Product Information

BAP50-04,215

BAP50-04,215 electronic component of NXP

Datasheet
NXP Semiconductors PIN Diodes PIN GP 50V 50MA

Manufacturer: NXP
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
N/A

Obsolete
Availability Price Quantity
0 - WHS 1

MOQ : 1
Multiples : 1
1 : USD 1.2427
10 : USD 0.5639
100 : USD 0.2796
500 : USD 0.2102
1000 : USD 0.1595
N/A

Obsolete
     
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Vr - Reverse Voltage
Maximum Diode Capacitance
Maximum Series Resistance @ Maximum IF
If - Forward Current
Vf - Forward Voltage
Minimum Operating Temperature
Maximum Operating Temperature
Mounting Style
Package / Case
Packaging
Configuration
Brand
Carrier Life
Maximum Series Resistance Minimum If
Pd - Power Dissipation
Factory Pack Quantity :
Height
Length
Width
Cnhts
Hts Code
Mxhts
Product Type
Subcategory
Taric
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BAP50-04 Silicon PIN diode Rev. 3.1 8 February 2019 Product data sheet 1 Product profile 1.1 General description Two planar PIN diodes in series configuration in an SOT23 small plastic SMD package. 1.2 Features and benefits Two elements in series configuration in a small-sized plastic SMD package Low diode capacitance Low diode forward resistance 1.3 Applications General RF applicationNXP Semiconductors BAP50-04 Silicon PIN diode 2 Pinning information Table 1.Discrete pinning Pin Description Simplified outline Graphic symbol 1 anode 3 3 2 cathode 1 2 3 common connection aaa-025249 1 2 Top view 3 Ordering information Table 2.Ordering information Type number Package Name Description Version BAP50-04 - plastic surface-mounted package 3 leads SOT23 4 Marking Table 3.Marking code Type number Marking code BAP50-04 4L% 5 Limiting values Table 4.Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit V reverse voltage - 50 V R I forward current - 50 mA F P total power dissipation T 90 C - 250 mW tot sp T storage temperature -65 +150 C stg T junction temperature -65 +150 C j 6 Thermal characteristics Table 5.Thermal characteristics Symbol Parameter Conditions Typ Unit R thermal resistance from 220 K/W th(j-sp) junction to solder point BAP50-04 All information provided in this document is subject to legal disclaimers. NXP B.V. 2019. All rights reserved. Product data sheet Rev. 3.1 8 February 2019 2 / 9

Tariff Desc

8542.31.00 51 No ..Application Specific (Digital) Integrated Circuits (ASIC)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:
FR9
Freescale
FREESCALE SEMI
Freescale Semicon
FREESCALE SEMICONDUC
Freescale Semiconductor
Freescale Semiconductor - NXP
NXP
NXP Freescale
NXP (FREESCALE)
NXP / Freescale
NXP SEMI
NXP Semicon
NXP SEMICONDUCTOR
NXP Semiconductors
NXP USA Inc.
PH3
PHI

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