Product Information

W25M02GWZEIG

W25M02GWZEIG electronic component of Winbond

Datasheet
Multichip Packages 2G-bit Serial NAND flash, 1.8V

Manufacturer: Winbond
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

480: USD 4.3659 ea
Line Total: USD 2095.63

0 - Global Stock
MOQ: 480  Multiples: 1
Pack Size: 1
Availability Price Quantity
0 - Global Stock


Ships to you between Fri. 03 May to Thu. 09 May

MOQ : 480
Multiples : 1

Stock Image

W25M02GWZEIG
Winbond

480 : USD 6.2619
500 : USD 6.2291
1000 : USD 6.195
2000 : USD 6.1609
2500 : USD 6.1254
3000 : USD 6.0913
4000 : USD 6.0559
5000 : USD 6.0204
10000 : USD 5.9837
20000 : USD 5.9483

0 - Global Stock


Ships to you between Thu. 09 May to Mon. 13 May

MOQ : 126
Multiples : 126

Stock Image

W25M02GWZEIG
Winbond

126 : USD 5.8684
252 : USD 5.8322
504 : USD 5.4699
1008 : USD 5.3855
2520 : USD 5.3009
5040 : USD 5.1077
10080 : USD 5.0353

     
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Type
Memory Size
Package / Case
Series
Mounting Style
Maximum Clock Frequency
Minimum Operating Temperature
Maximum Operating Temperature
Organization
Packaging
Brand
Interface Type
Data Bus Width
Product Type
Factory Pack Quantity :
Subcategory
Supply Voltage - Max
Supply Voltage - Min
Tradename
LoadingGif

Notes:- Show Stocked Products With Similar Attributes.
Image Description
W25N01GVZEIG electronic component of Winbond W25N01GVZEIG

3V 1G-BITSERIAL SLC NAND FLASH MEMORY WITHDUAL/QUAD SPI/CONTINUOUS READ
Stock : 13164

W25N01GVZEIG TR electronic component of Winbond W25N01GVZEIG TR

NAND Flash 1G-bit Serial NAND flash, 3V
Stock : 2948

W25M512JVFIQ electronic component of Winbond W25M512JVFIQ

Multichip Packages spiFlash, 512M-bit, 4Kb Uniform Sector
Stock : 6369

W25M512JVBIQ electronic component of Winbond W25M512JVBIQ

Multichip Packages spiFlash, 512M-bit, 4Kb Uniform Sector
Stock : 81

W25M512JVEIQ electronic component of Winbond W25M512JVEIQ

Multichip Packages spiFlash, 512M-bit, 4Kb Uniform Sector
Stock : 120

W25M02GWZEIT electronic component of Winbond W25M02GWZEIT

Multichip Packages 2G-bit Serial NAND flash, 1.8V
Stock : 0

W25N01GVSFIT electronic component of Winbond W25N01GVSFIT

NAND Flash 1G-bit Serial NAND flash, 3V
Stock : 0

W25N01GVSFIG electronic component of Winbond W25N01GVSFIG

NAND Flash 1G-bit Serial NAND flash, 3V
Stock : 599

W25M161AVEIT electronic component of Winbond W25M161AVEIT

Multichip Packages 1Gb Serial NAND flash 3V + 16Mb Serial Flash 3V MCP
Stock : 3968

W25N01GVZEIT electronic component of Winbond W25N01GVZEIT

NAND Flash 1G-bit Serial NAND flash, 3V
Stock : 125

Image Description
BLE-NFC-V2 electronic component of NXP BLE-NFC-V2

Bluetooth Development Tools (802.15.1) BLE-NFC-V2
Stock : 2

UR2L610011-SWH electronic component of Advantech UR2L610011-SWH

Routers UR5i v2 Libratum set SWH
Stock : 1

MT28EW01GABA1HPC-0AAT TR electronic component of Micron MT28EW01GABA1HPC-0AAT TR

NOR Flash EW-SERIES FLASH NOR SLC 64MX16 LBGA
Stock : 2000

CYBT-343151-02 electronic component of Infineon CYBT-343151-02

Bluetooth Modules (802.15.1) BLE 5.0 Module CYW20706
Stock : 1756

XBIB-CU-TH electronic component of Digi International XBIB-CU-TH

Zigbee Development Tools - 802.15.4 XBee Interface Board, USB-C, Through-Hole
Stock : 39

1120780001 electronic component of Molex 1120780001

Gateways PLC;SERIAL;CLX;4CHL
Stock : 1

CYW920819EVB-02 electronic component of Infineon CYW920819EVB-02

Bluetooth Development Tools (802.15.1) CYW20819 BLE Mesh 5.0 Kit
Stock : 0

NOVA-U201 electronic component of Hologram NOVA-U201

Modems Hologram Nova Global 3G/2G Cellular USB Modem
Stock : 214

W25Q128JVEIM TR electronic component of Winbond W25Q128JVEIM TR

NOR Flash spiFlash, 3V, 128M-bit, 4Kb Uniform Sector, DTR
Stock : 5543

MT28EW256ABA1LPC-0SIT TR electronic component of Micron MT28EW256ABA1LPC-0SIT TR

NOR Flash EW-SERIES FLASH NOR SLC 16MX16 LBGA
Stock : 0

W25M02GW Featuring 1.8V 2G-BIT (2 x 1G-BIT) SERIAL SLC NAND FLASH MEMORY WITH DUAL/QUAD SPI BUFFER READ & CONTINUOUS READ CONCURRENT OPERATIONS Publication Release Date: January 22, 2019 Revision D W25M02GW Table of Contents 1. GENERAL DESCRIPTIONS ............................................................................................................. 6 2. FEATURES ....................................................................................................................................... 6 3. PACKAGE TYPES AND PIN CONFIGURATIONS .......................................................................... 7 3.1 Pad Configuration WSON 8x6-mm ...................................................................................... 7 3.2 Pad Description WSON 8x6-mm .......................................................................................... 7 3.3 Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array) ................................................. 8 3.4 Ball Description TFBGA 8x6-mm ......................................................................................... 8 4. PIN DESCRIPTIONS ........................................................................................................................ 9 4.1 Serial MCP (SpiStack ) Device Configuration ..................................................................... 9 4.2 Chip Select (/CS) .................................................................................................................. 9 4.3 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) .................................... 9 4.4 Write Protect (/WP) ............................................................................................................... 9 4.5 HOLD (/HOLD) ................................................................................................................... 10 4.6 Serial Clock (CLK) .............................................................................................................. 10 5. SINGLE DIE (W25N01GW) BLOCK DIAGRAM ............................................................................. 11 6. FUNCTIONAL DESCRIPTIONS ..................................................................................................... 12 6.1 Device Operation Flow ....................................................................................................... 12 6.1.1 Stacked Die Operations ........................................................................................................ 12 6.1.2 Standard SPI Instructions ..................................................................................................... 12 6.1.3 Dual SPI Instructions ............................................................................................................ 13 6.1.4 Quad SPI Instructions ........................................................................................................... 13 6.1.5 Hold Function ........................................................................................................................ 13 6.2 Write Protection .................................................................................................................. 14 7. PROTECTION, CONFIGURATION AND STATUS REGISTERS .................................................. 15 7.1 Protection Register / Status Register-1 (Volatile Writable, OTP lockable) ......................... 15 7.1.1 Block Protect Bits (BP3, BP2, BP1, BP0, TB) Volatile Writable, OTP lockable .................. 15 7.1.2 Write Protection Enable Bit (WP-E) Volatile Writable, OTP lockable ................................. 16 7.1.3 Status Register Protect Bits (SRP1, SRP0) Volatile Writable, OTP lockable ..................... 16 7.2 Configuration Register / Status Register-2 (Volatile Writable) ........................................... 17 7.2.1 One Time Program Lock Bit (OTP-L) OTP lockable .......................................................... 17 7.2.2 Enter OTP Access Mode Bit (OTP-E) Volatile Writable ..................................................... 17 7.2.3 Status Register-1 Lock Bit (SR1-L) OTP lockable ............................................................. 17 7.2.4 ECC Enable Bit (ECC-E) Volatile Writable ......................................................................... 17 7.2.5 Buffer Read / Continuous Read Mode Bit (BUF) Volatile Writable ..................................... 18 7.3 Status Register-3 (Status Only) .......................................................................................... 19 7.3.1 Look-Up Table Full (LUT-F) Status Only ............................................................................ 19 7.3.2 Cumulative ECC Status (ECC-1, ECC-0) Status Only ....................................................... 19 7.3.3 Program/Erase Failure (P-FAIL, E-FAIL) Status Only ........................................................ 20 7.3.4 Write Enable Latch (WEL) Status Only .............................................................................. 20 7.3.5 Erase/Program In Progress (BUSY) Status Only ............................................................... 20 7.3.6 Reserved Bits Non Functional ........................................................................................... 20 7.4 Single Die W25N01GW Status Register Memory Protection ............................................. 21 8. INSTRUCTIONS ............................................................................................................................. 22 - 1 -

Tariff Desc

8542.32.00 31 No ..Random Access Memory (RAM) including Single Inline Memory Modules (SIMMS), Dual Inline Memory Modules (DIMMS), Dynamic Random Access Memory (DRAM), Synchronous Dynamic Random Access Memory (SD RAM), Rambus Dynamic Random Access Memory (RD RAM) and other similar memory
Winbond Elec
WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA

Looking for help? Visit our FAQ's Section to answer to all your questions

 

X-ON Worldwide Electronics

Welcome To X-ON ELECTRONICS
For over three decades, we have been advocating and shaping the electronic components industry. Our management complements our worldwide business scope and focus. We are committed to innovation, backed by a strong business foundation. If you need a trustworthy supplier of electronic components for your business – look no further.
 

Copyright ©2024  X-ON Electronic Services. All rights reserved.
Please ensure you have read and understood our Terms & Conditions before purchasing.
All prices exclude GST.

Image for all the cards that are accepted Image for all the cards that are accepted Image for all the cards that are accepted Image for all the cards that are accepted Image for all the cards that are accepted