W29N08GVSIAA Winbond

W29N08GVSIAA electronic component of Winbond
W29N08GVSIAA Winbond
W29N08GVSIAA NAND Flash
W29N08GVSIAA Semiconductors
Images are for reference only, See Product Specifications

X-On Electronics has gained recognition as a prominent supplier of W29N08GVSIAA NAND Flash across the USA, India, Europe, Australia, and various other global locations. W29N08GVSIAA NAND Flash are a product manufactured by Winbond. We provide cost-effective solutions for NAND Flash, ensuring timely deliveries around the world.

Part No. W29N08GVSIAA
Manufacturer: Winbond
Category: NAND Flash
Description: NAND Flash 4G-bit NAND flash, 3V x 8bit
Datasheet: W29N08GVSIAA Datasheet (PDF)
Price (USD)
N/A

Obsolete

 W29N08GVSIAA More Buying Options & Price Grid(s)
Availability 0
MOQ : 96
Multiples : 96
QtyUnit Price
96$ 16.1306
480$ 16.0414
2400$ 15.9508
4800$ 15.8589
5280$ 15.7657
12000$ 15.6726
24000$ 15.5781
48000$ 15.4836
60000$ 15.3877
300000$ 15.2906
N/A

Obsolete
Availability 0
MOQ : 1
Multiples : 1
QtyUnit Price
1$ 17.8407
10$ 13.8382
30$ 12.4858
100$ 11.3509
N/A

Obsolete
Availability 0
MOQ : 1
Multiples : 1
QtyUnit Price
1$ 11.2364
10$ 10.1672
25$ 9.9279
50$ 9.8844
100$ 8.9384
250$ 8.4926
500$ 8.4055
1000$ 8.1337
5000$ 8.1337
N/A

Obsolete

Specifications

   
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Mounting Style
Package / Case
Series
Memory Size
Interface Type
Organisation
Data Bus Width
Supply Voltage - Min
Supply Voltage - Max
Supply Current - Max
Minimum Operating Temperature
Maximum Operating Temperature
Packaging
Brand
Product Type
Factory Pack Quantity :
Subcategory
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Notes:- Show Stocked Products With Similar Attributes.

We are delighted to provide the W29N08GVSIAA from our NAND Flash category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the W29N08GVSIAA and other electronic components in the NAND Flash category and beyond.

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Additional Infomation About Product

W29N08GV 2 CHIP STACKED 8G-BIT W29N08GV 8G-BIT 3.3V NAND FLASH MEMORY th Release Date: May 17 , 2018 1 Revision C W29N08GV Table of Contents 1. GENERAL DESCRIPTION ............................................................................................................ 7 2. FEATURES .................................................................................................................................... 7 3. PACKAGE TYPES AND PIN CONFIGURATIONS ....................................................................... 8 3.1 Pin Assignment W29N08GVSIAA 1CE Type 48-pin TSOP1 ............................................... 8 3.2 Pin Assignment W29N08GVSIAD 2CE Type 48-pin TSOP1 ............................................... 9 3.3 Pin Assignment W29N08GVBIAA 1CE Type 63-ball VFBGA ............................................ 10 3.4 Pin Assignment W29N08GVBIAD 2CE Type 63-ball VFBGA ............................................ 11 3.5 Pin Descriptions .................................................................................................................. 12 4. PIN DESCRITPIONS ................................................................................................................... 13 4.1 Chip Enable ( CE) .............................................................................................................. 13 4.2 Write Enable ( WE) ............................................................................................................ 13 4.3 Read Enable ( RE) ............................................................................................................. 13 4.4 Address Latch Enable (ALE) .............................................................................................. 13 4.5 Command Latch Enable (CLE) ........................................................................................... 13 4.6 Write Protect ( WP) ............................................................................................................ 13 4.7 Ready/Busy (RY/ BY) ........................................................................................................ 13 4.8 Input and Output (I/Ox) ....................................................................................................... 13 5. SINGLE DIE BLOCK DIAGRAM .................................................................................................. 14 6. MEMORY ARRAY ORGANIZATION ........................................................................................... 15 6.1 Array Organization ............................................................................................................ 15 7. MODE SELECTION TABLE ........................................................................................................ 16 8. COMMAND TABLE ...................................................................................................................... 17 9. DEVICE OPERATIONS ............................................................................................................... 19 9.1 READ operation .................................................................................................................. 19 9.1.1 PAGE READ (00h-30h) ........................................................................................................ 19 9.1.2 CACHE READ OPERATIONS .............................................................................................. 19 9.1.3 TWO PLANE READ (00h-00h-30h) ...................................................................................... 23 9.1.4 RANDOM DATA OUTPUT (05h-E0h) ................................................................................... 25 9.1.5 READ ID (90h) ...................................................................................................................... 27 9.1.6 READ PARAMETER PAGE (ECh) ....................................................................................... 28 9.1.7 READ STATUS (70h) ........................................................................................................... 30 9.1.8 READ STATUS ENHANCED (78h) ...................................................................................... 32 9.1.9 READ UNIQUE ID (EDh) ...................................................................................................... 33 9.2 PROGRAM operation ......................................................................................................... 34 9.2.1 PAGE PROGRAM (80h-10h) ................................................................................................ 34 9.2.2 SERIAL DATA INPUT (80h) ................................................................................................. 34 9.2.3 RANDOM DATA INPUT (85h) .............................................................................................. 35 9.2.4 CACHE PROGRAM (80h-15h) ............................................................................................. 35 9.2.5 TWO PLANE PAGE PROGRAM .......................................................................................... 37 9.3 COPY BACK operation ....................................................................................................... 40 9.3.1 READ for COPY BACK (00h-35h) ........................................................................................ 40 9.3.2 PROGRAM for COPY BACK (85h-10h) ................................................................................ 40 9.3.3 TWO PLANE READ for COPY BACK ................................................................................... 41 th Release Date: May 17 , 2018 2 Revision C

HS Compliance

Tariff Desc

8542.32.00 32 No ..CMOS and MOS Read Only Memory and Programmable Read Only Memory whether erasable or non-erasable (for example, flash memory, EPROM, E2PROM, EAPROM, NOVRAM, ROM and PROM)

Winbond Elec may also be referenced as

WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA

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