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V = 10 V, I = 3.25 A UniFET II MOSFET is Fairchild Semiconductors high voltage DS(on) GS D MOSFET family based on advanced planar stripe and DMOS Low Gate Charge (Typ. 14 nC) technology. This advanced MOSFET family has the smallest Low C (Typ. 5 pF) rss on-state resistance among the planar MOSFET, and also pro- 100% Avalanche Tested vides superior switching performance and higher avalanche Improved dv/dt Capability energy strength. In addition, internal gate-source ESD diode TM allows UniFET II MOSFET to withstand over 2kV HBM surge ESD Imoroved Capability stress. This device family is suitable for switching power con- RoHS Compliant verter applications such as power factor correction (PFC), flat panel display (FPD) TV power, ATX and electronic lamp bal- Applications lasts. LCD/LED/PDP TV Lighting Uninterruptible Power Supply D D G G S D-PAK S o MOSFET Maximum Ratings T = 25 C unless otherwise noted. C Symbol Parameter FDD8N50NZTM Unit V Drain to Source Voltage 500 V DSS V Gate to Source Voltage 25 V GSS o - Continuous (T = 25 C) 6.5 C I Drain Current A D o - Continuous (T = 100 C) 3.9 C I Drain Current - Pulsed (Note 1) 26 A DM E Single Pulsed Avalanche Energy (Note 2) 287 mJ AS I Avalanche Current (Note 1) 6.5 A AR E Repetitive Avalanche Energy (Note 1) 9 mJ AR dv/dt Peak Diode Recovery dv/dt (Note 3) 10 V/ns o (T = 25 C) 90 W C P Power Dissipation D o o - Derate Above 25C0.7W/ C o T , T Operating and Storage Temperature Range -55 to +150 C J STG o Maximum Lead Temperature for Soldering, 1/8 from Case for 5 Seconds T 300 C L Thermal Characteristics Symbol Parameter FDD8N50NZTM Unit R Thermal Resistance, Junction to Case, Max. 1.4 JC o C/W R Thermal Resistance, Junction to Ambient, Max. 62.5 JA 2010 Fairchild Semiconductor Corporation www.fairchildsemi.com 1 FDD8N50NZ Rev. C1