L6716TR STMicroelectronics

L6716 2/3/4 phase controller with embedded drivers for Intel VR11.1 Features Load transient boost LTB Technology to minimize the number of output capacitors 2 or 3-phase operation with internal driver 4-phase operation with external PWM driver signal PSI input with programmable strategy VFQFPN-48 - 7 x 7 mm Imon output 0.5% output voltage accuracy Description 8-bit programmable output up to 1.60000 V - Intel VR11.1 DAC - backward compatible with The device implements a two-to-four phases step- VR10/VR11 down controller with three integrated high current drivers in a compact 7x7 mm body package with Full differential current sense across inductor exposed pad. Differential remote voltage sensing Load transient boost LTB Technology reduces Adjustable voltage offset system cost by providing the fastest response to LSLess startup to manage pre-biased output load transition therefore requiring less bulk and ceramic output capacitors to satisfy load transient Feedback disconnection protection requirements. Preliminary overvoltage protection The device embeds VR11.x DACs: the output Programmable overcurrent protection voltage ranges up to 1.60000 V managing D-VID Programmable overvoltage protection with 0.5% output voltage accuracy over line and Adjustable switching frequency temperature variations. SS END and OUTEN signal The controller assures fast protection against load overcurrent and under / overvoltage (in this last VFQFPN-48 7x7 mm package with exposed case also before UVLO). Feedback disconnection pad prevents from damaging the load in case of disconnections in the system board. Applications In case of overcurrent, the system works in High current VRM/VRD for desktop / server / constant current mode until UVP. workstation CPUs High density DC/DC converters Table 1. Device summary Order codes Package Packing L6716 Tray VFQFPN-48 L6716TR Tape and reel January 2010 Doc ID 14521 Rev 3 1/57 www.st.com 57 Contents L6716 Contents 1 Principle application circuit and block diagram . 4 1.1 Principle application circuit . 4 1.2 Block diagram . 7 2 Pin description and connection diagram 8 2.1 Pin description 8 3 Maximum ratings . 13 3.1 Absolute maximum ratings 13 3.2 Thermal data 13 4 Electrical characteristics 14 4.1 Electrical characteristics 14 5 Voltage identifications 17 6 Device description . 20 7 DAC and Phase number selection 21 8 Power dissipation 22 9 Current reading and current sharing loop 23 10 Differential remote voltage sensing . 25 11 Voltage positioning . 26 11.1 Offset (optional) 26 11.2 Droop function . 27 12 Droop thermal compensation 28 13 Output current monitoring (IMON) . 29 14 Load transient boost technology 31 2/57 Doc ID 14521 Rev 3