MIN (A) 1A (mA) (mA) SMTBJ050 A or B 50 1 60 80 <2V 50 150 SMTBJ070 A or B 70 1 80 120 <2V 50 150 SMTBJ100 A or B 100 1 110 135 <2V 50 150 SMTBJ120 A or B 120 1 140 165 <2V 50 150 SMTBJ170 A or B 170 1 180 215 <2V 50 150 SMTBJ200 A or B 200 1 220 265 <2V 50 150 All parameters are tested using Fet Test Model 3600. www.littelfuse.com 60