ENW-89835A1KF Panasonic

Name: ENW-89835A1KF
Brand: Panasonic
SKU: ENW89835A1KF_Panasonic
Availability: OutOfStock
Rating: 5 (11 reviews)

ENW-89835A1KF electronic component of Panasonic

ENW-89835A1KF Bluetooth Modules - 802.15.1

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X-On Electronics has gained recognition as a prominent supplier of ENW-89835A1KF Bluetooth Modules - 802.15.1 across the USA, India, Europe, Australia, and various other global locations. ENW-89835A1KF Bluetooth Modules - 802.15.1 are a product manufactured by Panasonic. We provide cost-effective solutions for Bluetooth Modules - 802.15.1, ensuring timely deliveries around the world.

Part No.	ENW-89835A1KF
Manufacturer:	Panasonic
Category:	Bluetooth Modules - 802.15.1
Description:	Panasonic Bluetooth 802.15.1 Modules BLE PAN1721 CC2541 I2C TI FW Ant
Datasheet:	ENW-89835A1KF Datasheet (PDF)

Price (USD)

N/A

Obsolete

ENW-89835A1KF More Buying Options & Price Grid(s)

Availability

Price (USD)

Quantity

Availability 0

MOQ : 500
Multiples : 500

Qty	Unit Price
500	$ 18.1125
1000	$ 18.5801

N/A

Obsolete

Availability 0

MOQ : 1
Multiples : 1

Qty	Unit Price
1	$ 21.0656
25	$ 15.7268
50	$ 14.9011
100	$ 14.1153
250	$ 13.1405

N/A

Obsolete

Availability 0

MOQ : 1
Multiples : 1

Qty	Unit Price
1	$ 16.2864
10	$ 14.742
25	$ 13.5756
100	$ 11.9016
250	$ 10.854
500	$ 10.0764
1000	$ 9.774
2500	$ 9.6768
5000	$ 9.5796

N/A

Obsolete

We are delighted to provide the ENW-89835A1KF from our Bluetooth Modules - 802.15.1 category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the ENW-89835A1KF and other electronic components in the Bluetooth Modules - 802.15.1 category and beyond.

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Additional Infomation About Product

No. REV. CLASSIFICATION PRODUCT SPECIFICATION DS-17xx-2400-102 2.13 CLASS 2 BLUETOOTH LOW ENERGY SUBJECT PAGE 1 of 37 SINGLE MODE MODULE CUSTOMERS CODE PANASONICS CODE DATE 08.07.2015 PAN172x / PAN171x ENW89820AxKF / ENW89835AxKF Product Specification Applicant / Manufacturer Panasonic Industrial Devices Europe GmbH Hardware Zeppelinstrasse 19 21337 Lneburg Germany Applicant / Manufacturer Please refer to chapter 24 / 24.1 Information regarding Software Versions Software Software Version Please refer to chapter 24 / 24.1 Information regarding Software Versions By purchase of any of products described in this document the customer accepts the document s validity and declares their agreement and understanding of its contents and recommendations. Panasonic reserves the right to make changes as required without notification. APPROVED CHECKED DESIGNED Power Electronics R&D Center genehmigt geprft erstellt Wireless Connectivity Panasonic Industrial Devices Europe GmbH No. REV. CLASSIFICATION PRODUCT SPECIFICATION DS-17xx-2400-102 2.13 CLASS 2 BLUETOOTH LOW ENERGY SUBJECT PAGE 2 of 37 SINGLE MODE MODULE CUSTOMERS CODE PANASONICS CODE DATE 08.07.2015 PAN172x / PAN171x ENW89820AxKF / ENW89835AxKF TABLE OF CONTENTS 1. Scope of this Document ................................................................................................ 4 2. Difference PAN1720 / PAN1721 .................................................................................... 4 3. Difference PAN172x / PAN171x .................................................................................... 4 4. Key Features ................................................................................................................. 4 Bluetooth Low Energy ............................................................................................................ 5 5. Applications for the Module ........................................................................................... 5 6. Description for the Module ............................................................................................. 5 7. Detailed Description ...................................................................................................... 6 7.1. PAN172x Terminal Layout ................................................................................... 6 7.2. Crossreference GPIO PAN-Module to BlueRadios-Module .................................. 8 8. Bluetooth Features ........................................................................................................ 9 9. PAN172x Block Diagram ............................................................................................... 9 10. Test Conditions ........................................................................................................... 10 11. General Device Requirements and Operation ............................................................. 10 11.1. Absolute Maximum Ratings ................................................................................ 10 11.2. Recommended Operating Conditions ................................................................. 10 11.3. PAN1720 Current Consumption ......................................................................... 11 12. Bluetooth RF Performance .......................................................................................... 12 12.1. PAN1720 Bluetooth Characteristics ................................................................... 12 12.2. PAN1721 Bluetooth Characteristics ................................................................... 12 12.3. PAN17XX Spurious Emission ............................................................................. 12 13. Soldering Temperature-Time Profile (for reflow soldering) ........................................... 13 13.1. For lead solder ................................................................................................... 13 13.2. For leadfree solder ............................................................................................. 13 14. PAN172x Module Dimension ....................................................................................... 14 15. PAN171x Module Dimension ....................................................................................... 15 16. PAN172x FootPrint of the Module ............................................................................... 16 17. PAN171x FootPrint of the Module ............................................................................... 17 18. Case Marking .............................................................................................................. 18 18.1. Example for Marking .......................................................................................... 18 18.2. Marking Definition .............................................................................................. 18 19. Mechanical Requirements ........................................................................................... 18 20. Development of Applications ....................................................................................... 19 21. Reliability Tests ........................................................................................................... 19 22. Cautions ...................................................................................................................... 19 22.1. Design Notes ..................................................................................................... 19 22.2. Installation Notes ................................................................................................ 20 22.3. Usage Conditions Notes ..................................................................................... 20 22.4. Storage Notes .................................................................................................... 21 PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.panasonic.de

HS Compliance

Tariff Desc

8542.3 - Electronic integrated circuits:
8542.31.00 -- Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:
.Digital:
61 No ..Linear/analogue and peripheral integrated circuits, timers, voltage regulators, A/D and D/A converters, telecommunication and modem integrated circuits, other than board level products
62 No ..Other
63 No Hybrid integrated circuits
64 No Multichip integrated circuits

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PANASONIC IMD
PANASONIC IND DEVICES (PIDSA)
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Manufacturer Panasonic Panasonic
Product Category Bluetooth Modules - 802.15.1 Bluetooth Modules - 802.15.1
RoHS - XON Y Y
Series Pan1721 Pan1721
Protocol Bluetooth 4.0 Bluetooth 4.0
Class 2 2
Interface Type I2 C I2 C
Output Power 0 dBm 0 dBm
Data Rate 1 Mb/S 1 Mb/S
Operating Supply Voltage 2 v to 3.6 V 2 v to 3.6 V
Minimum Operating Temperature - 40 C - 40 C
Maximum Operating Temperature + 85 C + 85 C
Packaging Reel Reel
Dimensions 14.5 Mm X 8.2 Mm X 3 Mm 14.5 Mm X 8.2 Mm X 3 Mm
Sensitivity - 94 Dbm - 94 Dbm
Brand Panasonic Panasonic
Frequency Band 2.4 GHz 2.4 GHz
Mounting Style Smd/Smt Smd/Smt
Antenna Connector Type On Board, Chip On Board, Chip
Factory Pack Quantity : 500 500
Height 3 mm 3 mm
Length 14.5 mm 14.5 mm
Product Bluetooth Modules Bluetooth Modules
Width 8.2 mm 8.2 mm
Cnhts 8543709991 8543709991
Hts Code 8517620090 8517620090
Product Type Bluetooth Modules Bluetooth Modules
Subcategory Wireless & Rf Modules Wireless & Rf Modules
Taric 8517620000 8517620000
Version Bluetooth 4.0 Bluetooth 4.0

ENW-89835A1KF Panasonic

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