SPBTLE-RF Very low power network processor module for Bluetooth low energy v4.1 Datasheet - production data On-board chip antenna Operating supply voltage: from 1.7 to 3.6 V Operating temperature range: -40 C to 85 C Applications Watches Fitness, wellness and sports Consumer medical Security/proximity Remote control Home and industrial automation Features Assisted living Mobile phone peripherals Bluetooth v4.1 compliant PC peripherals Supports master and slave modes Multiple roles supported simultaneously Description Embedded Bluetooth low energy protocol stack GAP, GATT, SM, L2CAP, LL, RFPHY The SPBTLE-RF is an easy to use Bluetooth low energy master/slave network processor module, Bluetooth low energy profiles provided compliant with Bluetooth v4.1. The SPBTLE-RF separately module supports multiple roles simultaneously, Bluetooth radio performance: and can act at the same time as Bluetooth low Embedded ST BlueNRG-MS energy sensor and hub device. Tx power: + 4 dBm The entire Bluetooth low energy stack and Rx sensitivity: - 88 dBm protocols are embedded into SPBTLE-RF Provides up to 92 dB link budget with module. The external host application processor, excellent link reliability where the application resides, is connected to the Host interface SPBTLE-RF module through a standard SPI interface. SPI, IRQ, and RESET On-field stack upgrading available via SPI The SPBTLE-RF module provides a complete RF platform in a tiny form factor. Radio, antenna, high AES security co-processor frequency and LPO oscillators are integrated to Certification offer a certified solution to optimize the time to CE qualified market of the final applications. FCC, IC modular approval certified The SPBTLE-RF can be powered directly with a TELEC standard 3 V coin cell battery, a pair of AAA BQE qualified batteries or any power source from 1.7 to 3.6 V. January 2021 DocID027851 Rev 11 1/24 This is information on a product in full production. www.st.comContents SPBTLE-RF Contents 1 General description 3 2 Block diagram 4 3 Software architecture 5 3.1 Bluetooth firmware implementation 5 4 Hardware specifications 6 4.1 Absolute maximum ratings . 6 4.2 Recommended operating conditions . 6 4.3 Current consumption . 6 4.4 Current consumption comparison . 7 4.5 Pin assignment . 10 4.6 Mechanical dimensions .11 5 Hardware design . 13 5.1 Reflow soldering 13 6 Regulatory compliance 15 6.1 FCC certification 15 6.1.1 Labeling instructions . 15 6.1.2 Product manual instructions . 16 6.2 IC certification 16 6.2.1 Labeling instructions . 17 6.2.2 Product manual instructions . 18 6.3 CE certification . 18 6.4 Bluetooth certification 19 6.5 TELEC certification 19 7 Ordering information . 20 8 Package information 21 9 Traceability 21 2/24 DocID027851 Rev 11