NTE5671 NTE

NTE5671 TRIAC 800V , 20A RM TO220 Full Pack Description: The NTE5671 TRIAC is designed for use in applications requiring high bidirectional transient and blocking voltage capability. Typical applications include AC power control circuits such as lighting, in- dustrial and domestic heating, motor control and switching systems.. Absolute Maximum Ratings: Non Repetitive Peak OffState Voltage (Either Direction, t 10ms), V . . . . . . . . . . . . . . . . 800V DSM Repetitive Peak OffState Voltage (Either Direction, 0.01), V . . . . . . . . . . . . . . . . . . . . . 800V DRM Crest Working OffState Voltage (Either Direction), V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400V DWM RMS OnState Current (Conduction Angle 360 , T = +67C), I . . . . . . . . . . . . . . . . . . . . 16A H T(RMS) Repetitive Peak On State Current, I . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 140A TRM Non Repetitive Peak On State Current, I TSM (T = +120C Prior to Surge, t = 20ms, Full Sine Wave) . . . . . . . . . . . . . . . . . . . . . . . . . . 140A J 2 2 2 I t for Fusing (t = 10ms), I t . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95A s Rate of Rise of On State Current After Triggering, dI /dt T (I = 200mA to I = 20A, dI dt = 0.2A/s) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30A/ s G T G Average Power Dissipation (Averaged Over any 20ms Period), P . . . . . . . . . . . . . . . . . . . 0.5W G(AV) Peak Power Dissipation, P . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.0W GM RMS Isolation Voltage (From All Three Terminals to External Heatsink Peak ), V . . . . . . 1000V (ISO) Isolation Capacitance (From T to External Heatsink), C . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12pF 2 (ISO) Full Operating Temperature, T . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +120 C J Storage Temperature Range, T . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 to +125C stg Typical Thermal Resistance, JunctiontoHeatsink (See Mounting Instructions), R thJH With Heatsink Compound . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.5K/W Without Heatsink Compound . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.5K/W Thermal Resistance, Junction toAmbient (Note 1), R . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55K/W thJA Note 1. Mounted on a printed circuit board at any lead length. The quoted value of R should be thJA used only when no leads of other dissipating components run to the same tie point.Electrical Characteristics: (T = +25 C, unless otherwise specified. Polarities, positive or negative, J are identified with respect to MT .) 1 Parameter Symbol Test Conditions Min Typ Max Unit OnState Voltage (Measured under pulse V I = 20A 1.6 V T T conditions to prevent excessive dissipation) Rate of Rise of OffState Voltage dV /dt T = +120C, Gate Open 100 V/ s D J (That will not trigger any device) Rate of Change of Commutating Voltage dV /dt dI /dt = 7.2A/ms, 10 V/ s com com (That will not trigger any device) I = 16A, T = 70 C, T(RMS) H V = 400V, Gate Open D OffState Current I V = 400V, T = +120C 0.5 mA D D J Gate Voltage (That will trigger all devices) V 1.5 V GT Gate Voltage (That will not trigger any device) MT (+), G (+) MT (), G () V V = 400V, T = +120C 250 mV 2 2 GD D J Gate Current (That will trigger all devices) MT (+), G (+) I G to MT 35 Ma 2 GT 1 MT (+), G () 35 mA 2 MT (), G () 35 mA 2 MT (), G (+) 70 mA 2 Holding Current I 30 mA H Latching Current MT (+), G (+) I V = 12V 40 Ma 2 L D MT (+), G () 60 mA 2 MT (), G () 40 mA 2 MT (), G (+) 60 mA 2 Mounting Instructions: 1. The TRIAC may be soldered directly into the circuit, but the maximum permissible temperature of the soldering iron or bath is +275 C it must not be in contact with the joint for more than 5 seconds. Soldered joints must be at least .185 (4.7mm) from the seal. 2. The leads should not be bent less than .094 (2.4mm) from the seal, and should be supported during bending. The leads can be bent, twisted or straightened by 90 maximum. The minimum bending radius is .039 (1mm). 3. Mounting by means of a spring clip (not provided by NTE) is the best mounting method because if offers good thermal contact under the crystal area and slightly lower R values than screw thJH mounting. However, if a screw is used, it should be an M3 crossrecess panhead. Care should be taken to avoid damage to the plastic body. 4. For good thermal contact, heatsink compound should be used between the seating plane and the heatsink. values of R given for mounting with heatsink compound refer to the use of a metallic thJH oxide loaded compound. Ordinary silicone grease is not recommended. 5. Rivit mounting is not recommended. 6. The heatsink must have a flatness in the mounting area of .0007 (.02mm) maximum per .393 (10mm). Mounting holes must be deburred.