VN771KPTR-E STMicroelectronics

VN771KP-E Quad smart power solid state relay for complete H-bridge configurations Datasheet - production data Description The VN771KP-E is a device formed by three monolithic chips housed in a standard SO-28 package: a double high-side and two low-side switches. Both the double high-side and low-side switches are made using STMicroelectronics VIPower M0-3 Technology. 62 This device is suitable to drive a DC motor in a &)7 * 3* bridge configuration as well as to be used as a quad switch for any low voltage application. The dual high-side switches have built-in thermal Features shutdown to protect the chips from overtemperature and current limiter blocks to Type R I V DS(on) OUT CC protect the device from short circuit. Status output is provided to indicate open-load in OFF and (1) (2) VN771KP-E 95 m 9 A 36 V ON-state and overtemperature. 1. Total resistance of one side in bridge configuration The low-side switches are two OMNIFET II types 2. Typical current limitation value (fully auto protected Power MOSFET in VIPower technology). They have built-in thermal shutdown, ECOPACK : lead free and RoHS compliant linear current limitation and overvoltage clamping. Automotive Grade: compliant with AEC Fault feedback for thermal intervention can be guidelines detected by monitoring the voltage at the input pin. Suited as low voltage bridge Linear current limitation Very low standby power dissipation Short circuit protected Status flag diagnostic (open drain) Integrated clamping circuits Undervoltage protection ESD protection Table 1. Device summary Order codes Package Tube Tape and reel SO-28 VN771KP-E VN771KPTR-E February 2015 DocID018896 Rev 3 1/34 This is information on a product in full production. www.st.comContents VN771KP-E Contents 1 Block diagrams and pins descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2 Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.1 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.2 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.3 Electrical characteristics for dual high side switch . . . . . . . . . . . . . . . . . . . 9 2.4 Electrical characteristics for low side switches . . . . . . . . . . . . . . . . . . . . . .11 2.5 Dual high-side switch timing data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 2.6 Electrical characterization for dual high-side switch . . . . . . . . . . . . . . . . . 16 2.7 Electrical characterization for low-side switches . . . . . . . . . . . . . . . . . . . 19 3 Application recommendations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 4 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 4.1 SO-28 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 4.2 Thermal calculation in clockwise and anti-clockwise operation in steady state mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 4.2.1 Thermal resistances definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 4.2.2 Thermal calculation in transient mode . . . . . . . . . . . . . . . . . . . . . . . . . 27 4.2.3 Single pulse thermal impedance definition . . . . . . . . . . . . . . . . . . . . . . 27 4.2.4 Pulse calculation formula . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 5 Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 5.1 SO-28 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 5.2 SO-28 Packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 6 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 2/34 DocID018896 Rev 3