Product Information

W25N01JWSFIT

W25N01JWSFIT electronic component of Winbond

Datasheet
NAND Flash 1G-bit Serial NAND flash, 1.8V

Manufacturer: Winbond
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 6.3169 ea
Line Total: USD 6.32

201 - Global Stock
Ships to you between
Thu. 09 May to Mon. 13 May
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
134 - Global Stock


Ships to you between Thu. 09 May to Mon. 13 May

MOQ : 1
Multiples : 1

Stock Image

W25N01JWSFIT
Winbond

1 : USD 4.3355
10 : USD 3.933
100 : USD 3.5995
176 : USD 3.473
528 : USD 3.3925
1056 : USD 3.3005
2640 : USD 3.2085
5104 : USD 3.0705
10032 : USD 3.0245

     
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Mounting Style
Series
Memory Size
Interface Type
Supply Voltage - Max
Brand
Moisture Sensitive
Product Type
Factory Pack Quantity :
Subcategory
Tradename
LoadingGif

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W25N01JWxxIG/IT 1.8V 1G-BIT SERIAL SLC NAND FLASH MEMORY DUAL/QUAD SPI WITH 166MHZ STR & 80MHZ DTR BUFFER READ & CONTINUOUS READ th Release Date: October 10 , 2019 Revision A W25N01JWxxIG/IT Table of Contents 1. GENERAL DESCRIPTIONS ....................................................................................................... 6 2. FEATURES ................................................................................................................................. 6 3. PACKAGE TYPES AND PIN CONFIGURATIONS .................................................................... 7 3.1 Pad Configuration WSON 8x6-mm ................................................................................ 7 3.2 Pad Description WSON 8x6-mm .................................................................................... 7 3.3 Pin Configuration SOIC 300-mil ..................................................................................... 8 3.4 Pin Description SOIC 300-mil ......................................................................................... 8 3.5 Ball Configuration TFBGA 8x6-mm (5x5-1 Ball Array) ................................................... 9 3.6 Ball Description TFBGA 8x6-mm ................................................................................... 9 4. PIN DESCRIPTIONS ................................................................................................................ 10 4.1 Chip Select (/CS) .......................................................................................................... 10 4.2 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) ............................ 10 4.3 Write Protect (/WP) ....................................................................................................... 10 4.4 HOLD (/HOLD) ............................................................................................................. 10 4.5 Serial Clock (CLK) ........................................................................................................ 10 4.6 Reset (/RESET) ............................................................................................................ 10 5. BLOCK DIAGRAM .................................................................................................................... 11 6. FUNCTIONAL DESCRIPTIONS ............................................................................................... 12 6.1 Device Operation Flow ................................................................................................. 12 6.1.1 Standard SPI Instructions .............................................................................................. 12 6.1.2 Dual SPI Instructions...................................................................................................... 12 6.1.3 Quad SPI Instructions .................................................................................................... 13 6.1.4 DTR Read Instructions ................................................................................................... 13 6.1.5 Hold Function ................................................................................................................. 13 6.1.6 Software Reset & Hardware /RESET pin ....................................................................... 13 6.2 Write Protection ............................................................................................................ 14 6.3 DLP (Data Learning Pattern) ........................................................................................ 15 6.4 Interface states ............................................................................................................. 16 7. PROTECTION, CONFIGURATION AND STATUS REGISTERS ............................................ 17 7.1 Protection Register / Status Register-1 (Volatile Writable, OTP lockable) ................... 17 7.1.1 Block Protect Bits (BP3, BP2, BP1, BP0, TB) Volatile Writable, OTP lockable ........... 17 7.1.2 Write Protection Enable Bit (WP-E) Volatile Writable, OTP lockable .......................... 18 7.1.3 Status Register Protect Bits (SRP1, SRP0) Volatile Writable, OTP lockable .............. 18 7.2 Configuration Register / Status Register-2 (Volatile Writable ...................................... 19 7.2.1 One Time Program Lock Bit (OTP-L) OTP lockable.................................................... 19 7.2.2 Enter OTP Access Mode Bit (OTP-E) Volatile Writable .............................................. 19 7.2.3 Status Register-1 Lock Bit (SR1-L) OTP lockable ....................................................... 19 7.2.4 ECC Enable Bit (ECC-E) Volatile Writable .................................................................. 20 7.2.5 Buffer Read / Continuous Read Mode Bit (BUF) Volatile Writable .............................. 20 7.2.6 Quad Enable (QE) Volatile Writable ............................................................................ 20 7.3 Status Register-3 (Status only) .................................................................................... 21 7.3.1 Look-Up Table Full (LUT-F) Status Only ..................................................................... 21 7.3.2 Cumulative ECC Status (ECC-1, ECC-0) Status Only ................................................ 21 7.3.3 Program/Erase Failure (P-FAIL, E-FAIL) Status Only ................................................. 22 th Release Date: October 10 , 2019 - 1 - Revision A

Tariff Desc

8542.32.00 32 No ..CMOS and MOS Read Only Memory and Programmable Read Only Memory whether erasable or non-erasable (for example, flash memory, EPROM, E2PROM, EAPROM, NOVRAM, ROM and PROM)
Winbond Elec
WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA

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