ESD7484 ESD Protection Diode 4Line, Ultra Large Bandwidth Functional Description The ESD7484 chip is a monolithic, application specific discrete www.onsemi.com device dedicated to ESD protection of the HDMI connection. It also offers the same high level of protection for IEEE 1394a and IEEE MARKING 1394b/c, USB2.0, Ethernet links, and video lines. DIAGRAM Its ultra high cutoff frequency (5.3 GHz) secures a high level of signal integrity. The device topology provides this integrity without 84 compromising the complete protection of ICs against the most YW WLCSP10 stringent ESD strikes. CASE 567DE Features 84 = Specific Device Code Wideband Performance Y = Year W = Work Week FlowThrough Layout = PbFree Package Low Profile with Small Footprint: 1.6 mm x 1.1 mm Package 0.4 mm Pitch WLCSP Package IEC6100042 Level 4 (At External Pins) ORDERING INFORMATION See detailed ordering and shipping information in the package 15 kV (Air Discharge) dimensions section on page 6 of this data sheet. 15 kV (Contact Discharge) These Devices are PbFree, Halogen Free and are RoHS II Compliant Applications Mobile Phones and Communications Systems HDMI Ports at 1.65 Gb/s and up to 3.2 Gb/s Video Out Protection 3 2 1 A D 1+ D 1+ OUT IN B GND D 1 D 1 C IN OUT External Internal (Connector) (ASIC) D D 2+ D 2+ OUT IN GND E D 2 D 2 OUT IN F Figure 1. Pin Configuration (Bump View) Semiconductor Components Industries, LLC, 2011 1 Publication Order Number: November, 2017 Rev. 1 ESD7484/DESD7484 ABSOLUTE MAXIMUM RATINGS Symbol Parameter Value Unit V ESD IEC6100042, level 4 air discharge (external pins) 15 kV PP ESD IEC6100042, level 4 contact discharge (external pins) 15 P Peak Pulse Power Dissipation (8/20 s) 70 W PP T Maximum Junction Temperature 125 C J T Storage Temperature Range 55 to +150 C stg Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. ELECTRICAL CHARACTERISTICS (Note 1) Symbol Test Condition Min Typ Max Unit V Breakdown Voltage (Ir = 1 mA) 6 9 V BR I Leakage Current V (V = 3 V per line) 3 100 nA RM rm rm C V = 0 V, V = 30 mV, F = 1 MHz, Capacitor between I/O and GND 1.6 1.75 pF line line osc V = 0 V, V = 30 mV, F = 1 MHz, Capacitor between I/O 0.8 line osc C V = 0 V, V = 30 mV, F = 1 MHz, Capacitance Variation between I/O 0.006 pF I/OI/O line osc 1. All parameters specified at T = 25C unless otherwise noted. A 2. Standard IEC 6100042 with C = 150 pF, R = 330 . Discharge Discharge www.onsemi.com 2