Product Information

PMZ350XN,315

PMZ350XN,315 electronic component of NXP

Datasheet
Trans MOSFET N-CH 30V 1.87A 3-Pin DFN T/R

Manufacturer: NXP
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

52: USD 0.6533 ea
Line Total: USD 33.97

0 - Global Stock
MOQ: 52  Multiples: 1
Pack Size: 1
Availability Price Quantity
0 - Global Stock


Ships to you between Fri. 03 May to Thu. 09 May


Multiples : 10000

     
Manufacturer
Product Category
Transistor Polarity
Pd - Power Dissipation
Mounting Style
Packaging
Channel Mode
Gate-Source Voltage Max
Drain-Source On-Res
Operating Temp Range
Package Type
Pin Count
Type
Number Of Elements
Operating Temperature Classification
Drain-Source On-Volt
Rad Hardened
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PMZ350XN N-channel TrenchMOS standard level FET Rev. 01 21 February 2008 Product data sheet BOTTOM VIEW 1. Product prole 1.1 General description N-channel enhancement mode Field-Effect Transistor (FET) in a plastic package using TrenchMOS technology. 1.2 Features n Prole 55 % lower than SOT23 n Footprint 90 % smaller than SOT23 n Low on-state resistance n Low threshold voltage n Leadless package n fast switching 1.3 Applications n Driver circuits n Load switching in portable appliances n DC-to-DC converters 1.4 Quick reference data n V 30 V n I 1.87 A DS D n R 420 m n P 2.50 W DSon tot 2. Pinning information Table 1. Pinning Pin Description Simplied outline Symbol 1 gate (G) D 1 2 source (S) 3 2 3 drain (D) G Transparent top view mbb076 S SOT833 (SC-101)PMZ350XN NXP Semiconductors N-channel TrenchMOS standard level FET 3. Ordering information Table 2. Ordering information Type number Package Name Description Version PMZ350XN SC-101 leadless ultra small plastic package 3 solder lands SOT883 body 1.0 0.6 0.5 mm 4. Limiting values CAUTION This device is sensitive to ElectroStatic Discharge (ESD). Observe precautions for handling electrostatic sensitive devices. Such precautions are described in the ANSI/ESD S20.20, IEC/ST 61340-5, JESD625-A or equivalent standards. Table 3. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit V drain-source voltage 25 C T 150 C - 30 V DS j V drain-gate voltage (DC) 25 C T 150 C R =20k -30 V DGR j GS V gate-source voltage - - 12 V GS I drain current T =25 C V = 10 V see Figure 2 and 3 - 1.87 A D mb GS T = 100 C V = 10 V see Figure 2 - 1.18 A mb GS I peak drain current T =25 C pulsed t 10 s see Figure 3 - 3.74 A DM mb p P total power dissipation T =25 C see Figure 1 - 2.50 W tot mb T storage temperature - - 55 +150 C stg T junction temperature - - 55 +150 C j Source-drain diode I source current T =25 C - 1.87 A S mb I peak source current T =25 C pulsed t 10 s - 3.74 A SM mb p Electrostatic discharge V electrostatic discharge voltage human body model C = 100 pF -65 V esd R = 1.5 k(all pins) machine model C = 200 pF (all pins) -35 V PMZ350XN 1 NXP B.V. 2008. All rights reserved. Product data sheet Rev. 01 21 February 2008 2 of 13

Tariff Desc

8541.21.00 16 No - - With a dissipation rate of less than 1 W Free

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