Product Information

ATMEGA329PV-10MN

ATMEGA329PV-10MN electronic component of Microchip

Datasheet
8-bit Microcontrollers - MCU AVR 32K FLSH 2K SRAM 1KB EE-10 MHZ 105C

Manufacturer: Microchip
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Price (USD)

61: USD 5.1935 ea
Line Total: USD 316.8

0 - Global Stock
MOQ: 61  Multiples: 1
Pack Size: 1
Availability Price Quantity
0 - WHS 1


Ships to you between Fri. 17 May to Thu. 23 May

MOQ : 260
Multiples : 1
260 : USD 7.38

0 - WHS 2


Ships to you between Fri. 17 May to Thu. 23 May

MOQ : 260
Multiples : 260
260 : USD 13.4703

0 - WHS 3


Ships to you between Fri. 17 May to Thu. 23 May

MOQ : 61
Multiples : 1
61 : USD 5.1935

0 - WHS 4


Ships to you between Thu. 23 May to Mon. 27 May

MOQ : 1
Multiples : 1
1 : USD 8.348
25 : USD 7.1844
100 : USD 6.7342

0 - WHS 5


Ships to you between Fri. 17 May to Thu. 23 May

MOQ : 1
Multiples : 1
1 : USD 9.702
2 : USD 8.2365
5 : USD 8.2229
6 : USD 7.7751

     
Manufacturer
Product Category
Interface
Integrated Circuit Features
Case
Mounting
Family
Type Of Integrated Circuit
Number Of Pwm Channels
Sram Memory Capacity
Eeprom Memory Capacity
Number Of 10Bit A/D Converters
Number Of Comparators
Number Of 8Bit Timers
Number Of 16Bit Timers
Flash Memory Capacity
Operating Frequency
Number Of External Interrupts
Number Of Output Compare Channels
Number Of Input Capture Channels
Operating Temperature
Supply Voltage
Number Of Capacitive Channels
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Features High Performance, Low Power Atmel AVR 8-Bit Microcontroller Advanced RISC Architecture 130 Powerful Instructions Most Single Clock Cycle Execution 32 x 8 General Purpose Working Registers Fully Static Operation Up to 20MIPS Throughput at 20MHz (ATmega329P/3290P) On-Chip 2-cycle Multiplier High Endurance Non-volatile Memory segments In-System Self-programmable Flash Program Memory 32KBytes (ATmega329P/ATmega3290P) EEPROM 1Kbytes (ATmega329P/ATmega3290P) Internal SRAM 8-bit Atmel 2Kbytes (ATmega329P/ATmega3290P) Write/Erase cyles: 10,000 Flash/100,000 EEPROM (1) Data retention: 20 years at 85C/100 years at 25C Microcontroller Optional Boot Code Section with Independent Lock Bits In-System Programming by On-chip Boot Program True Read-While-Write Operation with 32KBytes Programming Lock for Software Security JTAG (IEEE std. 1149.1 compliant) Interface Boundary-scan Capabilities According to the JTAG Standard In-System Extensive On-chip Debug Support Programming of Flash, EEPROM, Fuses, and Lock Bits through the JTAG Interface Peripheral Features Programmable 4 x 25 Segment LCD Driver (ATmega329P) 4 x 40 Segment LCD Driver (ATmega3290P) Two 8-bit Timer/Counters with Separate Prescaler and Compare Mode Flash One 16-bit Timer/Counter with Separate Prescaler, Compare Mode, and Capture Mode Real Time Counter with Separate Oscillator Four PWM Channels 8-channel, 10-bit ADC Programmable Serial USART Master/Slave SPI Serial Interface ATmega329P Universal Serial Interface with Start Condition Detector Programmable Watchdog Timer with Separate On-chip Oscillator On-chip Analog Comparator ATmega3290P Interrupt and Wake-up on Pin Change Special Microcontroller Features Power-on Reset and Programmable Brown-out Detection Internal Calibrated Oscillator External and Internal Interrupt Sources Preliminary Five Sleep Modes: Idle, ADC Noise Reduction, Power-save, Power-down, and Standby I/O and Packages 54/69 Programmable I/O Lines 64/100-lead TQFP, 64-pad QFN/MLF Speed Grade: ATmega329P/ATmega3290P: 0 - 16MHz 1.8 - 5.5V, 0 - 20MHz 2.7 - 5.5V Temperature range: -40C to 85C Industrial Ultra-Low Power Consumption Active Mode: 420A at 1MHz, 1.8V Power-down Mode: 40nA at 1.8V Power-save Mode: 750nA at 1.8V Atmel-8021HAVR-ATmega329P- 3290P Datasheet 07/2015ATmega329P/3290P 1. Pin Configurations Figure 1-1. MLF/ Pinout ATmega329P LCDCAP 1 PA3 (COM3) 48 (RXD/PCINT0) PE0 2 PA4 (SEG0) 47 INDEX CORNER (TXD/PCINT1) PE1 PA5 (SEG1) 3 46 PA6 (SEG2) (XCK/AIN0/PCINT2) PE2 4 45 (AIN1/PCINT3) PE3 5 PA7 (SEG3) 44 (USCK/SCL/PCINT4) PE4 6 43 PG2 (SEG4) (DI/SDA/PCINT5) PE5 7 42 PC7 (SEG5) (DO/PCINT6) PE6 8 41 PC6 (SEG6) (CLKO/PCINT7) PE7 9 40 PC5 (SEG7) (SS/PCINT8) PB0 10 39 PC4 (SEG8) (SCK/PCINT9) PB1 11 PC3 (SEG9) 38 PC2 (SEG10) (MOSI/PCINT10) PB2 12 37 (MISO/PCINT11) PB3 13 PC1 (SEG11) 36 PC0 (SEG12) (OC0A/PCINT12) PB4 14 35 (OC1A/PCINT13) PB5 15 34 PG1 (SEG13) (OC1B/PCINT14) PB6 16 33 PG0 (SEG14) Note: The large center pad underneath the QFN/MLF packages is made of metal and internally connected to GND. It should be sol- dered or glued to the board to ensure good mechanical stability. If the center pad is left unconnected, the package might loosen from the board. 2 8021HAVR07/2015 17 64 (OC2A/PCINT15) PB7 AVCC 18 63 (T1/SEG24) PG3 GND 19 62 AREF (T0/SEG23) PG4 RESET/PG5 20 PF0 (ADC0) 61 21 60 PF1 (ADC1) VCC GND 22 PF2 (ADC2) 59 23 PF3 (ADC3) (TOSC2) XTAL2 58 (TOSC1) XTAL1 24 PF4 (ADC4/TCK) 57 (ICP1/SEG22) PD0 25 PF5 (ADC5/TMS) 56 26 (INT0/SEG21) PD1 PF6 (ADC6/TDO) 55 27 PF7 (ADC7/TDI) (SEG20) PD2 54 (SEG19) PD3 28 GND 53 (SEG18) PD4 52 29 VCC (SEG17) PD5 51 PA0 (COM0) 30 (SEG16) PD6 50 PA1 (COM1) 31 (SEG15) PD7 32 49 PA2 (COM2)

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8542.31.00 52 No ..CMOS and MOS Microprocessors (MPU), Microcontrollers (MCU) and Digital Signal Processors (DSP)

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