Work-In-Progress SUM90330E www.vishay.com Vishay Siliconix N-Channel 200 V (D-S) 175 C MOSFET FEATURES TO-263 ThunderFET power MOSFET Low R - Q figure-of-merit (FOM) DS g Maximum 175 C junction temperature 100 % R and UIS tested g Material categorization: for definitions of compliance please see www.vishay.com/doc 99912 SS DD GG APPLICATIONS D Top View Synchronous rectification Power supplies PRODUCT SUMMARY DC/AC inverter V (V) 200 DS G DC/DC converter R max. ( ) at V = 10 V 0.0375 DS(on) GS Solar micro inverter R max. ( ) at V = 7.5 V 0.0422 DS(on) GS Motor drive switch Q typ. (nC) 21 g S I (A) 35.1 D N-Channel MOSFET Configuration Single ORDERING INFORMATION Package TO-263 Lead (Pb)-free and halogen-free SUM90330E-GE3 ABSOLUTE MAXIMUM RATINGS (T = 25 C, unless otherwise noted) A PARAMETER SYMBOL LIMIT UNIT Drain-source voltage V 200 DS V Gate-source voltage V 20 GS T = 25 C 35.1 C Continuous drain current I D T = 125 C 20.3 C Pulsed drain current (t = 100 s) I 70 A DM Continuous source-drain diode current I 12.5 S a Single pulse avalanche current I 33 AS L = 0.1 mH a Single pulse avalanche energy E 54.45 mJ AS b T = 25 C 125 C Maximum power dissipation P W D b T = 125 C 41.7 C Operating junction and storage temperature range T , T -55 to +175 J stg C c Soldering recommendations (peak temperature) 260 THERMAL RESISTANCE RATINGS PARAMETER SYMBOL MAXIMUM UNIT c Maximum junction-to-ambient (PCB mount) R 40 thJA C/W Maximum junction-to-case (drain) Steady state R 1.2 thJC Notes a. Duty cycle 1 % b. See SOA curve for voltage derating c. When mounted on 1 square PCB (FR4 material) SPending-Rev. B, 06-Sep-17 Document Number: 74505 1 For technical questions, contact: pmostechsupport vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc 91000Work-In-Progress SUM90330E www.vishay.com Vishay Siliconix SPECIFICATIONS (T = 25 C, unless otherwise noted) J PARAMETER SYMBOL TEST CONDITIONS MIN.TYP.MAX.UNIT Static Drain-source breakdown voltage V V = 0 V, I = 250 A 200 - - V DS GS D Gate-source threshold voltage V V = V , I = 250 A 2 - 4 V GS(th) DS GS D Gate-source leakage I V = 0 V, V = 20 V - - 250 nA GSS DS GS V = 200 V, V = 0 V - - 1 DS GS A Zero gate voltage drain current I V = 200 V, V = 0 V, T = 125 C - - 150 DSS DS GS J V = 200 V, V = 0 V, T = 175 C - - 5 mA DS GS J a On-state drain current I V 10 V, V = 10 V 20 - - A D(on) DS GS V = 10 V, I = 12.2 A - 0.0312 0.0375 GS D a Drain-source on-state resistance R DS(on) V = 7.5 V, I = 11.5 A - 0.0337 0.0422 GS D a Forward transconductance g V = 15 V, I = 10 A - 28 - S fs DS D b Dynamic Input capacitance C - 1172 - iss Output capacitance C V = 100 V, V = 0 V, f = 1 MHz - 150 - pF oss DS GS Reverse transfer capacitance C -11 - rss Total gate charge Q -21 32 g Gate-source charge Q V = 100 V, V =10 V, I = 12.2 A -6 - nC gs DS GS D Gate-drain charge Q -5.3 - gd Gate resistance R f = 1 MHz 0.76 3.8 7.6 g Turn-on delay time t -12 24 d(on) Rise time t -25 50 V = 100 V, R = 14.2 , I 7 A, r DD L D ns V = 10 V, R = 1 Turn-off delay time t GEN g -30 50 d(off) Fall time t -22 44 f Drain-Source Body Diode Characteristics Pulse diode forward current (t = 100 s) I -- 70 A SM Body diode voltage V I = 7 A, V = 0 V - 0.8 1.5 V SD F GS Body diode reverse recovery time t - 111 170 ns rr Body diode reverse recovery charge Q -0.51 1 C rr I = 7 A, di/dt = 100 A/s F Reverse recovery fall time t -94 - a ns Reverse recovery rise time t -17 - b Body diode peak reverse recovery charge I -8.5 17 A RM(REC) Notes a. Pulse test pulse width 300 s, duty cycle 2 % b. Guaranteed by design, not subject to production testing c. Independent of operating temperature Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. SPending-Rev. B, 06-Sep-17 Document Number: 74505 2 For technical questions, contact: pmostechsupport vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc 91000