Product Information

MRFE6VP61K25HR6

MRFE6VP61K25HR6 electronic component of NXP

Datasheet
Freescale Semiconductor RF MOSFET Transistors VHV6 1.25KW ISM NI1230H

Manufacturer: NXP
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 230.874 ea
Line Total: USD 230.87

390 - Global Stock
Ships to you between
Fri. 10 May to Tue. 14 May
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
185 - Warehouse 1


Ships to you between Fri. 10 May to Tue. 14 May

MOQ : 1
Multiples : 1
1 : USD 230.874
10 : USD 225.032
25 : USD 225.032
50 : USD 225.032
100 : USD 225.032
150 : USD 224.204
450 : USD 222.985
900 : USD 219.213
2400 : USD 218.132

     
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Transistor Polarity
Technology
Id - Continuous Drain Current
Vds - Drain-Source Breakdown Voltage
Operating Frequency
Gain
Output Power
Configuration
Pd - Power Dissipation
Maximum Operating Temperature
Mounting Style
Package / Case
Packaging
Vgs - Gate-Source Voltage
Series
Brand
Factory Pack Quantity :
Vgs - Gate-Source Breakdown Voltage
Vgs Th - Gate-Source Threshold Voltage
Type
Cnhts
Hts Code
Mxhts
Product Type
Subcategory
Taric
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DocumentNumber:MRFE6VP61K25H FreescaleSemiconductor Rev. 4.1, 3/2014 TechnicalData RFPowerLDMOSTransistors MRFE6VP61K25HR6 HighRuggedness N--Channel MRFE6VP61K25HR5 Enhancement--ModeLateral MOSFETs MRFE6VP61K25HSR5 These high ruggedness devices are designed for use in high VSWR industrial (including laser and plasma exciters), broadcast (analog and digital), aerospace MRFE6VP61K25GSR5 andradio/landmobileapplications.Theyareunmatchedinputandoutput designs allowingwidefrequency rangeutilization,between1.8and600MHz. Typical Performance: V =50Volts,I = 100mA DD DQ 1.8--600MHz,1250WCW,50V P f G out ps D WIDEBAND SignalType (W) (MHz) (dB) (%) RFPOWERLDMOSTRANSISTORS Pulse 1250Peak 230 24.0 74.0 (100 sec,20%Duty Cycle) CW 1250CW 230 22.9 74.6 (1) ApplicationCircuits TypicalPerformance Frequency P G out ps D (MHz) SignalType (W) (dB) (%) NI--1230H--4S 27 CW 1300 27 81 MRFE6VP61K25HR6/R5 40 CW 1300 26 85 81.36 CW 1250 27 84 87.5--108 CW 1100 24 80 144--148 CW 1250 26 78 170--230 DVB--T 225 25 30 NI--1230S--4S 352 Pulse 1250 21.5 66 MRFE6VP61K25HSR5 (200 sec, 20%Duty Cycle) 352 CW 1150 20.5 68 500 CW 1000 18 58 1. Contact yourlocalFreescalesales office foradditionalinformation on specific circuit designs. LoadMismatch/Ruggedness NI--1230GS--4L MRFE6VP61K25GSR5 Frequency P Test out SignalType VSWR (MHz) (W) Voltage Result 230 Pulse >65:1 at all 1500Peak 50 NoDevice (100 sec,20% PhaseAngles (3 dB Degradation Duty Cycle) Overdrive) GateA DrainA 31 Features UnmatchedInput andOutput AllowingWideFrequency RangeUtilization 42 DrainB DevicecanbeusedSingle--Endedor inaPush--Pull Configuration GateB QualifiedUptoaMaximum of 50V Operation DD Characterizedfrom 30V to50V for ExtendedPower Range (Top View) Suitablefor Linear ApplicationwithAppropriateBiasing Note: The backside of the package is the IntegratedESD ProtectionwithGreater NegativeGate--SourceVoltageRange sourceterminalforthetransistors. for ImprovedClass C Operation CharacterizedwithSeries Equivalent Large--Signal ImpedanceParameters Figure1.PinConnections InTapeandReel. R6Suffix = 150Units, 56mm TapeWidth, 13--inchReel. R5Suffix = 50Units, 56mm TapeWidth, 13--inchReel. FreescaleSemiconductor, Inc., 2010--2014. All rights reserved. MRFE6VP61K25HR6MRFE6VP61K25HR5MRFE6VP61K25HSR5MRFE6VP61K25GSR5 RF DeviceData FreescaleSemiconductor, Inc. 1Table1.MaximumRatings Rating Symbol Value Unit Drain--Source Voltage V --0.5,+133 Vdc DSS Gate--SourceVoltage V --6.0,+10 Vdc GS StorageTemperatureRange T --65to+150 C stg CaseOperatingTemperature T 150 C C (1,2) OperatingJunctionTemperature T 225 C J TotalDeviceDissipation T =25 C P 1333 W C D Derateabove25 C 6.67 W/ C Table2.ThermalCharacteristics (2,3) Characteristic Symbol Value Unit ThermalResistance,JunctiontoCase R 0.15 C/W JC CW: CaseTemperature63 C, 1250W CW, I =100mA,230MHz DQ ThermalImpedance,JunctiontoCase Z 0.03 C/W JC Pulse: CaseTemperature66C, 1250W Pulse, 100 sec PulseWidth,20%Duty Cycle, I =100mA,230MHz DQ Table3.ESDProtectionCharacteristics TestMethodology Class HumanBody Model(perJESD22--A114) 2,passes 3500V MachineModel(perEIA/JESD22--A115) B,passes 250V ChargeDeviceModel(perJESD22--C101) IV,passes 4000V Table4.ElectricalCharacteristics (T =25 Cunless otherwisenoted) A Characteristic Symbol Min Typ Max Unit (4) OffCharacteristics Gate--SourceLeakageCurrent I 1 Adc GSS (V =5Vdc,V =0Vdc) GS DS Drain--SourceBreakdownVoltage V 133 Vdc (BR)DSS (V =0Vdc,I =100mA) GS D Zero Gate Voltage Drain Leakage Current I 10 Adc DSS (V =50Vdc,V =0Vdc) DS GS Zero Gate Voltage Drain Leakage Current I 20 Adc DSS (V =100Vdc,V =0Vdc) DS GS OnCharacteristics (4) GateThresholdVoltage V 1.7 2.2 2.7 Vdc GS(th) (V =10Vdc,I =1776 Adc) DS D GateQuiescentVoltage V 1.9 2.2 2.9 Vdc GS(Q) (V =50Vdc,I =100mAdc,MeasuredinFunctionalTest) DD D (4) Drain--SourceOn--Voltage V 0.15 Vdc DS(on) (V =10Vdc,I =2Adc) GS D ForwardTransconductance g 28.0 S fs (V =10Vdc,I =30Adc) DS D (4) DynamicCharacteristics ReverseTransferCapacitance C 2.8 pF rss (V =50Vdc 30mV(rms)ac 1MHz,V =0Vdc) DS GS OutputCapacitance C 185 pF oss (V =50Vdc 30mV(rms)ac 1MHz,V =0Vdc) DS GS InputCapacitance C 562 pF iss (V =50Vdc,V =0Vdc 30mV(rms)ac 1MHz) DS GS 1. Continuous useat maximum temperaturewillaffect MTTF. 2. MTTFcalculatoravailableat

Tariff Desc

8541.21.00 16 No - - With a dissipation rate of less than 1 W Free

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