Product Information

550

550 electronic component of MG Chemicals

Datasheet
Proto Board Copper Clad FR4, Double Sided, 1 oz. 6.00" x 6.00" (152.4mm x 152.4mm)

Manufacturer: MG Chemicals
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 13.0065 ea
Line Total: USD 13.0065

72 - Global Stock
Ships to you between
Thu. 11 Apr to Mon. 15 Apr
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
72 - Global Stock


Ships to you between Thu. 11 Apr to Mon. 15 Apr

MOQ : 1
Multiples : 1

Stock Image

550
MG Chemicals

1 : USD 13.0065
50 : USD 12.8915
100 : USD 11.822
250 : USD 11.247
500 : USD 11.086
1000 : USD 10.925

     
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RoHS - XON
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Copper Clad Boards 500 Series Technical Data Sheet 500 Series Description The 500 Series Copper Clad Boards are made of a laminate consisting of continuous woven glass cloth impregnated with epoxy resin. The boards are made of FR4 which is a flame retardant version of G-10 material. Applications & Usages The boards are ideal for prototyping and small production runs. It is used by PCB manufacturers, design engineers, hobbyists, and students. Benefits and Features Complies with UL (file number E214381) and IPC-4101C/21 DICY (dicyandiamide) Cured System Easy to cut with no specialized equipment required UV blocking Available in 1 oz (1.37 mil, 35 m) and oz (0.67 mil, 17 m) copper cladding Comes in 1/16 (1.60 mm) and 1/32 (0.80 mm) laminate thicknesses Properties Physical Properties Method Specification Value Moisture Absorption IPC-TM-650 2.6.2.1 <0.80% 0.25% Flammability UL-94 94V-0 V0 Thermal Properties Method Specification Value Glass Transition Temperature (T ) IPC-TM-650 2.4.25 >110 140 C g CTE prior Tg, z-axis IPC-TM-650 2.4.24 50 ppm/C CTE after Tg, z-axis 250 ppm/C Total Expansion (50-260 C), z-axis 3.75% Time to Delamination T260 IPC-TM-650 2.4.24.1 20 min Time to Delamination T288 2 min Thermal Degradation via TGA ASTM D 3850 310 C Thermal Stress 288 C IPC-TM-650 2.4.13.1 >10 s 300 s UL 94 Maximum Operating Temp. (MOT) 130 C Page 1 of 4 Date: 16 March 2017 / Ver. 2.01 Copper Clad Boards 500 Series Technical Data Sheet 500 Series Electrical Properties Method Specification Value Volume Resistivity 6 8 After Moisture Resistance IPC-TM-650 2.5.17.1 >1 x 10 mcm 5 x 10 mcm Surface Resistivity 4 7 After Moisture Resistance >1 x 10 mcm 5 x 10 m Dielectric Constant 1 GHz IPC-TM-650 2.5.5.9 <5.4 4.2 Dissipation Factor 1 GHz >0.035 0.015 Dielectric Strength IPC-TM-650 2.5.6.2 >762 V/mil 1 2001 400 V/mil Dielectric Breakdown IPC-TM-650 2.5.6 >40 kV 60 kV Comparative Tracking Index (CTI) ASTM D 3638 Grade 3, 175250 V Arc Resistance IPC-TM-650 2.5.1 >60 s 240 s Mechanical Properties Method Specification Value Peel Strength (1 oz) As received IPC-TM-650 2.4.8 10-12 lb/in After thermal stress >6 lb/in 9-12 lb/in Flexural Strength Warp IPC-TM-650 2.4.4 >415 MPa 600 MPa Fill >345 MPa 500 MPa Note: Data shown are typical values for reference only. Storage Store at around room temperature 18 to 27 C 65 to 80 F and protect from direct heat or sunlight. Keep sealed in an air tight container, away from humidity. Health and Safety Please see the 500 Series Copper Clad Boards Safety Data Sheet (SDS) for more details on transportation, storage, handling and other security guidelines. Environmental Impact: This product doesnt have any known environmental toxicity. This product meets the European Directive 2011/65/EU Annex II (ROHS) recasting 2002/95/EC. Health and Safety: This product is not considered to be hazardous for human health under normal use. It is widely used in the packing and food industry. Page 2 of 4 Date: 16 March 2017 / Ver. 2.01

Tariff Desc

8514.30.10 30 No --- Of a kind used solely or principally for the manufacture of printed circuits or printed circuit assemblies
M.G. CHEMICAL
MG Chemical
MG Chemicals
MG Chemicals.

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