Datasheet Gate Driver Providing Galvanic Isolation Series Isolation voltage 3750Vrms 1ch Gate Driver Providing Galvanic Isolation BM61S40RFV-C General Description Key Specifications The BM61S40RFV-C is a gate driver with an isolation Isolation Voltage: 3750 Vrms voltage of 3750 Vrms, I/O delay time of 65ns, and Maximum Gate Drive Voltage: 20 V minimum input pulse width of 60ns. It incorporates the I/O Delay Time: 65 ns(Max) Under-Voltage Lockout (UVLO) function, Miller clamp Minimum Input Pulse Width: 60 ns function and Over-Voltage Protect (OVP) function. Output Current 4 A Features (Note 1 ) AEC-Q100 Qualified Providing Galvanic Isolation Package W(Typ) x D(Typ) x H(Max) Active Miller Clamping Under-Voltage Lockout Function SSOP-B10W 3.5 mm x10.2 mm x 1.9 mm Over-Voltage Protect Function UL1577 Recognized: File E356010 (Note 1) Grade1 Applications SiC MOSFET Gate Drive SSOP-B10W Typical Application Circuits Isolation GND1 GND2 UVLO1 UVLO2 OVP VCC1 VCC2 INA OUT Pulse Logic Generator INB MC C C VCC2 VCC1 - GND1 GND2 + 2V Pin 1 Figure 1. For Driving SiC MOSFET without Negative Power Supply SSOSSOSSOPPP---B1B1B1000WWW SSOP-B10W Product structure : Silicon integrated circuit This product has no designed protection against radioactive rays www.rohm.com TSZ02201-0818ACH00400-1-2 2018 ROHM Co., Ltd. All rights reserved. 1/25 30.Mar.2020 Rev.002 TSZ22111 14 001 BM61S40RFV-C Contents General Description ........................................................................................................................................................................ 1 Features.......................................................................................................................................................................................... 1 Applications .................................................................................................................................................................................... 1 Key Specifications ........................................................................................................................................................................... 1 Package .................................................................................................................................................................................. 1 Typical Application Circuits ............................................................................................................................................................. 1 Contents ......................................................................................................................................................................................... 2 Recommended Range of External Constants ................................................................................................................................. 3 Pin Configurations .......................................................................................................................................................................... 3 Pin Descriptions .............................................................................................................................................................................. 3 Description of Functions and Examples of Constant Setting .......................................................................................................... 5 Absolute Maximum Ratings ............................................................................................................................................................ 8 Thermal Resistance ........................................................................................................................................................................ 8 Recommended Operating Ratings .................................................................................................................................................. 9 Insulation Related Characteristics .................................................................................................................................................. 9 Electrical Characteristics............................................................................................................................................................... 11 Typical Performance Curves ......................................................................................................................................................... 12 Figure 8. Input-side Circuit Current 1 vs Input-side Supply Voltage .......................................................................................... 12 Figure 9. Input-side Circuit Current 1 vs Temperature ............................................................................................................... 12 Figure 10. Input-side Circuit Current 2 vs Input-side Supply Voltage (At INA=100 kHz, Duty=50 %) ........................................ 12 Figure 11. Input-side Circuit Current 2 vs Temperature (At INA=100 kHz, Duty=50 %) ............................................................. 12 Figure 12. Output-side Circuit Current 2 vs Output-side Supply Voltage (At OUT=L) ............................................................... 13 Figure 13. Output-side Circuit Current 2 vs Temperature (At OUT=L) ....................................................................................... 13 Figure 14.Output-side Circuit Current 2 vs Output-side Supply Voltage (At OUT=H) ................................................................ 13 Figure 15 Output-side Circuit Current 2 vs Temperature (At OUT=H) ....................................................................................... 13 Figure 16. Logic High/Low Level Input Voltage ......................................................................................................................... 14 Figure 17.Output Voltage vs Logic Level Input Voltage (INA) .................................................................................................... 14 Figure 18 Logic Pull-up/down Resistance vs Temperature ........................................................................................................ 14 Figure 19 Logic Input Minimum Pulse Width vs Temperature ................................................................................................... 14 Figure 20. OUT ON Resistance (Source) vs Temperature ........................................................................................................ 15 Figure 21. OUT ON Resistance (Sink) vs Temperature ............................................................................................................. 15 Figure 22 Turn ON Time vs Temperature .................................................................................................................................. 15 Figure 23 Turn OFF Time vs Temperature ................................................................................................................................ 15 Figure 24. Turn ON Time vs Temperature (INA=H, INB=PWM) ................................................................................................ 16 Figure 25. Turn OFF Time vs Temperature (INA=H, INB=PWM) ............................................................................................... 16 Figure 26. MC ON Resistance vs Temperature ......................................................................................................................... 16 Figure 27. MC ON Threshold Voltage vs Temperature .............................................................................................................. 16 Figure 28 V UVLO ON/OFF Voltage vs Temperature ........................................................................................................... 17 CC1 Figure 29 V UVLO Mask Time vs Temperature .................................................................................................................... 17 CC1 Figure 30 V UVLO ON/OFF Voltage vs Temperature ........................................................................................................... 17 CC2 Figure 31 V UVLO Mask Time vs Temperature .................................................................................................................... 17 CC2 Figure 32 V OVP ON/OFF Voltage vs Temperature ............................................................................................................. 18 CC2 Figure 33 V OVP Mask Time vs Temperature ....................................................................................................................... 18 CC2 Selection of Components Externally Connected ........................................................................................................................... 19 I/O Equivalence Circuits ................................................................................................................................................................ 20 Operational Notes ......................................................................................................................................................................... 21 1. Reverse Connection of Power Supply ............................................................................................................................ 21 2. Power Supply Lines ........................................................................................................................................................ 21 3. Ground Voltage ............................................................................................................................................................... 21 4. Ground Wiring Pattern .................................................................................................................................................... 21 5. Recommended Operating Conditions ............................................................................................................................. 21 6. Inrush Current................................................................................................................................................................. 21 7. Operation Under Strong Electromagnetic Field .............................................................................................................. 21 8. Testing on Application Boards ........................................................................................................................................ 21 9. Inter-pin Short and Mounting Errors ............................................................................................................................... 21 10. Unused Input Pins .......................................................................................................................................................... 22 11. Regarding the Input Pin of the IC ................................................................................................................................... 22 12. Ceramic Capacitor .......................................................................................................................................................... 22 Ordering Information ..................................................................................................................................................................... 23 Marking Diagram .......................................................................................................................................................................... 23 Physical Dimension and Packing Information ............................................................................................................................... 24 Revision History ............................................................................................................................................................................ 25 www.rohm.com TSZ02201-0818ACH00400-1-2 2018 ROHM Co., Ltd. All rights reserved. 2/25 TSZ22111 15 001 30.Mar.2020 Rev.002