GHXS050B065S-D3 SemiQ

GHXS050B065S-D3 electronic component of SemiQ
GHXS050B065S-D3 SemiQ
GHXS050B065S-D3 Discrete Semiconductor Modules
GHXS050B065S-D3  Semiconductors
Images are for reference only, See Product Specifications

X-On Electronics has gained recognition as a prominent supplier of GHXS050B065S-D3 Discrete Semiconductor Modules across the USA, India, Europe, Australia, and various other global locations. GHXS050B065S-D3 Discrete Semiconductor Modules are a product manufactured by SemiQ. We provide cost-effective solutions for Discrete Semiconductor Modules, ensuring timely deliveries around the world.

Part No. GHXS050B065S-D3
Manufacturer: SemiQ
Category: Discrete Semiconductor Modules
Description: Discrete Semiconductor Modules SiC SBD 650V 50A SiC Power Modules
Datasheet: GHXS050B065S-D3 Datasheet (PDF)
Price (USD)
1: USD 25.829 ea
Line Total: USD 25.83 
Availability : 9
  
Ship by Wed. 12 Nov to Fri. 14 Nov
QtyUnit Price
1$ 25.829
10$ 20.064
100$ 17.754
500$ 17.743

Availability 9
Ship by Wed. 12 Nov to Fri. 14 Nov
MOQ : 1
Multiples : 1
QtyUnit Price
1$ 25.829
10$ 20.064
100$ 17.754
500$ 17.743

   
Manufacturer
Product Category
Product
Type
Vf - Forward Voltage
Vr - Reverse Voltage
Mounting Style
Package / Case
Minimum Operating Temperature
Maximum Operating Temperature
Series
Packaging
Technology
Hts Code
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Notes:- Show Stocked Products With Similar Attributes.

We are delighted to provide the GHXS050B065S-D3 from our Discrete Semiconductor Modules category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the GHXS050B065S-D3 and other electronic components in the Discrete Semiconductor Modules category and beyond.

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G H X S 0 5 0 B 0 6 5 S - D 3 VDC 650 V I 50 A F T ,max 175 C j 650V SiC Power Module Dual Diode Pack Features Package SiC Schottky Diode - Zero reverse recovery - Zero forward recovery - Temperature independent switching behavior - Positive temperature coefficient on V F Low stray inductance High junction temperature operation All parts tested to greater than 715V Parallel Benefits Outstanding performance at high frequency operation Low loss and low EMI noise Very rugged and easy mounting Internally isolated package (AlN) Part Package Marking Low junction to case thermal resistance Easy paralleling due to positive T of V C F GHXS050B065S-D3 SOT-227 GHXS050B065S-D3 RoHS compliant Applications Switched-mode power supply Induction heater Welding equipment Charging station Maximum Ratings, at T =25 C, unless otherwise specified (per leg) j Characteristics Symbol Conditions Values Unit T =25 C, T =175 C 95 C j I T =117 C, T =175 C Continuous forward current 50 A F* C j T =150 C, T =175 C 29 C j T =25 C, t =8.3 ms 300 Surge non-repetitive forward current C p I A FSM sine halfwave T =110 C, t =8.3 ms 275 C p Non-repetitive peak forward current I T =25 C, t =10 s 2000** A F,max C p T =25 C, t =8.3 ms 374 C p 2 2 2 i t value i dt A s T =110 C, t =8.3 ms 314 C p Repetitive peak reverse voltage V T =25 C 650 V RRM j Diode dv/dt ruggedness dv/dt Turn-on slew rate, repetitive 200 V/ns P T =25 C Power dissipation 232 W tot* C T Operating junction temperature -55175 C j Storage temperature T -55150 C storage Notes: *Typical Rth used JC **Limited by testing equipment Rev. 1, 8/28/2020 www.SemiQ.com p.1650V SiC Power Module G H X S 0 5 0 B 0 6 5 S - D 3 Electrical Characteristics, at T =25 C, unless otherwise specified (per leg) j Values Characteristics Symbol Conditions Unit min. typ. max. V I =125A, T =25 C DC blocking voltage 650 - - V DC R j Breakdown voltage V I =1.65mA, T =25 C 715 - - V BR R j I =50A, T =25 C - 1.45 1.60 F j Diode forward voltage V I =50A, T =125 C - 1.61 - V F F j I =50A, T =175 C - 1.77 2.00 F j V =650V, T =25 C - 6 125 R j V =715V, T =25 C - 22 - R j Reverse current I mA R V =650V, T =125 C - 41 - R j V =650V, T =175 C - 147 500 R j Q V =400V, T =25 C Total capacitive charge - 120 - nC C R j V =1V, f=1 MHz - 1946 - R Total capacitance C V =200V, f=1 MHz - 228 - pF R V =400V, f=1 MHz - 189 - R Thermal and Package Characteristics, at Tj=25 C, unless otherwise specified Values Characteristics Symbol Conditions Unit min. typ. max. o Thermal resistance, junction-case R Per leg - 0.65 0.81 C/W thJC Mounting torque M M4-0.7 screws 1.1 - 1.5 N-m d Terminal connection torque M M4-0.7 screws - 1.1 1.3 N-m dt W Package weight - 32 - g t I < 1mA, ISOL Isolation voltage V 2500 - - V ISOL 50/60 Hz, 1 min Typical Performance Per Leg 100 1.E-03 -55C -55C 90 25C 25C 80 1.E-04 75C 75C 125C 125C 70 175C 175C 60 1.E-05 50 40 1.E-06 30 20 1.E-07 10 0 1.E-08 0.0 0.5 1.0 1.5 2.0 2.5 3.0 0 100 200 300 400 500 600 V (V) V (V) F R Fig. 1 Forward Characteristics (parameterized on T ) Fig. 2 Reverse Characteristics (parameterized on T ) j j Rev. 1, 8/28/2020 www.SemiQ.com p.2 I (A) F I (A) R

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8541.30.00 20 No - Thyristors, diacs and triacs, other than photo- sensitive devices Free
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