IX4340N IXYS

IX4340 5-Ampere, Dual Low-Side MOSFET Driver INTEGRATED CIRCUITS DIVISION Features Description Two Independent Drivers, Each Capable of Sourcing The IX4340 is a dual, high current, low side gate and Sinking 5A driver. Each of the two outputs is capable of sourcing CMOS and TTL Compatible Inputs and sinking 5A of peak current, and has a maximum Independent Enable for Each Driver voltage rating of 20V. The two outputs can be 5V to 20V Supply Voltage Range paralleled for higher current applications. Fast -40C to +125C Extended Operating Temperature propagation delay times (16ns typical) and fast rise Range and fall times (7ns) make the IX4340 well suited for 4kV ESD Rating (Human Body Model) high frequency applications. Thermally enhanced 8-pin SOIC and 8-pin MSOP packages and standard 8-pin SOIC package The inputs are TTL and CMOS logic compatible, and Under Voltage Lockout Circuitry there is an independent Enable function for each Fast Propagation Delays (16ns typical) output. Under voltage lockout circuitry (UVLO) Fast Rise and Fall Times (7ns typical) prevents the high side source driver from conducting until there is sufficient supply voltage. The outputs are Applications held low if the logic inputs are floating. Switch-Mode Power Supplies DC-DC Converters The IX4340 is available in standard 8-pin SOIC and Motor Controllers thermally enhanced 8-pin SOIC and MSOP packages. Power Inverters Ordering Information Part Number Description IX4340N 8-Pin SOIC (100/Tube) IX4340NTR 8-Pin SOIC (4000/Reel) 8-Pin SOIC w/ Exposed Thermal Pad IX4340NE (100/Tube) 8-Pin SOIC w/ Exposed Thermal Pad IX4340NETR (4000/Reel) 8-Pin MSOP w/ Exposed Thermal Pad IX4340UE (80/Tube) 8-Pin MSOP w/ Exposed Thermal Pad IX4340UETR (5000/Reel) IX4340 Functional Block Diagram V V CC CC ENA 1 8 ENB V CC INA 2 7 OUTA V CC V CC V GND UVLO 3 6 CC V CC INB 4 5 OUTB DS-IX4340-R06 www.ixysic.com 1IX4340 INTEGRATED CIRCUITS DIVISION 1. Specifications 3 1.1 Pin Configuration 3 1.2 Logic Table 3 1.3 Pin Definitions 3 1.4 Absolute Maximum Ratings 3 1.5 Electrical Characteristics 4 1.6 Thermal Characteristics . 4 2. Performance Data . 5 3. Manufacturing Information 7 3.1 Moisture Sensitivity 7 3.2 ESD Sensitivity . 7 3.3 Soldering Profile . 7 3.4 Board Wash 7 3.5 Mechanical Dimensions . 8 2 www.ixysic.com R06