HSMP-389E-TR1G Broadcom

GUx HSMP-389x Series, HSMP-489x Series Surface Mount RF PIN Switch Diodes Data Sheet Description/Applications Features The HSMP-389x series is optimiz ed for switching appli- Unique Configurations in Surface Mount Packages cations where low resistance at low current and low ca- Add Flexibility pacitance are required. The HSMP-489x series products Save Board Space feature ultra low parasitic inductance. These products Reduce Cost are specifically designed for use at frequencies which are much higher than the upper limit for conventional Switching PIN diodes. Low Capacitance Pin Connections and Package Marking Low Resistance at Low Current 1 Low Failure in Time (FIT) Rate 1 6 Matched Diodes for Consistent Performance Better Thermal Conductivity for Higher Power 2 5 Dissipation Lead-free 3 4 Note: 1. For more information see the Surface Mount PIN Reliability Data Sheet. Notes: 1. Package marking provides orientation, identification, and date code. 2. See Electrical Specifications for appropriate package marking.Package Lead Code Identification, Package Lead Code Identification, Package Lead Code Identification, SOT-23/143 SOT-323 SOT-363 (Top View) (Top View) (Top View) SERIES SERIES UNCONNECTED DUAL SWITCH SINGLE SINGLE TRIO MODEL 6 5 4 6 5 4 0 2 B C 1 2 3 1 2 3 R L COMMON COMMON COMMON COMMON ANODE CATHODE LOW ANODE CATHODE INDUCTANCE SERIES SINGLE SHUNT PAIR 6 5 4 6 5 4 E 3 F 4 1 2 3 1 2 3 DUAL ANODE UNCONNECTED T U PAIR DUAL ANODE HIGH FREQUENCY SERIES 6 5 4 489B 4890 5 RING 1 2 3 QUAD V 3 4 1 2 7 UNDER DEVELOPMENT 1 Absolute Maximum Ratings T = +25C C Symbol Parameter Unit SOT-23/143 SOT-323/363 I Forward Current (1 s Pulse) Amp 1 1 f P Peak Inverse Voltage V 100 100 IV T Junction Temperature C 150 150 j T Storage Temperature C -65 to 150 -65 to 150 stg 2 Thermal Resistance C/W 500 150 jc Notes: 1. Operation in excess of any one of these conditions may result in permanent damage to the device. 2. T = +25C, where T is defined to be the temperature at the package pins where contact is made to the circuit board. C C ESD WARNING: Handling Precautions Should Be Taken To Avoid Static Discharge. 2