Product Information

BD8P250MUF-CE2

BD8P250MUF-CE2 electronic component of ROHM

Datasheet
Buck, Buck-Boost Switching Regulator IC Positive Fixed 5V 1 Output 2A 24-VFQFN Exposed Pad

Manufacturer: ROHM
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Price (USD)

1: USD 4.416 ea
Line Total: USD 4.42

2307 - Global Stock
Ships to you between
Thu. 16 May to Mon. 20 May
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
2307 - WHS 1


Ships to you between Thu. 16 May to Mon. 20 May

MOQ : 1
Multiples : 1
1 : USD 4.416
10 : USD 3.726
100 : USD 3.381
250 : USD 3.2085
500 : USD 2.921
1000 : USD 2.53
2500 : USD 2.484
10000 : USD 2.415

     
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Mounting Style
Package / Case
Output Voltage
Output Current
Number of Outputs
Input Voltage MAX
Topology
Input Voltage MIN
Switching Frequency
Minimum Operating Temperature
Maximum Operating Temperature
Qualification
Packaging
Quiescent Current
Input Voltage
Brand
Shutdown
Product Type
Factory Pack Quantity :
Subcategory
Supply Voltage - Min
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Datasheet 2.7 V to 36 V Input, 2 A Single Buck DC/DC Conve rter with Boost Function For Automotive BD8P250MUF-C General Description Key Specifications BD8P250MUF-C is a synchronous rectification buck DC/DC Input Voltage A: 3.5 V to 36 V converter with a boost control function. This DC/DC (Buck DC/DC Converter, Initial startup is over 4.8 V) converter enables a common design that can meet a variety Input Voltage B: 2.7 V to 36 V of demands, including the use as a buck DC/DC converter if (Buck-Boost DC/DC Converter, Initial startup is over 7.5 V) a drop of the output voltage is acceptable during the input Output Voltage: 5.0 V(Typ) voltage drop such as a cold cranking, and the use as a Output Current in Buck Operation: 2 A(Max) buck-boost DC/DC with an exclusive boost-FET connected Output Current in Buck-Boost Operation: 0.8 A(Max) if the output voltage must be maintained. The Quick Buck Switching Frequency: 2.2 MHz(Typ) Booster technology realizes a high-speed response even Shutdown Circuit Current: 3.5 A(Typ) during buck-boost operations, allowing reduction in the Quiescent Current: 8 A(Typ) capacitance value of the output capacitor. Operating Temperature: -40 C to +125 C Features Package W(Typ) x D(Typ) x H(Max) Quick Buck Booster VQFN24FV4040 4.00 mm x 4.00 mm x 1.00 mm Nano Pulse Control (Note 1) AEC-Q100 Qualitied Boost Control Function LLM(Light Load Mode) Spread Spectrum Function Power Good Function Soft Start Function Current Mode Control Enlarged View Phase Compensation Included Over Current Protection Input Under Voltage Lockout Protection Thermal Shutdown Protection Output Over Voltage Protection Short Circuit Protection VQFN24FV4040 Wettable Flank QFN Package Wettable Flank Package (Note 1) Grade 1 Applications Automotive Equipment (Cluster Panel, Infotainment Systems) Other Electronic Equipment Typical Application Circuit BD8P250MUF-C C BD8P250MUF-C BOOT C BOOT Exclusive Boost-FET V IN VIN VIN BOOT VIN BOOT BD90302NUF-C L 1 V L1 OUT V OUT SW SW SW2 PVOUT PVIN PVIN VOUT VOUT CTLIN EN EN C IN C IN VCC EX VCC EX PGND C C OUT OUT V R MODE MODE CTL V MODE MODE CTLOUT CTLOUT R R PGOOD PGOOD SSCG SSCG PGOOD PGOOD VREG VREG GND PGND GND PGND C C REG REG A. Buck DC/DC Converter B. Buck-Boost DC/DC Converter (Use Exclusive Boost-FET) Figure 1. Application Circuit Quick Buck Booster is a registered trademark of ROHM Co., Ltd. Nano Pulse Control is a trademark of ROHM Co., Ltd. Product structure : Silicon integrated circuit This product has no designed protection against radioactive rays www.rohm.com TSZ02201-0J1J0AL01400-1-2 2018 ROHM Co., Ltd. All rights reserved. 1/42 TSZ22111 14 001 11.Sep.2018 Rev.001 BD8P250MUF-C Pin Configuration EN 1 18 CTLOUT VIN 2 17 SSCG PVIN 3 16 N.C EXP-PAD PVIN 4 15 BOOT PVIN 5 14 SW N.C 6 13 SW (TOP VIEW) Figure 2. Pin Configuration Pin Descriptions Pin No. Pin Name Function Enable pin. Apply Low-level (0.8 V or lower) to turn this device off. Apply High-level (2.0 1 EN V or higher) to turn this device on. This pin must be terminated. 2 VIN Power supply input pin of the internal circuitry. Connect this pin to PVIN pin. Power supply input pins that are used for the output stage of the switching regulator. 3to5 PVIN Connecting input ceramic capacitors with values of 4.7 F(Typ) and 0.1 F to this pin is recommended. 6 N.C No connection pin. Leave these pins open, or connect to PVIN pin. 7,8 PGND Ground pins for the output stage of the switching regulator. 9to10 N.C. No connection pin. Leave these pins open, or connect to PGND pin. 11 N.C. No connection pin. Leave this pin open. Switching node pins. These pins are connected to the source of the High Side FET and 12to14 SW drain of the Low Side FET. Connect a bootstrap capacitor of 0.1 F between this pin and the SW pins. 15 BOOT The voltage of this capacitor is the gate drive voltage of the High Side FET. 16 N.C. No connection pin. Leave this pin open. Pin to select Spread Spectrum function. Connect this pin to VREG pin or GND pin. 17 SSCG Connect to VREG pin to enable Spread Spectrum function and connect to GND pin to disable Spread Spectrum function. Pin used to control the exclusive Boost-FET. When using the exclusive Boost-FET, 18 CTLOUT connect this pin to CTLIN pin of the exclusive Boost-FET. Connect this pin to GND pin through a pull-down 1 k resistor when not using the exclusive Boost-FET. Power Good pin, an open drain output. Connect to VREG pin or suitable voltage supply 19 PGOOD through a pull-up resistor. Using a 10 k to 100 k resistance is recommended. 20 VOUT Sense pin of output voltage. This pin is controlled to become 5.0 V(Typ). 21 VCC EX Internal power supply pin. Connect this pin to VOUT pin. 22 GND Ground pin. Internal power supply output pin. This node supplies power 5.0 V(Typ) to other blocks 23 VREG which are mainly responsible for the control function of the switching regulator. Connect a ceramic capacitor with value of 1.0 F(Typ) to ground. Pin for setting switching control mode. Turning this pins signal to Low-level (0.8 V or lower) enables the LLM control and the mode is automatically switched between the 24 MODE LLM control and PWM (Pulse Wide Modulation) control. Turning this pins signal to High-level (2.0 V or higher) enables the forced PWM control.This pin must be terminated. A backside heat dissipation pad. Connecting to the internal PCB ground plane by using - EXP-PAD via provides excellent heat dissipation characteristics. www.rohm.com TSZ02201-0J1J0AL01400-1-2 2018 ROHM Co., Ltd. All rights reserved. 2/42 TSZ22111 15 001 11.Sep.2018 Rev.001 PGND 7 24 MODE PGND 8 23 VREG N.C 9 22 GND N.C 10 21 VCC EX N.C 11 20 VOUT SW 12 19 PGOOD

Tariff Desc

8542.31.00 51 No ..Application Specific (Digital) Integrated Circuits (ASIC)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:
LAPIS Semiconductor
RHE
RHM
ROHM Semicon
ROHM Semiconductor

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