TLP2368(E(O Toshiba

TLP2368 Photocouplers GaAAs Infrared LED & Photo IC TLP2368TLP2368TLP2368TLP2368 1. 1. ApplicationsApplications 1. 1. ApplicationsApplications Factory Automation (FA) Plasma Display Panels (PDPs) Measuring Instruments 2. 2. 2. 2. GeneralGeneralGeneralGeneral The Toshiba TLP2368 consists of a high-output GaAAs light-emitting diode coupled with integrated high gain, high-speed photodetectors. The TLP2368 guarantees operation at up to 125 and on supplies from 2.7 V to 5.5 V. It is housed in the SO6 package. The TLP2368 has an internal Faraday shield that provides a guaranteed common-mode transient immunity of 20 kV/s. 3. 3. FeaturesFeatures 3. 3. FeaturesFeatures (1) Inverter logic type (open collector output) (2) Package: SO6 (3) Operating temperature: -40 to 125 (4) Supply voltage: 2.7 to 5.5 V (5) Data transfer rate: 20 MBd (typ.) (NRZ) (6) Threshold input current: 5.0 mA (max) (7) Supply current: 4 mA (max) (8) Common-mode transient immunity: 20 kV/s (min) (9) Isolation voltage: 3750 Vrms (min) (10) Safety standards UL-approved: UL1577, File No.E67349 cUL-approved: CSA Component Acceptance Service No.5A File No.E67349 (Note 1) VDE-approved: EN60747-5-5, EN60065 or EN60950-1 (Note 1)(Note 1)(Note 1) CQC-approved: GB4943.1, GB8898 Thailand Factory Note 1: When a VDE approved type is needed, please designate the Option (V4)Option (V4)Option (V4)Option (V4). Start of commercial production 2011-05 2015 Toshiba Corporation 2015-12-18 1 Rev.6.0TLP2368 4. 4. 4. 4. Packaging and Pin ConfigurationPackaging and Pin ConfigurationPackaging and Pin ConfigurationPackaging and Pin Configuration 1: Anode 3: Cathode 4: GND 5: V (Output) O 6: V CC 11-4L1S 5. 5. 5. 5. Internal CircuitInternal CircuitInternal CircuitInternal Circuit 6. Principle of Operation 6. 6. 6. Principle of OperationPrinciple of OperationPrinciple of Operation 6.1. 6.1. 6.1. 6.1. Truth TableTruth TableTruth TableTruth Table Input LED Output H ON L L OFF H 6.2. Mechanical Parameters 6.2. 6.2. 6.2. Mechanical ParametersMechanical ParametersMechanical Parameters Characteristics Min Unit Creepage distances 5.0 mm Clearance distances 5.0 Internal isolation thickness 0.4 2015 Toshiba Corporation 2015-12-18 2 Rev.6.0