Product Information

W25N01GVZEIT

W25N01GVZEIT electronic component of Winbond

Datasheet
NAND Flash 1G-bit Serial NAND flash, 3V

Manufacturer: Winbond
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 3.9123 ea
Line Total: USD 3.9123

121 - Global Stock
Ships to you between
Wed. 10 Apr to Fri. 12 Apr
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
130 - Global Stock


Ships to you between Wed. 10 Apr to Fri. 12 Apr

MOQ : 1
Multiples : 1

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W25N01GVZEIT
Winbond

1 : USD 3.9123
10 : USD 3.5501
100 : USD 3.1033
252 : USD 2.9825
504 : USD 2.9101
1008 : USD 2.8256
2520 : USD 2.7652
5040 : USD 2.6324
10017 : USD 2.6082

     
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RoHS - XON
Icon ROHS
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Data Bus Width
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Supply Voltage - Max
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W25N01GVxxIG/IT 3V 1G-BIT SERIAL SLC NAND FLASH MEMORY WITH DUAL/QUAD SPI BUFFER READ & CONTINUOUS READ Publication Release Date: May 09, 2018 Revision L W25N01GVxxIG/IT Table of Contents 1. GENERAL DESCRIPTIONS ............................................................................................................. 6 2. FEATURES ....................................................................................................................................... 6 3. PACKAGE TYPES AND PIN CONFIGURATIONS .......................................................................... 7 3.1 Pad Configuration WSON 8x6-mm ...................................................................................... 7 3.2 Pad Description WSON 8x6-mm .......................................................................................... 7 3.3 Pin Configuration SOIC 300-mil ........................................................................................... 8 3.4 Pin Description SOIC 300-mil ............................................................................................... 8 3.5 Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array) ................................................. 9 3.6 Ball Description TFBGA 8x6-mm ......................................................................................... 9 4. PIN DESCRIPTIONS ...................................................................................................................... 10 4.1 Chip Select (/CS) ................................................................................................................ 10 4.2 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) .................................. 10 4.3 Write Protect (/WP) ............................................................................................................. 10 4.4 HOLD (/HOLD) ................................................................................................................... 10 4.5 Serial Clock (CLK) .............................................................................................................. 10 5. BLOCK DIAGRAM .......................................................................................................................... 11 6. FUNCTIONAL DESCRIPTIONS ..................................................................................................... 12 6.1 Device Operation Flow ....................................................................................................... 12 6.1.1 Standard SPI Instructions ..................................................................................................... 12 6.1.2 Dual SPI Instructions ............................................................................................................ 12 6.1.3 Quad SPI Instructions ........................................................................................................... 13 6.1.4 Hold Function ........................................................................................................................ 13 6.2 Write Protection .................................................................................................................. 14 7. PROTECTION, CONFIGURATION AND STATUS REGISTERS .................................................. 15 7.1 Protection Register / Status Register-1 (Volatile Writable, OTP lockable) ......................... 15 7.1.1 Block Protect Bits (BP3, BP2, BP1, BP0, TB) Volatile Writable, OTP lockable .................. 15 7.1.2 Write Protection Enable Bit (WP-E) Volatile Writable, OTP lockable ................................. 16 7.1.3 Status Register Protect Bits (SRP1, SRP0) Volatile Writable, OTP lockable ..................... 16 7.2 Configuration Register / Status Register-2 (Volatile Writable) ........................................... 17 7.2.1 One Time Program Lock Bit (OTP-L) OTP lockable .......................................................... 17 7.2.2 Enter OTP Access Mode Bit (OTP-E) Volatile Writable ..................................................... 17 7.2.3 Status Register-1 Lock Bit (SR1-L) OTP lockable ............................................................. 17 7.2.4 ECC Enable Bit (ECC-E) Volatile Writable ......................................................................... 18 7.2.5 Buffer Read / Continuous Read Mode Bit (BUF) Volatile Writable ..................................... 18 7.3 Status Register-3 (Status Only) .......................................................................................... 19 7.3.1 Look-Up Table Full (LUT-F) Status Only ............................................................................ 19 7.3.2 Cumulative ECC Status (ECC-1, ECC-0) Status Only ....................................................... 19 7.3.3 Program/Erase Failure (P-FAIL, E-FAIL) Status Only ........................................................ 20 7.3.4 Write Enable Latch (WEL) Status Only .............................................................................. 20 7.3.5 Erase/Program In Progress (BUSY) Status Only ............................................................... 20 7.3.6 Reserved Bits Non Functional ........................................................................................... 20 7.4 W25N01GV Status Register Memory Protection ............................................................... 21 - 1 -

Tariff Desc

8542.32.00 32 No ..CMOS and MOS Read Only Memory and Programmable Read Only Memory whether erasable or non-erasable (for example, flash memory, EPROM, E2PROM, EAPROM, NOVRAM, ROM and PROM)
Winbond Elec
WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA

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