ON Semiconductor Is Now To learn more about onsemi, please visit our website at www.onsemi.com onsemi andand other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba onsemi or its affiliates and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of onsemi product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. onsemi reserves the right to make changes at any time to any products or information herein, without notice. The information herein is provided as-is and onsemi makes no warranty, representation or guarantee regarding the accuracy of the information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by onsemi. Typical parameters which may be provided in onsemi data sheets and/ or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including Typicals must be validated for each customer application by customers technical experts. onsemi does not convey any license under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and holdo nsemi and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. Other names and brands may be claimed as the property of others. FDP8D5N10C / FDPF8D5N10C N-Channel Shielded Gate PowerTrench MOSFET www.onsemi.com FDP8D5N10C / FDPF8D5N10C N-Channel Shielded Gate PowerTrench MOSFET 100 V, 76 A, 8.5 m Features General Description This N-Channel MV MOSFET is produced using ON Max r = 8.5 m at V = 10 V, I = 76 A DS(on) GS D Semiconductors advanced PowerTrench process that Extremely Low Reverse Recovery Charge, Qrr incorporates Shielded Gate technology. This process has been optimized to minimize on-state resistance and yet maintain 100% UIL Tested superior switching performance with best in class soft body RoHS Compliant diode. Applications Synchronous Rectification for ATX / Server / Telecom PSU Motor drives and Uninterruptible Power Supplies Micro Solar Inverter D G G G D D S S S TO-220 TO-220F MOSFET Maximum Ratings T = 25 C unless otherwise noted. C Ratings Symbol Parameter Units FDP8D5N10C FDPF8D5N10C V Drain to Source Voltage 100 100 V DS V Gate to Source Voltage 20 20 V GS Drain Current -Continuous T = 25C (Note 3) 76 76* C I -Continuous T = 100C (Note 3) 54 54* A D C -Pulsed (Note 1) 304 304* E Single Pulse Avalanche Energy (Note 2) 181 mJ AS Power Dissipation T = 25C 107 35 C P W D Power Dissipation T = 25C 2.4 2.4 A T , T Operating and Storage Junction Temperature Range -55 to +175 -55 to +175 C J STG * Drain current limited by maximum junction temperature. Thermal Characteristics Symbol Parameter FDP8D5N10C FDPF8D5N10C Units R Thermal Resistance, Junction to Case 1.4 4.2 JC C/W R Thermal Resistance, Junction to Ambient 62.5 62.5 JA Package Marking and Ordering Information Device Marking Device Package Reel Size Tape Width Quantity FDP8D5N10C FDP8D5N10C TO-220 - - 50 units FDPF8D5N10C FDPF8D5N10C TO-220F - - 50 units Semiconductor Components Industries, LLC, 2017 Publication Order Number: May, 2017, Rev. 1.0 FDP8D5N10C / FDPF8D5N10C/D 1