Product Information

W29N04GZBIBA

W29N04GZBIBA electronic component of Winbond

Datasheet
NAND Flash 4G-bit NAND flash, 1.8V, 4-bit ECC, 1.8V, x8
Manufacturer: Winbond
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
N/A

Obsolete

 More Buying Options & Price Grid(s)

Availability Price Quantity
0 - WHS 1

MOQ : 210
Multiples : 1

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W29N04GZBIBA
Winbond

210 : USD 9.9789
250 : USD 9.8792
500 : USD 9.7807
1000 : USD 9.6836
2000 : USD 9.5865
2500 : USD 9.4907
3000 : USD 9.3949
4000 : USD 9.3017
5000 : USD 9.2085
10000 : USD 9.1166
N/A

Obsolete
0 - WHS 2

MOQ : 1
Multiples : 1

Stock Image

W29N04GZBIBA
Winbond

1 : USD 10.5708
10 : USD 7.0246
25 : USD 6.8941
50 : USD 6.8506
N/A

Obsolete

Read More Specifications

     
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Mounting Style
Package / Case
Series
Memory Size
Interface Type
Organisation
Data Bus Width
Supply Voltage - Min
Supply Voltage - Max
Supply Current - Max
Minimum Operating Temperature
Maximum Operating Temperature
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Additional Infomation About Product

W29N04GW/Z W29N04GW/Z 4G-BIT 1.8V NAND FLASH MEMORY th Release Date: May 21 , 2018 1 Revision A W29N04GW/Z Table of Contents 1. GENERAL DESCRIPTION ............................................................................................................... 7 2. FEATURES ....................................................................................................................................... 7 3. PACKAGE TYPES AND PIN CONFIGURATIONS .......................................................................... 8 3.1 Pin Assignment 48 pin TSOP1 (x8) ...................................................................................... 8 3.2 Pin Assignment 63 ball VFBGA (x8) .................................................................................... 9 3.3 Pin Assignment 63 ball VFBGA (x16) ................................................................................ 10 3.4 Pin Descriptions .................................................................................................................. 11 4. PIN DESCRITPIONS ...................................................................................................................... 12 4.1 Chip Enable ( CE) .............................................................................................................. 12 4.2 Write Enable ( WE) ............................................................................................................ 12 4.3 Read Enable ( RE) ............................................................................................................ 12 4.4 Address Latch Enable (ALE) .............................................................................................. 12 4.5 Command Latch Enable (CLE) .......................................................................................... 12 4.6 Write Protect ( WP) ............................................................................................................ 12 4.7 Ready/Busy (RY/ BY) ........................................................................................................ 12 4.8 Input and Output (I/Ox) ....................................................................................................... 12 5. BLOCK DIAGRAM .......................................................................................................................... 13 6. MEMORY ARRAY ORGANIZATION .............................................................................................. 14 6.1 Array Organization (x8) ...................................................................................................... 14 6.2 Array Organization (x16) .................................................................................................... 15 7. MODE SELECTION TABLE ........................................................................................................... 16 8. COMMAND TABLE......................................................................................................................... 17 9. DEVICE OPERATIONS .................................................................................................................. 18 9.1 READ operation .................................................................................................................. 18 9.1.1 PAGE READ (00h-30h)......................................................................................................... 18 9.1.2 TWO PLANE READ (00h-00h-30h) ...................................................................................... 18 9.1.3 RANDOM DATA OUTPUT (05h-E0h) ................................................................................... 20 9.1.4 READ ID (90h) ...................................................................................................................... 21 9.1.5 READ PARAMETER PAGE (ECh) ....................................................................................... 22 9.1.6 READ STATUS (70h)............................................................................................................ 24 9.1.7 READ STATUS ENHANCED (78h) ...................................................................................... 25 9.1.8 READ UNIQUE ID (EDh) ...................................................................................................... 27 9.2 PROGRAM operation ......................................................................................................... 28 9.2.1 PAGE PROGRAM (80h-10h) ................................................................................................ 28 9.2.2 SERIAL DATA INPUT (80h) .................................................................................................. 28 9.2.3 RANDOM DATA INPUT (85h) .............................................................................................. 29 9.2.4 TWO PLANE PAGE PROGRAM .......................................................................................... 29 9.3 COPY BACK operation....................................................................................................... 31 9.3.1 READ for COPY BACK (00h-35h) ........................................................................................ 31 9.3.2 PROGRAM for COPY BACK (85h-10h) ................................................................................ 31 9.3.3 TWO PLANE READ for COPY BACK ................................................................................... 32 9.3.4 TWO PLANE PROGRAM for COPY BACK .......................................................................... 32 9.4 BLOCK ERASE operation .................................................................................................. 36 th Release Date: May 21 , 2018 2 Revision A

HS Compliance

Tariff Desc

8542.32.00 32 No ..CMOS and MOS Read Only Memory and Programmable Read Only Memory whether erasable or non-erasable (for example, flash memory, EPROM, E2PROM, EAPROM, NOVRAM, ROM and PROM)

Winbond may also be referenced as

Winbond Elec
WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA

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