Product Information

W9812G6KH-6

W9812G6KH-6 electronic component of Winbond

Datasheet
DRAM Chip SDRAM 128Mbit 8Mx16 3.3V 54-Pin TSOP-II

Manufacturer: Winbond
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

6: USD 1.0956 ea
Line Total: USD 6.57

776 - Global Stock
Ships to you between
Fri. 26 Apr to Thu. 02 May
MOQ: 6  Multiples: 1
Pack Size: 1
Availability Price Quantity
776 - Global Stock


Ships to you between Fri. 26 Apr to Thu. 02 May

MOQ : 1
Multiples : 1

Stock Image

W9812G6KH-6
Winbond

1 : USD 1.0956
10 : USD 1.0315
25 : USD 1.0212
40 : USD 1.0157
108 : USD 0.9464
324 : USD 0.9335
540 : USD 0.9149
972 : USD 0.9149
4968 : USD 0.9149

1845 - Global Stock


Ships to you between
Fri. 03 May to Wed. 08 May

MOQ : 1
Multiples : 1

Stock Image

W9812G6KH-6
Winbond

1 : USD 1.7165
10 : USD 1.468
30 : USD 1.3318
108 : USD 1.0066
540 : USD 0.9411
864 : USD 0.911

759 - Global Stock


Ships to you between Thu. 02 May to Mon. 06 May

MOQ : 1
Multiples : 1

Stock Image

W9812G6KH-6
Winbond

1 : USD 1.9205
10 : USD 1.725
108 : USD 1.5525
540 : USD 1.495
1080 : USD 1.288
2592 : USD 1.242
25056 : USD 1.242

776 - Global Stock


Ships to you between Fri. 26 Apr to Thu. 02 May

MOQ : 6
Multiples : 1

Stock Image

W9812G6KH-6
Winbond

6 : USD 1.0956
10 : USD 1.0315
25 : USD 1.0212
40 : USD 1.0157
108 : USD 0.9464
324 : USD 0.9335
540 : USD 0.9149

     
Manufacturer
Product Category
Type
Mounting Style
Package / Case
Data Bus Width
Organisation
Memory Size
Maximum Clock Frequency
Access Time
Supply Voltage - Max
Supply Voltage - Min
Supply Current - Max
Minimum Operating Temperature
Maximum Operating Temperature
Series
Hts Code
LoadingGif

Notes:- Show Stocked Products With Similar Attributes.
Image Description
W9812G6KH-6 TR electronic component of Winbond W9812G6KH-6 TR

DRAM 128Mb SDR SDRAM x16, 166MHz T&R
Stock : 0

W9816G6JH-6I electronic component of Winbond W9816G6JH-6I

DRAM Chip SDRAM 16Mbit 1Mx16 3.3V
Stock : 1317

W9825G2JB-6I electronic component of Winbond W9825G2JB-6I

DRAM Chip SDRAM 256Mbit 8Mx32 3.3V 90-Pin TFBGA
Stock : 0

W9812G6KH-6I electronic component of Winbond W9812G6KH-6I

DRAM Chip SDRAM 128Mbit 8Mx16 3.3V 54-Pin TSOP-II
Stock : 4

W9816G6JH-6 electronic component of Winbond W9816G6JH-6

DRAM Chip SDRAM 16Mbit 1Mx16 3.3V 50-Pin TSOP-II
Stock : 630

W9825G2JB-6 electronic component of Winbond W9825G2JB-6

DRAM Chip SDRAM 256Mbit 8Mx32 3.3V 90-Pin TFBGA
Stock : 0

W9825G6JB-6I electronic component of Winbond W9825G6JB-6I

DRAM 256M SDR SDRAM x16, 166MHz, Ind Temp
Stock : 0

W9825G6JB-6 electronic component of Winbond W9825G6JB-6

DRAM 256M SDR SDRAM x16, 166MHz,
Stock : 0

W9825G6KH-5 electronic component of Winbond W9825G6KH-5

DRAM 256M SDR SDRAM x16, 166MHz
Stock : 4958

W9816G6JH-7 electronic component of Winbond W9816G6JH-7

DRAM 16M SDR SDRAM 133MHz
Stock : 685

Image Description
W9712G6KB25I electronic component of Winbond W9712G6KB25I

DRAM Chip DDR2 SDRAM 128Mbit 8Mx16 1.8V 84-Pin TFBGA
Stock : 255

IS66WVC4M16ECLL-7010BLI electronic component of ISSI IS66WVC4M16ECLL-7010BLI

DRAM Pseudo SRAM, 64Mb 4Mb x16bits, CLL
Stock : 379

IS62C25616BL-45TLI electronic component of ISSI IS62C25616BL-45TLI

Memory; SRAM; 256kx16bit; 5V; 45ns; TSOP44 II; -40÷85°C
Stock : 0

IS61WV5128EDBLL-10TLI electronic component of ISSI IS61WV5128EDBLL-10TLI

Memory; SRAM; 512kx8bit; 2.4÷3.6V; 10ns; TSOP44 II; -40÷85°C
Stock : 54

IS61WV51216EDBLL-8TLI electronic component of ISSI IS61WV51216EDBLL-8TLI

Memory; SRAM; 512kx16bit; 2.4÷3.6V; 8ns; TSOP44 II; -40÷85°C
Stock : 122

IS61WV3216DBLL-10TLI electronic component of ISSI IS61WV3216DBLL-10TLI

Memory; SRAM; 32kx16bit; 2.4÷3.6V; 10ns; TSOP44 II; -40÷85°C
Stock : 125

IS61LV12824-10TQLI electronic component of ISSI IS61LV12824-10TQLI

Memory; SRAM; 128kx24bit; 3.3V; 10ns; TQFP100; -40÷85°C
Stock : 0

IS46TR16640B-15GBLA2 electronic component of ISSI IS46TR16640B-15GBLA2

DRAM Automotive (Tc: -40 to +105C), 1G, 1.5V, DDR3, 64Mx16, 1333MT/s @ 8-8-8, 96 ball BGA (9mm x13mm) RoHS
Stock : 0

IS46TR16256A-125KBLA2 electronic component of ISSI IS46TR16256A-125KBLA2

DRAM Chip DDR3 SDRAM 4Gbit 256Mx16 1.5V Automotive 96-Pin FBGA
Stock : 0

IS46R16160F-6TLA2 electronic component of ISSI IS46R16160F-6TLA2

DRAM Automotive (-40 to +105C), 256M, 2.5V, DDR1, 64Mx8, 166MHz, 66 pin TSOP-II RoHS
Stock : 63

W9812G6KH 2M 4 BANKS 16 BITS SDRAM Table of Contents- 1. GENERAL DESCRIPTION .............................................................................................................. 3 2. FEATURES ...................................................................................................................................... 3 3. ORDER INFORMATION .................................................................................................................. 3 4. PIN CONFIGURATION .................................................................................................................... 4 5. PIN DESCRIPTION ......................................................................................................................... 5 6. BLOCK DIAGRAM ........................................................................................................................... 6 7. FUNCTIONAL DESCRIPTION ........................................................................................................ 7 7.1 Power Up and Initialization ................................................................................................. 7 7.2 Programming Mode Register .............................................................................................. 7 7.3 Bank Activate Command .................................................................................................... 7 7.4 Read and Write Access Modes .......................................................................................... 7 7.5 Burst Read Command ........................................................................................................ 8 7.6 Burst Write Command ......................................................................................................... 8 7.7 Read Interrupted by a Read................................................................................................ 8 7.8 Read Interrupted by a Write ................................................................................................ 8 7.9 Write Interrupted by a Write ................................................................................................ 8 7.10 Write Interrupted by a Read ................................................................................................ 8 7.11 Burst Stop Command .......................................................................................................... 8 7.12 Addressing Sequence of Sequential Mode......................................................................... 9 7.13 Addressing Sequence of Interleave Mode .......................................................................... 9 7.14 Auto-precharge Command................................................................................................ 10 7.15 Precharge Command ........................................................................................................ 10 7.16 Self Refresh Command ..................................................................................................... 10 7.17 Power Down Mode ............................................................................................................ 11 7.18 No Operation Command ................................................................................................... 11 7.19 Deselect Command .......................................................................................................... 11 7.20 Clock Suspend Mode ........................................................................................................ 11 8. OPERATION MODE ...................................................................................................................... 12 9. ELECTRICAL CHARACTERISTICS ............................................................................................. 13 9.1 Absolute Maximum Ratings .............................................................................................. 13 9.2 Recommended DC Operating Conditions ........................................................................ 13 9.3 Capacitance ...................................................................................................................... 14 9.4 DC Characteristics ............................................................................................................ 14 9.5 AC Characteristics and Operating Condition .................................................................... 15 10. TIMING WAVEFORMS .................................................................................................................. 17 10.1 Command Input Timing ..................................................................................................... 17 10.2 Read Timing ...................................................................................................................... 18 10.3 Control Timing of Input/Output Data ................................................................................. 19 10.4 Mode Register Set Cycle .................................................................................................. 20 Publication Release Date: Feb. 22, 2017 Revision: A05 - 1 - W9812G6KH 11. OPERATING TIMING EXAMPLE .................................................................................................. 21 11.1 Interleaved Bank Read (Burst Length = 4, CAS Latency = 3) .......................................... 21 11.2 Interleaved Bank Read (Burst Length = 4, CAS Latency = 3, Auto-precharge) ............... 22 11.3 Interleaved Bank Read (Burst Length = 8, CAS Latency = 3) .......................................... 23 11.4 Interleaved Bank Read (Burst Length = 8, CAS Latency = 3, Auto-precharge) ............... 24 11.5 Interleaved Bank Write (Burst Length = 8) ....................................................................... 25 11.6 Interleaved Bank Write (Burst Length = 8, Auto-precharge) ............................................ 26 11.7 Page Mode Read (Burst Length = 4, CAS Latency = 3) ................................................... 27 11.8 Page Mode Read / Write (Burst Length = 8, CAS Latency = 3) ....................................... 28 11.9 Auto Precharge Read (Burst Length = 4, CAS Latency = 3) ............................................ 29 11.10 Auto Precharge Write (Burst Length = 4) ......................................................................... 30 11.11 Auto Refresh Cycle ........................................................................................................... 31 11.12 Self Refresh Cycle ............................................................................................................ 32 11.13 Burst Read and Single Write (Burst Length = 4, CAS Latency = 3) ................................. 33 11.14 Power Down Mode ............................................................................................................ 34 11.15 Auto-precharge Timing (Read Cycle) ............................................................................... 35 11.16 Auto-precharge Timing (Write Cycle) ............................................................................... 36 11.17 Timing Chart of Read to Write Cycle ................................................................................ 37 11.18 Timing Chart of Write to Read Cycle ................................................................................ 37 11.19 Timing Chart of Burst Stop Cycle (Burst Stop Command) ............................................... 38 11.20 Timing Chart of Burst Stop Cycle (Precharge Command) ................................................ 38 11.21 CKE/DQM Input Timing (Write Cycle) .............................................................................. 39 11.22 CKE/DQM Input Timing (Read Cycle) .............................................................................. 40 12. PACKAGE SPECIFICATION ......................................................................................................... 41 13. REVISION HISTORY ..................................................................................................................... 42 Publication Release Date: Feb. 22, 2017 Revision: A05 - 2 -

Tariff Desc

8542.32.00 -- Memories
               Monolithic integrated circuits:
Winbond Elec
WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA

Looking for help? Visit our FAQ's Section to answer to all your questions

 

X-ON Worldwide Electronics

Welcome To X-ON ELECTRONICS
For over three decades, we have been advocating and shaping the electronic components industry. Our management complements our worldwide business scope and focus. We are committed to innovation, backed by a strong business foundation. If you need a trustworthy supplier of electronic components for your business – look no further.
 

Copyright ©2024  X-ON Electronic Services. All rights reserved.
Please ensure you have read and understood our Terms & Conditions before purchasing.
All prices exclude GST.

Image for all the cards that are accepted Image for all the cards that are accepted Image for all the cards that are accepted Image for all the cards that are accepted Image for all the cards that are accepted