Product Information

W25M161AVEIT

W25M161AVEIT electronic component of Winbond

Datasheet
Multichip Packages 1Gb Serial NAND flash 3V + 16Mb Serial Flash 3V MCP
Manufacturer: Winbond
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 0.8673 ea
Line Total: USD 0.87

3848 - Global Stock
Ships to you between
Fri. 03 May to Thu. 09 May
MOQ: 1  Multiples: 1
Pack Size: 1

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Availability Price Quantity
3848 - Global Stock


Ships to you between Fri. 03 May to Thu. 09 May

MOQ : 1
Multiples : 1

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W25M161AVEIT
Winbond

1 : USD 0.8673

Read More Specifications

     
Manufacturer
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RoHS - XON
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Type
Memory Size
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Series
Mounting Style
Maximum Clock Frequency
Minimum Operating Temperature
Maximum Operating Temperature
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Additional Infomation About Product

W25M161AV Featuring SERIAL MCP FLASH MEMORY With Multi I/O SPI & Concurrent Operations 3V 16M-bit Serial NOR Flash Memory & 3V 1G-bit Serial NAND Flash Memory Publication Release Date: August 24, 2016 Preliminary Revision A W25M161AV Table of Contents 1. GENERAL DESCRIPTIONS ............................................................................................................. 2 2. FEATURES ....................................................................................................................................... 3 3. PACKAGE TYPES AND PIN CONFIGURATIONS .......................................................................... 4 3.1 Pad Configuration WSON 8x6-mm ...................................................................................... 4 3.2 Pad Description WSON 8x6-mm .......................................................................................... 4 4. DEVICE CONFIGURATION & PIN DESCRIPTIONS ....................................................................... 5 4.1 Serial MCP (SpiStack ) Device Configuration ..................................................................... 5 4.2 Chip Select (/CS) .................................................................................................................. 5 4.3 Serial Input & Output (DI, DO and IO0, IO1, IO2, IO3) ........................................................ 5 4.4 Serial Clock (CLK) ................................................................................................................ 6 5. CONCURRENT OPERATION DESCRIPTIONS .............................................................................. 6 6. SOFTWARE DIE SELECT (C2H) INSTRUCTION ........................................................................... 7 7. SOFTWARE RESET......................................................................................................................... 8 7.1.1 Enable Reset (66h) and Reset Device (99h) .......................................................................... 9 7.1.2 Device Reset (FFh) ................................................................................................................. 9 8. PACKAGE SPECIFICATIONS ....................................................................................................... 10 8.1 8-Pad WSON 8x6-mm (Package Code E) ......................................................................... 10 9. ORDERING INFORMATION .......................................................................................................... 11 9.1 Valid Part Numbers and Top Side Marking ........................................................................ 12 10. REVISION HISTORY ...................................................................................................................... 13 - 1 -

HS Compliance

Tariff Desc

8542.32.00 31 No ..Random Access Memory (RAM) including Single Inline Memory Modules (SIMMS), Dual Inline Memory Modules (DIMMS), Dynamic Random Access Memory (DRAM), Synchronous Dynamic Random Access Memory (SD RAM), Rambus Dynamic Random Access Memory (RD RAM) and other similar memory

Winbond may also be referenced as

Winbond Elec
WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA

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