PCS3P8504A General Purpose Peak EMI Reduction IC Functional Description PCS3P8504A is a versatile, 3.3 V TimingSafe Peak EMI reduction IC. PCS3P8504A accepts an input clock either from a www.onsemi.com fundamental Crystal or from an external reference (AC or DC coupled to XIN/CLKIN) and locks on to it delivering a 1x modulated clock MARKING DIAGRAMS output. PCS3P8504A has a SSON pin for enabling and disabling Spread Spectrum function. 1 1 PCS3P8504A has an SSEXTR pin to select different deviations DAM depending upon the value of an external resistor connected between WDFN8 SSEXTR and GND. Modulation Rate (MR) control selects one of the CASE 511AQ two different Modulation Rates. PCS3P8504A operates from a 3.3 V supply, and is available in an DA = Specific Device Code M = Date Code 8pin, WDFN(2 mm x 2 mm) package. = PbFree Device General Features (Note: Microdot may be in either location) 1x, LVCMOS Peak EMI Reduction Input frequency: PIN CONFIGURATION 15 MHz 50 MHz Output frequency: XIN/CLKIN 1 8 VDD 15 MHz 50 MHz Analog Deviation Selection 7 XOUT 2 SSEXTR PCS3P8504A ModRate selection option Spread Spectrum Enable/Disable 6 SSON 3 MR Supply Voltage: 3.3 V 0.3 V 5 GND 4 ModOUT 8pin, WDFN 2 mm x 2 mm (TDFN) Package These Devices are PbFree, Halogen Free/BFR Free and are RoHS Compliant ORDERING INFORMATION See detailed ordering and shipping information in the package Application dimensions section on page 5 of this data sheet. PCS3P8504A is targeted for consumer electronics application like DPF, MFP. Semiconductor Components Industries, LLC, 2013 1 Publication Order Number: June, 2017 Rev. 4 PCS3P8504A/DPCS3P8504A VDD SSON MR XIN/CLKIN ModOUT Crystal XOUT PLL Oscillator SSEXTR GND Figure 1. Block Diagram Table 1. PIN DESCRIPTION Pin Pin Name Type Description 1 XIN / CLKIN I Crystal connection or External reference clock input. 2 XOUT O Crystal connection. If using an external reference, this pin should be left open. 3 SSON I Spread Spectrum ON/OFF. Spread Spectrum function enabled when HIGH, disabled when LOW. Has an internal pullup resistor. 4 GND P Ground 5 ModOUT O Modulated clock output 6 MR I Modulation Rate Select. When LOW selects Low Modulation Rate. Selects High Modulation Rate when pulled HIGH. Has an internal pullup resistor. 7 SSEXTR I Analog Deviation Selection through external resistor to GND. 8 V P 3.3 V supply Voltage. DD Table 2. OPERATING CONDITIONS Symbol Parameter Min Max Unit V Supply Voltage 3 3.6 V DD T Operating Temperature Industrial 40 85 C A C Load Capacitance 10 pF L C Input Capacitance 7 pF IN Table 3. ABSOLUTE MAXIMUM RATING Symbol Parameter Rating Unit V , V Voltage on any input pin with respect to Ground 0.5 to +4.6 V DD IN T Storage Temperature 65 to +125 C STG T Max. Soldering Temperature (10 sec) 260 C s Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functional- ity should not be assumed, damage may occur and reliability may be affected. www.onsemi.com 2