X-On Electronics has gained recognition as a prominent supplier of FDMS2510SDC mosfet across the USA, India, Europe, Australia, and various other global locations. FDMS2510SDC mosfet are a product manufactured by ON Semiconductor. We provide cost-effective solutions for mosfet, ensuring timely deliveries around the world.

FDMS2510SDC

FDMS2510SDC electronic component of ON Semiconductor
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See Product Specifications
Part No.FDMS2510SDC
Manufacturer: ON Semiconductor
Category:MOSFET
Description: Fairchild Semiconductor MOSFET 20V N-Chan Dual Cool PowerTrench SyncFET
Datasheet: FDMS2510SDC Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

331: USD 1.3549 ea
Line Total: USD 448.47

Availability - 0
MOQ: 331  Multiples: 331
Pack Size: 331
Availability Price Quantity
0 - WHS 1


Ships to you between Thu. 30 May to Wed. 05 Jun

MOQ : 331
Multiples : 331
331 : USD 1.3133

0 - WHS 2


Ships to you between Wed. 05 Jun to Fri. 07 Jun

MOQ : 1
Multiples : 1
1 : USD 5.3994
10 : USD 1.8194
100 : USD 1.5839
500 : USD 1.4791
1000 : USD 1.309
3000 : USD 1.2932
6000 : USD 1.2893
24000 : USD 1.1715

     
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Id - Continuous Drain Current
Vds - Drain-Source Breakdown Voltage
Rds On - Drain-Source Resistance
Transistor Polarity
Vgs th - Gate-Source Threshold Voltage
Minimum Operating Temperature
Maximum Operating Temperature
Pd - Power Dissipation
Mounting Style
Package / Case
Packaging
Technology
Number of Channels
Vgs - Gate-Source Voltage
Qg - Gate Charge
Configuration
Series
Brand
Forward Transconductance - Min
Factory Pack Quantity :
Height
Length
Transistor Type
Width
Cnhts
Hts Code
Mxhts
Product Type
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TM TM FDMS2510SDC N-Channel Dual Cool PowerTrench SyncFET July 2013 FDMS2510SDC TM TM N-Channel Dual Cool PowerTrench SyncFET 25 V, 49 A, 2.9 m Features General Description TM Dual Cool Top Side Cooling PQFN package This N-Channel MOSFET is produced using Fairchild Semiconductors advanced PowerTrench process. Max r = 2.9 m at V = 10 V, I = 23 A TM DS(on) GS D Advancements in both silicon and Dual Cool package Max r = 4.2 m at V = 4.5 V, I = 18 A technologies have been combined to offer the lowest r DS(on) GS D DS(on) while maintaining excellent switching performance by extremely High performance technology for extremely low r DS(on) low Junction-to-Ambient thermal resistance. This device has the SyncFET Schottky Body Diode added benefit of an efficient monolithic Schottky body diode. RoHS Compliant Applications Synchronous Rectifier for DC/DC Converters Telecom Secondary Side Rectification High End Server/Workstation Vcore Low Side Pin 1 S S D G 5 4 S G D 6 3 S D 7 2 S D D D S D 8 1 D Top Power 56 Bottom MOSFET Maximum Ratings T = 25C unless otherwise noted A Symbol Parameter Ratings Units V Drain to Source Voltage 25 V DS V Gate to Source Voltage (Note 4) 20 V GS Drain Current -Continuous (Package limited) T = 25 C 49 C -Continuous (Silicon limited) T = 25 C 117 C I A D -Continuous T = 25 C (Note 1a) 28 A -Pulsed 200 E Single Pulse Avalanche Energy (Note 3) 84 mJ AS dv/dt Peak Diode Recovery dv/dt (Note 5) 2.5 V/ns Power Dissipation T = 25 C 60 C P W D Power Dissipation T = 25 C (Note 1a) 3.3 A T , T Operating and Storage Junction Temperature Range -55 to +150 C J STG Thermal Characteristics R Thermal Resistance, Junction to Case (Top Source) 4.4 JC R Thermal Resistance, Junction to Case (Bottom Drain) 2.1 JC R Thermal Resistance, Junction to Ambient (Note 1a) 38 JA R Thermal Resistance, Junction to Ambient (Note 1b) 81 C/W JA R Thermal Resistance, Junction to Ambient (Note 1i) 16 JA R Thermal Resistance, Junction to Ambient (Note 1j) 23 JA R Thermal Resistance, Junction to Ambient (Note 1k) 11 JA Package Marking and Ordering Information Device Marking Device Package Reel Size Tape Width Quantity TM 2510S FDMS2510SDC Dual Cool Power 56 13 12 mm 3000 units 2010 Fairchild Semiconductor Corporation 1 www.fairchildsemi.com FDMS2510SDC Rev.C3 TM TM FDMS2510SDC N-Channel Dual Cool PowerTrench SyncFET Electrical Characteristics T = 25 C unless otherwise noted J Symbol Parameter Test Conditions Min Typ Max Units Off Characteristics BV Drain to Source Breakdown Voltage I = 1 mA, V = 0 V 25 V DSS D GS BV Breakdown Voltage Temperature DSS I = 10 mA, referenced to 25 C 19 mV/C D T Coefficient J I Zero Gate Voltage Drain Current V = 20 V, V = 0 V 500 A DSS DS GS I Gate to Source Leakage Current, Forward V = 20 V, V = 0 V 100 nA GSS GS DS On Characteristics V Gate to Source Threshold Voltage V = V , I = 1 mA 1.2 1.7 3.0 V GS(th) GS DS D V Gate to Source Threshold Voltage GS(th) I = 10 mA, referenced to 25 C -5 mV/C D T Temperature Coefficient J V = 10 V, I = 23 A 2.4 2.9 GS D r Static Drain to Source On Resistance V = 4.5 V, I = 18 A 3.4 4.2 m DS(on) GS D V = 10 V, I = 23 A, T = 125 C 3.5 4.3 GS D J g Forward Transconductance V = 5 V, I = 23 A 159 S FS DS D Dynamic Characteristics C Input Capacitance 2090 2780 pF iss V = 13 V, V = 0 V, DS GS C Output Capacitance 577 770 pF oss f = 1 MHz C Reverse Transfer Capacitance 128 195 pF rss R Gate Resistance 1.1 2.4 g Switching Characteristics t Turn-On Delay Time 10 20 ns d(on) t Rise Time 410 ns V = 13 V, I = 23 A, r DD D V = 10 V, R = 6 t Turn-Off Delay Time 27 43 ns GS GEN d(off) t Fall Time 310 ns f Q Total Gate Charge V = 0 V to 10 V 32 45 nC g GS Q Total Gate Charge V = 0 V to 4.5 V 15 21 nC V = 13 V, g GS DD I = 23 A Q Gate to Source Gate Charge 6.3 nC D gs Q Gate to Drain Miller Charge 4.0 nC gd Drain-Source Diode Characteristics V = 0 V, I = 2 A (Note 2) 0.48 0.8 GS S V Source to Drain Diode Forward Voltage V SD V = 0 V, I = 23 A (Note 2) 0.79 1.2 GS S t Reverse Recovery Time 23 36 ns rr I = 23 A, di/dt = 300 A/ s F Q Reverse Recovery Charge 17 31 nC rr 2010 Fairchild Semiconductor Corporation www.fairchildsemi.com 2 FDMS2510SDC Rev.C3

Tariff Desc

8541.21.00 16 No - - With a dissipation rate of less than 1 W Free

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